Patents by Inventor Tsuyoshi Mutou
Tsuyoshi Mutou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11522114Abstract: The present invention provides: a thermoelectric conversion material capable of being produced in a simplified manner and at a lower cost and excellent in thermoelectric performance and flexibility, and a method for producing the material. The thermoelectric conversion material has, on a support, a thin film of a thermoelectric semiconductor composition containing thermoelectric semiconductor fine particles, a heat-resistant resin and an inorganic ionic compound. The method for producing a thermoelectric conversion material having, on a support, a thin film of a thermoelectric semiconductor composition containing thermoelectric semiconductor fine particles, a heat-resistant resin and an inorganic ionic compound includes a step of applying a thermoelectric semiconductor composition containing thermoelectric semiconductor fine particles, a heat-resistant resin and an inorganic ionic compound onto a support and drying it to form a thin film thereon, and a step of annealing the thin film.Type: GrantFiled: December 7, 2017Date of Patent: December 6, 2022Assignee: LINTEC CORPORATIONInventors: Kunihisa Kato, Wataru Morita, Tsuyoshi Mutou, Yuma Katsuta, Takeshi Kondo
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Publication number: 20200066960Abstract: The present invention provides: a thermoelectric conversion material capable of being produced in a simplified manner and at a lower cost and excellent in thermoelectric performance and flexibility, and a method for producing the material. The thermoelectric conversion material has, on a support, a thin film of a thermoelectric semiconductor composition containing thermoelectric semiconductor fine particles, a heat-resistant resin and an inorganic ionic compound. The method for producing a thermoelectric conversion material having, on a support, a thin film of a thermoelectric semiconductor composition containing thermoelectric semiconductor fine particles, a heat-resistant resin and an inorganic ionic compound includes a step of applying a thermoelectric semiconductor composition containing thermoelectric semiconductor fine particles, a heat-resistant resin and an inorganic ionic compound onto a support and drying it to form a thin film thereon, and a step of annealing the thin film.Type: ApplicationFiled: December 7, 2017Publication date: February 27, 2020Applicant: LINTEC CORPORATIONInventors: Kunihisa KATO, Wataru MORITA, Tsuyoshi MUTOU, Yuma KATSUTA, Takeshi KONDO
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Publication number: 20190378967Abstract: Provided are a flexible thermoelectric conversion device having high thermoelectric performance and capable of imparting a sufficient temperature difference in an in-plane direction to the thermoelectric elements inside the thermoelectric conversion module therein, and a method for producing the device. The flexible thermoelectric conversion device includes a thermoelectric conversion module having P-type thermoelectric elements and N-type thermoelectric elements alternately arranged to be adjacent to each other on one face of a film substrate, and includes a high thermally conductive layer composed of a high thermally conductive material in a part of a position on one face of the thermoelectric conversion module, which is on the side of the other face of the film substrate, among both faces of the thermoelectric conversion module, in which the thermal conductivity of the high thermally conductive layer is 5 to 500 (W/m·K), and the production method produces the device.Type: ApplicationFiled: January 24, 2018Publication date: December 12, 2019Applicant: LINTEC CORPORATIONInventors: Wataru MORITA, Kunihisa KATO, Tsuyoshi MUTOU, Takeshi KONDO
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Patent number: 10490724Abstract: To provide a Peltier cooling element that is excellent in thermoelectric performance and flexibility and can be manufactured easily at low cost. A Peltier cooling element containing a thermoelectric conversion material containing a support having thereon a thin film containing a thermoelectric semiconductor composition containing thermoelectric semiconductor fine particles, a heat resistant resin, and an ionic liquid, and a method for manufacturing a Peltier cooling element containing a thermoelectric conversion material containing a support having thereon a thin film containing a thermoelectric semiconductor composition containing thermoelectric semiconductor fine particles, a heat resistant resin, and an ionic liquid, the method containing: coating a thermoelectric semiconductor composition containing thermoelectric semiconductor fine particles, a heat resistant resin, and an ionic liquid, on a support, and drying, so as to form a thin film; and subjecting the thin film to an annealing treatment.Type: GrantFiled: December 24, 2015Date of Patent: November 26, 2019Assignee: LINTEC CORPORATIONInventors: Kunihisa Kato, Tsuyoshi Mutou, Wataru Morita, Yuma Katsuta, Takeshi Kondo
