Patents by Inventor Tsuyoshi Miyamori

Tsuyoshi Miyamori has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10662324
    Abstract: The invention provides a processing aid enabling short-time disappearance of melt fracture occurred in extrusion-molding a melt-fabricable resin at a high shear rate, a great reduction in extrusion pressure, and production of molded articles with good appearance. The processing aid contains a polymer containing a fluorine-containing elastomeric polymer segment and a fluorine-containing non-elastomeric polymer segment.
    Type: Grant
    Filed: February 8, 2019
    Date of Patent: May 26, 2020
    Assignee: DAIKIN INDUSTRIES, LTD.
    Inventors: Ken Okanishi, Yoshichika Komiya, Takafumi Yamato, Tsuyoshi Miyamori
  • Publication number: 20190177525
    Abstract: The invention provides a processing aid enabling short-time disappearance of melt fracture occurred in extrusion-molding a melt-fabricable resin at a high shear rate, a great reduction in extrusion pressure, and production of molded articles with good appearance. The processing aid contains a polymer containing a fluorine-containing elastomeric polymer segment and a fluorine-containing non-elastomeric polymer segment.
    Type: Application
    Filed: February 8, 2019
    Publication date: June 13, 2019
    Applicant: DAIKIN INDUSTRIES, LTD.
    Inventors: Ken OKANISHI, Yoshichika Komiya, Takafumi Yamato, Tsuyoshi Miyamori
  • Patent number: 10308800
    Abstract: The invention provides a processing aid enabling short-time disappearance of melt fracture occurred in extrusion-molding a melt-fabricable resin at a high shear rate, a great reduction in extrusion pressure, and production of molded articles with good appearance. The processing aid contains a polymer containing a fluorine-containing elastomeric polymer segment and a fluorine-containing non-elastomeric polymer segment.
    Type: Grant
    Filed: August 7, 2015
    Date of Patent: June 4, 2019
    Assignee: DAIKIN INDUSTRIES, LTD.
    Inventors: Ken Okanishi, Yoshichika Komiya, Takafumi Yamato, Tsuyoshi Miyamori
  • Publication number: 20170226335
    Abstract: The invention provides a processing aid enabling short-time disappearance of melt fracture occurred in extrusion-molding a melt-fabricable resin at a high shear rate, a great reduction in extrusion pressure, and production of molded articles with good appearance. The processing aid contains a polymer containing a fluorine-containing elastomeric polymer segment and a fluorine-containing non-elastomeric polymer segment.
    Type: Application
    Filed: August 7, 2015
    Publication date: August 10, 2017
    Applicant: DAIKIN INDUSTRIES, LTD.
    Inventors: Ken OKANISHI, Yoshichika KOMIYA, Takafumi YAMATO, Tsuyoshi MIYAMORI
  • Patent number: 9624362
    Abstract: The present invention provides a processing aid for polyolefins which can eliminate melt fracture occurring at the start of molding in a short time even when a polyolefin, which is a melt-processable polymer, is extrusion-molded at a high speed. The present invention also aims to provide a polyolefin composition containing such a processing aid for polyolefins and a polyolefin. The processing aid for polyolefins contains an ethylene/tetrafluoroethylene copolymer as the only fluoropolymer, the ethylene/tetrafluoroethylene copolymer having a melting point of 170° C. to 270° C.
    Type: Grant
    Filed: June 3, 2014
    Date of Patent: April 18, 2017
    Assignee: DAIKIN INDUSTRIES, LTD.
    Inventors: Ken Okanishi, Yoshichika Komiya, Takafumi Yamato, Tsuyoshi Miyamori
  • Publication number: 20160311954
    Abstract: The present invention aims to provide a polyolefin composition including: a processing aid for polyolefins that enables disappearance of melt fracture occurred at the start of molding in a short time even when a polyolefin that is a melt-fabricable polymer is extrusion-molded at a high rate; and a specific polyolefin. The present invention relates to a processing aid for polyolefins, including a perfluoroelastomer. The processing aid is intended to be used for extrusion-molding at least one polyolefin selected from the group consisting of low-density polyethylene, linear low-density polyethylene, high-density polyethylene, metallocene linear low-density polyethylene, polypropylene, and polyvinyl chloride.
