Patents by Inventor Tsuyoshi Matsuomoto

Tsuyoshi Matsuomoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic part module and method of making the same
    Patent number: 8345438
    Abstract: An electronic part module includes a wiring substrate, a passive device group of passive devices formed on the wiring substrate, and device chips mounted on the wiring substrate. Such an electronic part module is made in the following manner. First, a wiring substrate wafer is made, to include a plurality of electronic part module formation areas. Then, a plurality of passive devices are formed in each of the electronic part module formation areas on the wiring substrate wafer. Then, the device chips are formed on each of the electronic part module formation areas on the wiring substrate wafer. Finally, the wiring substrate wafer is divided.
    Type: Grant
    Filed: August 29, 2007
    Date of Patent: January 1, 2013
    Assignees: Fujitsu Limited, Taiyo Yuden Co., Ltd.
    Inventors: Xiaoyu Mi, Tsuyoshi Matsuomoto, Satoshi Ueda, Takeo Takahashi