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Patent number: 10403807Abstract: The present invention provides a thermoelectric conversion material having a reduced thermal conductivity and having an improved figure of merit, and a method for producing the material. The thermoelectric conversion material has, as formed on a resin substrate having recesses, a thermoelectric semiconductor layer formed of a thermoelectric semiconductor material, wherein the resin substrate comprises one formed by curing a resin layer of a curable resin composition. The production method for the thermoelectric conversion material comprises a resin substrate formation step of transcribing a protruding structure from an original plate having the protruding structure onto a resin layer of a curable resin composition and curing the layer, and a film formation step of forming a thermoelectric semiconductor layer of a thermoelectric semiconductor material on the resin substrate.Type: GrantFiled: April 17, 2013Date of Patent: September 3, 2019Assignee: LINTEC CORPORATIONInventors: Kunihisa Kato, Tsuyoshi Mutou
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Patent number: 10122045Abstract: A film-attached solid electrolyte membrane includes: a film having a surface that has a contact angle with respect to acetonitrile in a range from 35 to 75 degrees and a contact angle with respect to chloroform in a range from 15 to 40 degrees; and a solid electrolyte membrane in contact with the surface of the film. A manufacturing method of a film-attached solid electrolyte membrane includes: coating a solid-electrolyte-membrane-forming composition on a surface of a film that has a contact angle with respect to acetonitrile in a range from 35 to 75 degrees and a contact angle with respect to chloroform in a range from 15 to 40 degrees; and curing the coated solid-electrolyte-membrane-forming composition to form a solid electrolyte membrane.Type: GrantFiled: February 27, 2015Date of Patent: November 6, 2018Assignee: LINTEC CORPORATIONInventors: Takashi Morioka, Tsuyoshi Mutou
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Patent number: 9944831Abstract: The present invention provides a thermally conductive adhesive sheet that can be easily laminated on an electronic device without an adhesive layer therebetween and can further selectively dissipate heat in a particular direction to provide a sufficient temperature difference to the inside of the electronic device, a method for producing the same, and an electronic device using the same.Type: GrantFiled: September 24, 2014Date of Patent: April 17, 2018Assignee: LINTEC CORPORATIONInventors: Wataru Morita, Kunihisa Kato, Tsuyoshi Mutou
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Publication number: 20170373240Abstract: To provide a Peltier cooling element that is excellent in thermoelectric performance and flexibility and can be manufactured easily at low cost. A Peltier cooling element containing a thermoelectric conversion material containing a support having thereon a thin film containing a thermoelectric semiconductor composition containing thermoelectric semiconductor fine particles, a heat resistant resin, and an ionic liquid, and a method for manufacturing a Peltier cooling element containing a thermoelectric conversion material containing a support having thereon a thin film containing a thermoelectric semiconductor composition containing thermoelectric semiconductor fine particles, a heat resistant resin, and an ionic liquid, the method containing: coating a thermoelectric semiconductor composition containing thermoelectric semiconductor fine particles, a heat resistant resin, and an ionic liquid, on a support, and drying, so as to form a thin film; and subjecting the thin film to an annealing treatment.Type: ApplicationFiled: December 24, 2015Publication date: December 28, 2017Applicant: LINTEC CORPORATIONInventors: Kunihisa KATO, Tsuyoshi MUTOU, Wataru MORITA, Yuma KATSUTA, Takeshi KONDO
