Patents by Inventor Tsuyoshi Miyamori
Tsuyoshi Miyamori has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10662324Abstract: The invention provides a processing aid enabling short-time disappearance of melt fracture occurred in extrusion-molding a melt-fabricable resin at a high shear rate, a great reduction in extrusion pressure, and production of molded articles with good appearance. The processing aid contains a polymer containing a fluorine-containing elastomeric polymer segment and a fluorine-containing non-elastomeric polymer segment.Type: GrantFiled: February 8, 2019Date of Patent: May 26, 2020Assignee: DAIKIN INDUSTRIES, LTD.Inventors: Ken Okanishi, Yoshichika Komiya, Takafumi Yamato, Tsuyoshi Miyamori
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Publication number: 20190177525Abstract: The invention provides a processing aid enabling short-time disappearance of melt fracture occurred in extrusion-molding a melt-fabricable resin at a high shear rate, a great reduction in extrusion pressure, and production of molded articles with good appearance. The processing aid contains a polymer containing a fluorine-containing elastomeric polymer segment and a fluorine-containing non-elastomeric polymer segment.Type: ApplicationFiled: February 8, 2019Publication date: June 13, 2019Applicant: DAIKIN INDUSTRIES, LTD.Inventors: Ken OKANISHI, Yoshichika Komiya, Takafumi Yamato, Tsuyoshi Miyamori
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Patent number: 10308800Abstract: The invention provides a processing aid enabling short-time disappearance of melt fracture occurred in extrusion-molding a melt-fabricable resin at a high shear rate, a great reduction in extrusion pressure, and production of molded articles with good appearance. The processing aid contains a polymer containing a fluorine-containing elastomeric polymer segment and a fluorine-containing non-elastomeric polymer segment.Type: GrantFiled: August 7, 2015Date of Patent: June 4, 2019Assignee: DAIKIN INDUSTRIES, LTD.Inventors: Ken Okanishi, Yoshichika Komiya, Takafumi Yamato, Tsuyoshi Miyamori
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Publication number: 20170226335Abstract: The invention provides a processing aid enabling short-time disappearance of melt fracture occurred in extrusion-molding a melt-fabricable resin at a high shear rate, a great reduction in extrusion pressure, and production of molded articles with good appearance. The processing aid contains a polymer containing a fluorine-containing elastomeric polymer segment and a fluorine-containing non-elastomeric polymer segment.Type: ApplicationFiled: August 7, 2015Publication date: August 10, 2017Applicant: DAIKIN INDUSTRIES, LTD.Inventors: Ken OKANISHI, Yoshichika KOMIYA, Takafumi YAMATO, Tsuyoshi MIYAMORI
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Patent number: 9624362Abstract: The present invention provides a processing aid for polyolefins which can eliminate melt fracture occurring at the start of molding in a short time even when a polyolefin, which is a melt-processable polymer, is extrusion-molded at a high speed. The present invention also aims to provide a polyolefin composition containing such a processing aid for polyolefins and a polyolefin. The processing aid for polyolefins contains an ethylene/tetrafluoroethylene copolymer as the only fluoropolymer, the ethylene/tetrafluoroethylene copolymer having a melting point of 170° C. to 270° C.Type: GrantFiled: June 3, 2014Date of Patent: April 18, 2017Assignee: DAIKIN INDUSTRIES, LTD.Inventors: Ken Okanishi, Yoshichika Komiya, Takafumi Yamato, Tsuyoshi Miyamori
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Publication number: 20160311954Abstract: The present invention aims to provide a polyolefin composition including: a processing aid for polyolefins that enables disappearance of melt fracture occurred at the start of molding in a short time even when a polyolefin that is a melt-fabricable polymer is extrusion-molded at a high rate; and a specific polyolefin. The present invention relates to a processing aid for polyolefins, including a perfluoroelastomer. The processing aid is intended to be used for extrusion-molding at least one polyolefin selected from the group consisting of low-density polyethylene, linear low-density polyethylene, high-density polyethylene, metallocene linear low-density polyethylene, polypropylene, and polyvinyl chloride.Type: ApplicationFiled: December 22, 2014Publication date: October 27, 2016Applicant: DAIKIN INDUSTRIES, LTD.Inventors: Ken OKANISHI, Yoshichika KOMIYA, Takafumi YAMATO, Tsuyoshi MIYAMORI