    Type: Application
    Filed: December 22, 2014
    Publication date: October 27, 2016
    Applicant: DAIKIN INDUSTRIES, LTD.
    Inventors: Ken OKANISHI, Yoshichika KOMIYA, Takafumi YAMATO, Tsuyoshi MIYAMORI
  • Publication number: 20160145368
    Abstract: The present invention provides a processing aid for polyolefins which can eliminate melt fracture occurring at the start of molding in a short time even when a polyolefin, which is a melt-processable polymer, is extrusion-molded at a high speed. The present invention also aims to provide a polyolefin composition containing such a processing aid for polyolefins and a polyolefin. The processing aid for polyolefins contains an ethylene/tetrafluoroethylene copolymer as the only fluoropolymer, the ethylene/tetrafluoroethylene copolymer having a melting point of 170° C. to 270° C.
    Type: Application
    Filed: June 3, 2014
    Publication date: May 26, 2016
    Applicant: DAIKIN INDUSTRIES, LTD.
    Inventors: Ken OKANISHI, Yoshichika KOMIYA, Takafumi YAMATO, Tsuyoshi MIYAMORI
  • Publication number: 20110288221
    Abstract: The invention provides a polymer processing additive which, when added to a melt-processable resin, is highly effective in improving the moldability of the resin, and a molding composition containing the polymer processing additive, among others. This invention is related to a polymer processing additive comprising a fluoroelastomer subjected to heat treatment with an alkali metal inorganic salt or alkaline earth metal inorganic salt added thereto.
    Type: Application
    Filed: August 4, 2011
    Publication date: November 24, 2011
    Applicant: DAIKIN INDUSTRIES, LTD.
    Inventors: Tsuyoshi MIYAMORI, Yoshichika KOMIYA, Takuya ARASE
  • Publication number: 20090082510
    Abstract: The invention provides a polymer processing additive which, when added to a melt-processable resin, is highly effective in improving the moldability of the resin, and a molding composition containing the polymer processing additive, among others. This invention is related to a polymer processing additive comprising a fluoroelastomer subjected to heat treatment with an alkali metal inorganic salt or alkaline earth metal inorganic salt added thereto.
    Type: Application
    Filed: April 17, 2007
    Publication date: March 26, 2009
    Applicant: Daikin Industries Ltd.
    Inventors: Tsuyoshi Miyamori, Yoshichika Komiya, Takuya Arase
  • Publication number: 20060014904
    Abstract: A polymer composition of matter is disclosed which includes a thermoplastic polymer and a fluorine-containing polymer. The thermoplastic polymer is an amorphous non-fluorinated thermoplastic polymer or a crystalline non-fluorinated thermoplastic polymer with a melting point of 180° C. or higher. The fluorine-containing polymer has a zero shear viscosity at 340° C. of 0.2 Pa.s or greater and less than 5000 Pa.s, and is present to the extent of 0.005-2 mass % of the total of the thermoplastic polymer and the fluorine-containing polymer.
    Type: Application
    Filed: July 13, 2005
    Publication date: January 19, 2006
    Applicant: DAIKIN INDUSTRIES, LTD.
    Inventors: Masahiko Oka, Katsuyoshi Kubo, Tsuyoshi Miyamori, Yoshiki Maruya, Megumi Satou
  • Publication number: 20040242771
    Abstract: The present invention is a low-temperature-decomposable engineering plastic resin composition prepared by formulating a low-temperature-decomposable engineering plastic with a fluorine-containing resin, wherein said low-temperature-decomposable engineering plastic has a melting point of not higher than 200° C. and a decomposition temperature of not higher than 300° C., and wherein said fluorine-containing resin is a resin comprising a fluorine-containing polymer, said fluorine-containing polymer having a fluorine atom and at least one atom species selected from the group consisting of hydrogen atom, chlorine atom, bromine atom and iodine atom, said fluorine atom and said at least one atom species being bound to a non-terminal carbon atom constituting a main chain, and said fluorine-containing polymer having substantially no polar functional groups reactive to the low-temperature-decomposable engineering plastic.