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Patent number: 9780283Abstract: A thermoelectric conversion element that can efficiently make a temperature difference across a thermoelectric conversion material is provided. In the thermoelectric conversion element, on a first surface of a thermoelectric conversion module comprising a P-type thermoelectric element, an N-type thermoelectric element, and an electrode, a thermally conductive resin layer A and a thermally conductive resin layer B having a lower thermal conductivity than the thermally conductive resin layer A are provided in an alternating manner so as to be in direct contact with the first surface, and on a second surface on the opposite side of the first surface of the thermoelectric conversion module, a thermally conductive resin layer a and a thermally conductive resin layer b having a lower thermal conductivity than the thermally conductive resin layer a are provided in an alternating manner so as to be in direct contact with the second surface.Type: GrantFiled: March 18, 2014Date of Patent: October 3, 2017Assignees: NATIONAL UNIVERSITY CORPORATION NAGAOKA UNIVERSITY OF TECHNOLOGY, LINTEC CORPORATIONInventors: Masatoshi Takeda, Tsuyoshi Mutou, Takeshi Kondo
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Patent number: 9620697Abstract: The present invention provides a thermoelectric conversion material of which the structure is controlled to have nano-order microscopic pores and which has a low thermal conductivity and has an improved thermoelectric performance index. In the thermoelectric conversion material having a thermoelectric semiconductor layer formed on a block copolymer substrate that comprises a block copolymer having microscopic pores, wherein the block copolymer comprises a polymer unit (A) formed of a monomer capable of forming a homopolymer having a glass transition temperature of 50° C. or higher, and a polymer unit (B) formed of a conjugated dienic polymer.Type: GrantFiled: February 19, 2013Date of Patent: April 11, 2017Assignees: KYUSHU INSTITUTE OF TECHNOLOGY, LINTEC CORPORATIONInventors: Tsuyoshi Mutou, Koji Miyazaki, Yoshika Hatasako, Kunihisa Kato
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Patent number: 9608190Abstract: The invention provides a thermoelectric conversion material having a low thermal conductivity and an improved figure of merit and a production method for the material, and also provides a thermoelectric conversion module. The thermoelectric conversion material has, on a porous substrate having microscopic pores, a thermoelectric semiconductor layer formed of a thermoelectric semiconductor material, wherein the porous substrate has a polymer layer (B) on a plastic film (A) and the microscopic pores are formed in the polymer layer (B) and in a part of the plastic film (A). The production method for the thermoelectric conversion material comprises a substrate formation step of forming a porous substrate including a step 1, a step 2 and a step 3, and comprises a film formation step of forming a thermoelectric semiconductor layer through film formation of a thermoelectric semiconductor material on the porous substrate. The thermoelectric conversion module uses the thermoelectric conversion material.Type: GrantFiled: February 18, 2014Date of Patent: March 28, 2017Assignees: LINTEC CORPORATION, KYUSHU INSTITUTE OF TECHNOLOGYInventors: Kunihisa Kato, Tsuyoshi Mutou, Koji Miyazaki, Aiko Harada
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Publication number: 20170069933Abstract: A film-attached solid electrolyte membrane includes: a film having a surface that has a contact angle with respect to acetonitrile in a range from 35 to 75 degrees and a contact angle with respect to chloroform in a range from 15 to 40 degrees; and a solid electrolyte membrane in contact with the surface of the film. A manufacturing method of a film-attached solid electrolyte membrane includes: coating a solid-electrolyte-membrane-forming composition on a surface of a film that has a contact angle with respect to acetonitrile in a range from 35 to 75 degrees and a contact angle with respect to chloroform in a range from 15 to 40 degrees; and curing the coated solid-electrolyte-membrane-forming composition to form a solid electrolyte membrane.Type: ApplicationFiled: February 27, 2015Publication date: March 9, 2017Inventors: Takashi MORIOKA, Tsuyoshi MUTOU
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Patent number: 9461228Abstract: The present invention provides a thermoelectric conversion material excellent in thermoelectric performance and flexibility and capable of being produced in a simplified manner and at a low cost, and a method for producing the material. The thermoelectric conversion material has, on a support, a thin film of a thermoelectric semiconductor composition containing thermoelectric semiconductor fine particles and a conductive polymer, and the method for producing a thermoelectric conversion material includes a step of applying the thermoelectric semiconductor composition containing thermoelectric semiconductor fine particles and a conductive polymer onto the support and drying it to forma thin film thereon.Type: GrantFiled: March 11, 2013Date of Patent: October 4, 2016Assignees: LINTEC CORPORATION, KYUSHU INSTITUTE OF TECHNOLOGYInventors: Kunihisa Kato, Tsuyoshi Mutou, Koji Miyazaki