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Publication number: 20160145368Abstract: The present invention provides a processing aid for polyolefins which can eliminate melt fracture occurring at the start of molding in a short time even when a polyolefin, which is a melt-processable polymer, is extrusion-molded at a high speed. The present invention also aims to provide a polyolefin composition containing such a processing aid for polyolefins and a polyolefin. The processing aid for polyolefins contains an ethylene/tetrafluoroethylene copolymer as the only fluoropolymer, the ethylene/tetrafluoroethylene copolymer having a melting point of 170° C. to 270° C.Type: ApplicationFiled: June 3, 2014Publication date: May 26, 2016Applicant: DAIKIN INDUSTRIES, LTD.Inventors: Ken OKANISHI, Yoshichika KOMIYA, Takafumi YAMATO, Tsuyoshi MIYAMORI
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Publication number: 20110288221Abstract: The invention provides a polymer processing additive which, when added to a melt-processable resin, is highly effective in improving the moldability of the resin, and a molding composition containing the polymer processing additive, among others. This invention is related to a polymer processing additive comprising a fluoroelastomer subjected to heat treatment with an alkali metal inorganic salt or alkaline earth metal inorganic salt added thereto.Type: ApplicationFiled: August 4, 2011Publication date: November 24, 2011Applicant: DAIKIN INDUSTRIES, LTD.Inventors: Tsuyoshi MIYAMORI, Yoshichika KOMIYA, Takuya ARASE
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Publication number: 20090082510Abstract: The invention provides a polymer processing additive which, when added to a melt-processable resin, is highly effective in improving the moldability of the resin, and a molding composition containing the polymer processing additive, among others. This invention is related to a polymer processing additive comprising a fluoroelastomer subjected to heat treatment with an alkali metal inorganic salt or alkaline earth metal inorganic salt added thereto.Type: ApplicationFiled: April 17, 2007Publication date: March 26, 2009Applicant: Daikin Industries Ltd.Inventors: Tsuyoshi Miyamori, Yoshichika Komiya, Takuya Arase
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Publication number: 20060014904Abstract: A polymer composition of matter is disclosed which includes a thermoplastic polymer and a fluorine-containing polymer. The thermoplastic polymer is an amorphous non-fluorinated thermoplastic polymer or a crystalline non-fluorinated thermoplastic polymer with a melting point of 180° C. or higher. The fluorine-containing polymer has a zero shear viscosity at 340° C. of 0.2 Pa.s or greater and less than 5000 Pa.s, and is present to the extent of 0.005-2 mass % of the total of the thermoplastic polymer and the fluorine-containing polymer.Type: ApplicationFiled: July 13, 2005Publication date: January 19, 2006Applicant: DAIKIN INDUSTRIES, LTD.Inventors: Masahiko Oka, Katsuyoshi Kubo, Tsuyoshi Miyamori, Yoshiki Maruya, Megumi Satou
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Publication number: 20040242771Abstract: The present invention is a low-temperature-decomposable engineering plastic resin composition prepared by formulating a low-temperature-decomposable engineering plastic with a fluorine-containing resin, wherein said low-temperature-decomposable engineering plastic has a melting point of not higher than 200° C. and a decomposition temperature of not higher than 300° C., and wherein said fluorine-containing resin is a resin comprising a fluorine-containing polymer, said fluorine-containing polymer having a fluorine atom and at least one atom species selected from the group consisting of hydrogen atom, chlorine atom, bromine atom and iodine atom, said fluorine atom and said at least one atom species being bound to a non-terminal carbon atom constituting a main chain, and said fluorine-containing polymer having substantially no polar functional groups reactive to the low-temperature-decomposable engineering plastic.Type: ApplicationFiled: August 20, 2003Publication date: December 2, 2004Inventors: Katsuyoshi Kubo, Takahide Otsuka, Masahiko Oka, Tsuyoshi Miyamori, Charles W. Stewart, Carolyn Stewart