    Type: Application
    Filed: August 20, 2003
    Publication date: December 2, 2004
    Inventors: Katsuyoshi Kubo, Takahide Otsuka, Masahiko Oka, Tsuyoshi Miyamori, Charles W. Stewart, Carolyn Stewart
  • Publication number: 20040102572
    Abstract: The present invention is a resin composition prepared by formulating an engineering plastic with a fluorine-containing polymer wherein said fluorine-containing polymer accounts for 0.005 to 1 mass % of the total of a mass of said engineering plastic and a mass of said fluorine-containing polymer, wherein said fluorine-containing polymer is a perfluoropolymer, and wherein said resin composition is used for extrusion molding or injection molding.
    Type: Application
    Filed: August 25, 2003
    Publication date: May 27, 2004
    Inventors: Katsuyoshi Kubo, Takahide Otsuka, Masahiko Oka, Tsuyoshi Miyamori, Charles W. Stewart, Carolyn Stewart
  • Patent number: 6726994
    Abstract: The structural member of the present invention comprises (A) a layer which comprises a fluorine-containing polymer and does not contain an adhesive material other than the fluorine-containing polymer substantially and (B) a substrate, in which the layer (A) is adhered directly to the substrate (B) without interposing a binder therebetween and a longitudinal shear strength between the layer (A) comprising a fluorine-containing polymer and the substrate (B) is not less than 0.98 N/mm2 at 150° C. The structural member comprising a fluorine-containing polymer and a substrate adhered to each other, particularly the structural member having improved adhesive strength at high temperature and the sliding material produced by using the structural member are provided.
    Type: Grant
    Filed: May 17, 2001
    Date of Patent: April 27, 2004
    Assignee: Daikin Industries, Ltd.
    Inventors: Takayuki Araki, Tsuyoshi Miyamori, Masaji Komori, Yoshito Tanaka, Masahiro Kumegawa
  • Patent number: 6479578
    Abstract: A resin composition which gives a molded article having both of excellent mechanical properties and abrasion resistance with maintaining excellent thermal resistance, chemical resistance, surface characteristics (non-sticking property, low friction property), electric insulating property, etc. of a fluorine-containing polymer; a molded article obtained from the resin composition; and a method for producing the molded article are provided. The resin composition comprises: (A-1) a fluorine-containing ethylenic polymer prepared by copolymerizing at least one of fluorine-containing monomers having any one of hydroxyl, carboxyl, a carboxylate salt group, a carboxylate ester group or epoxy in an amount of 0.05 to 30% by mole on the basis of the total amount of monomers, and (B-1) an inorganic filler or a non-meltable organic filler, wherein said resin composition comprises 1 to 99.5% by weight of the component (A-1) and 0.5 to 99% by weight of the component (B-1).
    Type: Grant
    Filed: March 5, 2001
    Date of Patent: November 12, 2002
    Assignee: Daikin Industries, Ltd.
    Inventors: Takayuki Araki, Masahiro Kumegawa, Tsuyoshi Miyamori, Masami Kato, Masaji Komori, Taketo Kato, Tetsuo Shimizu
  • Patent number: 6416840
    Abstract: An injection moldable fluorine-containing meltable resin composition comprising 70 to 98 wt. % of a fluorine-containing meltable resin, and 2 to 30 wt. % of a needle-shape material having an average diameter of 3 &mgr;m or less, an average aspect ratio of between 10 and 100, and Mohs hardness of between 5 and 8, which composition has good sliding and sealing properties and excellent moldability, in particular, moldability of thin wall articles.
    Type: Grant
    Filed: May 2, 1997
    Date of Patent: July 9, 2002
    Assignee: Daikin Industries, Ltd.
    Inventors: Tsuyoshi Miyamori, Masaji Komori, Masami Katoh, Tetsuo Shimizu
  • Publication number: 20010021744
    Abstract: A resin composition which gives a molded article having both of excellent mechanical properties and abrasion resistance with maintaining excellent thermal resistance, chemical resistance, surface characteristics (non-sticking property, low friction property), electric insulating property, etc. of a fluorine-containing polymer; a molded article obtained from the resin composition; and a method for producing the molded article are provided.
