Abstract: An object of the present invention is to provide a laminated film excellent in oxygen absorbing ability. A laminated film 100 according to the present invention includes an oxygen-absorbing layer 150, a first adjacent layer 140 and a second adjacent layer 160. The oxygen-absorbing layer 150 contains an oxygen absorber and an oxygen absorption reaction catalyst. The first adjacent layer 140 is laminated in contact with one of the surfaces of the oxygen-absorbing layer 150. The second adjacent layer 160 is laminated in contact with the other surface of the oxygen-absorbing layer 150. The content of the oxygen absorption reaction catalyst is 100 ppm to 5000 ppm inclusive in terms of the weight ratio with respect to the oxygen-absorbing layer 150.

Abstract: A cover tape for packaging electronic elements capable of being heat-sealed to a polycarbonate carrier tape having regularly formed pockets for containing electronic elements, which cover tape comprises (A) a substrate layer comprising a thermoplastic resin having a load deflection temperature (ASTM D-648) under a load of 1.82 MPa of not lower than 60° C., and (B) a heat seal layer comprising at least one resin selected from polyvinyl chloride resin, polyester resin, polyurethane resin, acrylic resin containing a functional group and ethylene copolymer which have a Tg of 30-60° C., and an electroconductive fine powder dispersed in said resin.

Abstract: A cover tape for packaging electronic elements capable of being heat-sealed to a polycarbonate carrier tape having regularly formed pockets for containing electronic elements, which cover tape comprises (A) a substrate layer comprising a thermoplastic resin having a load deflection temperature (ASTM D-648) under a load of 1.82 MPa of not lower than 60° C., and (B) a heat seal layer comprising at least one resin selected from polyvinyl chloride resin, polyester resin, polyurethane resin, acrylic resin containing a functional group and ethylene copolymer which have a Tg of 30-60° C., and an electroconductive fine powder dispersed in said resin.