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Publication number: 20040102572Abstract: The present invention is a resin composition prepared by formulating an engineering plastic with a fluorine-containing polymer wherein said fluorine-containing polymer accounts for 0.005 to 1 mass % of the total of a mass of said engineering plastic and a mass of said fluorine-containing polymer, wherein said fluorine-containing polymer is a perfluoropolymer, and wherein said resin composition is used for extrusion molding or injection molding.Type: ApplicationFiled: August 25, 2003Publication date: May 27, 2004Inventors: Katsuyoshi Kubo, Takahide Otsuka, Masahiko Oka, Tsuyoshi Miyamori, Charles W. Stewart, Carolyn Stewart
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Patent number: 6726994Abstract: The structural member of the present invention comprises (A) a layer which comprises a fluorine-containing polymer and does not contain an adhesive material other than the fluorine-containing polymer substantially and (B) a substrate, in which the layer (A) is adhered directly to the substrate (B) without interposing a binder therebetween and a longitudinal shear strength between the layer (A) comprising a fluorine-containing polymer and the substrate (B) is not less than 0.98 N/mm2 at 150° C. The structural member comprising a fluorine-containing polymer and a substrate adhered to each other, particularly the structural member having improved adhesive strength at high temperature and the sliding material produced by using the structural member are provided.Type: GrantFiled: May 17, 2001Date of Patent: April 27, 2004Assignee: Daikin Industries, Ltd.Inventors: Takayuki Araki, Tsuyoshi Miyamori, Masaji Komori, Yoshito Tanaka, Masahiro Kumegawa
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Patent number: 6479578Abstract: A resin composition which gives a molded article having both of excellent mechanical properties and abrasion resistance with maintaining excellent thermal resistance, chemical resistance, surface characteristics (non-sticking property, low friction property), electric insulating property, etc. of a fluorine-containing polymer; a molded article obtained from the resin composition; and a method for producing the molded article are provided. The resin composition comprises: (A-1) a fluorine-containing ethylenic polymer prepared by copolymerizing at least one of fluorine-containing monomers having any one of hydroxyl, carboxyl, a carboxylate salt group, a carboxylate ester group or epoxy in an amount of 0.05 to 30% by mole on the basis of the total amount of monomers, and (B-1) an inorganic filler or a non-meltable organic filler, wherein said resin composition comprises 1 to 99.5% by weight of the component (A-1) and 0.5 to 99% by weight of the component (B-1).Type: GrantFiled: March 5, 2001Date of Patent: November 12, 2002Assignee: Daikin Industries, Ltd.Inventors: Takayuki Araki, Masahiro Kumegawa, Tsuyoshi Miyamori, Masami Kato, Masaji Komori, Taketo Kato, Tetsuo Shimizu
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Patent number: 6416840Abstract: An injection moldable fluorine-containing meltable resin composition comprising 70 to 98 wt. % of a fluorine-containing meltable resin, and 2 to 30 wt. % of a needle-shape material having an average diameter of 3 &mgr;m or less, an average aspect ratio of between 10 and 100, and Mohs hardness of between 5 and 8, which composition has good sliding and sealing properties and excellent moldability, in particular, moldability of thin wall articles.Type: GrantFiled: May 2, 1997Date of Patent: July 9, 2002Assignee: Daikin Industries, Ltd.Inventors: Tsuyoshi Miyamori, Masaji Komori, Masami Katoh, Tetsuo Shimizu
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Publication number: 20010021744Abstract: A resin composition which gives a molded article having both of excellent mechanical properties and abrasion resistance with maintaining excellent thermal resistance, chemical resistance, surface characteristics (non-sticking property, low friction property), electric insulating property, etc. of a fluorine-containing polymer; a molded article obtained from the resin composition; and a method for producing the molded article are provided.Type: ApplicationFiled: March 5, 2001Publication date: September 13, 2001Inventors: Takayuki Araki, Masahiro Kumegawa, Tsuyoshi Miyamori, Masami Kato, Masaji Komori, Taketo Kato, Tetsuo Shimizu