    Type: Application
    Filed: March 5, 2001
    Publication date: September 13, 2001
    Inventors: Takayuki Araki, Masahiro Kumegawa, Tsuyoshi Miyamori, Masami Kato, Masaji Komori, Taketo Kato, Tetsuo Shimizu
  • Patent number: 6245845
    Abstract: To provide a fluorine-containing resin composition useful as a molding material for parts of electronic and electrical equipment which assures well-balanced enhancement of dielectric property, heat resistance, mold-processability (precise processability) and mechanical properties and the parts of electronic and electrical equipment. The fluorine-containing resin composition for parts of electronic and electrical equipment comprises 70 to 95% by weight of (I) fluorine-containing resin mixture comprising (a) a fluorine-containing resin containing polytetrafluoroethylene not to be fibrillated and (b) a thermoplastic resin other than the fluorine-containing resin and 5 to 30% by weight of (II) a metal compound whisker having a single bond strength of not less than 190 KJ/mol calculated from a dissociation energy of bond between a metal element and oxygen. The parts of electronic and electrical equipment which are obtained from the composition have a dielectric constant of not more than 3.5.
    Type: Grant
    Filed: November 3, 1999
    Date of Patent: June 12, 2001
    Assignee: Daikin Industries, Inc.
    Inventors: Tsuyoshi Miyamori, Masaji Komori, Takuya Arase
  • Patent number: 6225399
    Abstract: A resin composition which gives a molded article having both of excellent mechanical properties and abrasion resistance with maintaining excellent thermal resistance, chemical resistance, surface characteristics (non-sticking property, low friction property), electric insulating property, etc. of a fluorine-containing polymer; a molded article obtained from the resin composition; and a method for producing the molded article are provided. The resin composition comprises: (A-1) a fluorine-containing ethylenic polymer prepared by copolymerizing at least one of fluorine-containing monomers having any one of hydroxyl, carboxyl, a carboxylate salt group, a carboxylate ester group or epoxy in an amount of 0.05 to 30% by mole on the basis of the total amount of monomers, and (B-1) an inorganic filler or a non-meltable organic filler, wherein said resin composition comprises 1 to 99.5% by weight of the component (A-1) and 0.5 to 99% by weight of the component (B-1).
    Type: Grant
    Filed: April 27, 1998
    Date of Patent: May 1, 2001
    Assignee: Daikin Industries, Ltd.
    Inventors: Takayuki Araki, Masahiro Kumegawa, Tsuyoshi Miyamori, Masami Kato, Masaji Komori, Taketo Kato, Tetsuo Shimizu
  • Patent number: 5906967
    Abstract: A non-sticking sliding part molding Composition comprising a mixture of a fluororesin and a thermoplastic resin other than fluororesin and a fibrous filler, said mixture and said fibrous filler accounting for 70 to 95 weight % and 5 to 30 weight %, respectively, and said thermoplastic resin other than fluororesin occurring in a proportion of 60 to 100 parts by weight based on t00 parts by weight of said fluororesin. The object is to provide a non-sticking sliding part molding composition which is not only fully possessed of the fundamental properties required of sliding parts but also has a well-balanced assortment of hardness, deflection under load, creep resistance, slidability, moldability, and toner-repellent property, thus surpassing the prior art.
    Type: Grant
    Filed: May 4, 1998
    Date of Patent: May 25, 1999
    Assignee: Daikin Industries, Ltd.
    Inventors: Masami Kato, Taketo Kato, Masaji Komori, Tsuyoshi Miyamori, Tetsuo Shimizu
  • Patent number: 5684088
    Abstract: The present invention relates to a PPS resin composition comprising a matrix of the PPS which is filled with a PTFE powder baked at a temperature not less than a melting point thereof and having a number-average molecular weight of not less than 1.5 million or PTFE fine particles having an average particle size of 0.05 to 1 .mu.m and comprising a fibrillating core portion of a high molecular weight PTFE with a number-average molecular weight of not less than 1.5 million and a non-fibrillating shell portion of a low molecular weight PTFE so that a content thereof is 40 to 80% by weight in the composition, and also relates to a process for preparing said PPS resin composition, which is characterized in that melting and kneading are carried out at a temperature from a temperature of not less than a melting point of PPS to a temperature of not more lower than a melting point of a high molecular weight PTFE.
    Type: Grant
    Filed: March 29, 1995
    Date of Patent: November 4, 1997
    Assignee: Daikin Industries, Ltd.
    Inventors: Tsuyoshi Miyamori, Yoshihisa Yamamoto, Masami Kato, Masaji Komori, Tetsuo Shimizu