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Patent number: 6245845Abstract: To provide a fluorine-containing resin composition useful as a molding material for parts of electronic and electrical equipment which assures well-balanced enhancement of dielectric property, heat resistance, mold-processability (precise processability) and mechanical properties and the parts of electronic and electrical equipment. The fluorine-containing resin composition for parts of electronic and electrical equipment comprises 70 to 95% by weight of (I) fluorine-containing resin mixture comprising (a) a fluorine-containing resin containing polytetrafluoroethylene not to be fibrillated and (b) a thermoplastic resin other than the fluorine-containing resin and 5 to 30% by weight of (II) a metal compound whisker having a single bond strength of not less than 190 KJ/mol calculated from a dissociation energy of bond between a metal element and oxygen. The parts of electronic and electrical equipment which are obtained from the composition have a dielectric constant of not more than 3.5.Type: GrantFiled: November 3, 1999Date of Patent: June 12, 2001Assignee: Daikin Industries, Inc.Inventors: Tsuyoshi Miyamori, Masaji Komori, Takuya Arase
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Patent number: 6225399Abstract: A resin composition which gives a molded article having both of excellent mechanical properties and abrasion resistance with maintaining excellent thermal resistance, chemical resistance, surface characteristics (non-sticking property, low friction property), electric insulating property, etc. of a fluorine-containing polymer; a molded article obtained from the resin composition; and a method for producing the molded article are provided. The resin composition comprises: (A-1) a fluorine-containing ethylenic polymer prepared by copolymerizing at least one of fluorine-containing monomers having any one of hydroxyl, carboxyl, a carboxylate salt group, a carboxylate ester group or epoxy in an amount of 0.05 to 30% by mole on the basis of the total amount of monomers, and (B-1) an inorganic filler or a non-meltable organic filler, wherein said resin composition comprises 1 to 99.5% by weight of the component (A-1) and 0.5 to 99% by weight of the component (B-1).Type: GrantFiled: April 27, 1998Date of Patent: May 1, 2001Assignee: Daikin Industries, Ltd.Inventors: Takayuki Araki, Masahiro Kumegawa, Tsuyoshi Miyamori, Masami Kato, Masaji Komori, Taketo Kato, Tetsuo Shimizu
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Patent number: 5906967Abstract: A non-sticking sliding part molding Composition comprising a mixture of a fluororesin and a thermoplastic resin other than fluororesin and a fibrous filler, said mixture and said fibrous filler accounting for 70 to 95 weight % and 5 to 30 weight %, respectively, and said thermoplastic resin other than fluororesin occurring in a proportion of 60 to 100 parts by weight based on t00 parts by weight of said fluororesin. The object is to provide a non-sticking sliding part molding composition which is not only fully possessed of the fundamental properties required of sliding parts but also has a well-balanced assortment of hardness, deflection under load, creep resistance, slidability, moldability, and toner-repellent property, thus surpassing the prior art.Type: GrantFiled: May 4, 1998Date of Patent: May 25, 1999Assignee: Daikin Industries, Ltd.Inventors: Masami Kato, Taketo Kato, Masaji Komori, Tsuyoshi Miyamori, Tetsuo Shimizu
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Patent number: 5684088Abstract: The present invention relates to a PPS resin composition comprising a matrix of the PPS which is filled with a PTFE powder baked at a temperature not less than a melting point thereof and having a number-average molecular weight of not less than 1.5 million or PTFE fine particles having an average particle size of 0.05 to 1 .mu.m and comprising a fibrillating core portion of a high molecular weight PTFE with a number-average molecular weight of not less than 1.5 million and a non-fibrillating shell portion of a low molecular weight PTFE so that a content thereof is 40 to 80% by weight in the composition, and also relates to a process for preparing said PPS resin composition, which is characterized in that melting and kneading are carried out at a temperature from a temperature of not less than a melting point of PPS to a temperature of not more lower than a melting point of a high molecular weight PTFE.Type: GrantFiled: March 29, 1995Date of Patent: November 4, 1997Assignee: Daikin Industries, Ltd.Inventors: Tsuyoshi Miyamori, Yoshihisa Yamamoto, Masami Kato, Masaji Komori, Tetsuo Shimizu