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Publication number: 20160284963Abstract: A thermoelectric conversion element that can efficiently make a temperature difference across a thermoelectric conversion material is provided. In the thermoelectric conversion element, on a first surface of a thermoelectric conversion module comprising a P-type thermoelectric element, an N-type thermoelectric element, and an electrode, a thermally conductive resin layer A and a thermally conductive resin layer B having a lower thermal conductivity than the thermally conductive resin layer A are provided in an alternating manner so as to be in direct contact with the first surface, and on a second surface on the opposite side of the first surface of the thermoelectric conversion module, a thermally conductive resin layer a and a thermally conductive resin layer b having a lower thermal conductivity than the thermally conductive resin layer a are provided in an alternating manner so as to be in direct contact with the second surface.Type: ApplicationFiled: March 18, 2014Publication date: September 29, 2016Applicants: NATIONAL UNIVERSITY CORPORATION NAGAOKA UNIVERSITY OF TECHNOLOGY, LINTEC CORPORATIONInventors: Masatoshi TAKEDA, Tsuyoshi MUTOU, Takeshi KONDO
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Patent number: 9431593Abstract: The present invention provides a thermoelectric conversion material capable of being produced in a simplified manner and at a low cost and excellent in thermoelectric conversion characteristics and flexibility, and provides a method for producing the material. The thermoelectric conversion material has, on a support, a thin film of a thermoelectric semiconductor composition containing thermoelectric semiconductor fine particles, a heat-resistant resin and an ionic liquid. The method for producing a thermoelectric conversion material having, on a support, a thin film of a thermoelectric semiconductor composition containing thermoelectric semiconductor fine particles, a heat-resistant resin and an ionic liquid comprises a step of applying a thermoelectric semiconductor composition containing thermoelectric semiconductor fine particles, a heat-resistant resin and an ionic liquid onto a support and drying it to form a thin film thereon, and a step of annealing the thin film.Type: GrantFiled: July 25, 2014Date of Patent: August 30, 2016Assignee: LINTEC CORPORATIONInventors: Kunihisa Kato, Tsuyoshi Mutou, Takeshi Kondo
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Publication number: 20160222256Abstract: The present invention provides a thermally conductive adhesive sheet that can be laminated on an electronic device to efficiently dissipate heat and to selectively dissipate heat in a particular direction to provide a sufficient temperature difference to the inside of the electronic device, a method for producing the same, and an electronic device using the same.Type: ApplicationFiled: September 24, 2014Publication date: August 4, 2016Applicant: LINTEC CORPORATIONInventors: Kunihisa KATO, Wataru MORITA, Tsuyoshi MUTOU
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Publication number: 20160215172Abstract: The present invention provides a thermally conductive adhesive sheet that can be easily laminated on an electronic device without an adhesive layer therebetween and can further selectively dissipate heat in a particular direction to provide a sufficient temperature difference to the inside of the electronic device, a method for producing the same, and an electronic device using the same.Type: ApplicationFiled: September 24, 2014Publication date: July 28, 2016Applicant: LINTEC CORPORATIONInventors: Wataru MORITA, Kunihisa KATO, Tsuyoshi MUTOU
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Publication number: 20160013391Abstract: The invention provides a thermoelectric conversion material having a low thermal conductivity and an improved figure of merit and a production method for the material, and also provides a thermoelectric conversion module. The thermoelectric conversion material has, on a porous substrate having microscopic pores, a thermoelectric semiconductor layer formed of a thermoelectric semiconductor material, wherein the porous substrate has a polymer layer (B) on a plastic film (A) and the microscopic pores are formed in the polymer layer (B) and in a part of the plastic film (A). The production method for the thermoelectric conversion material comprises a substrate formation step of forming a porous substrate including a step 1, a step 2 and a step 3, and comprises a film formation step of forming a thermoelectric semiconductor layer through film formation of a thermoelectric semiconductor material on the porous substrate. The thermoelectric conversion module uses the thermoelectric conversion material.Type: ApplicationFiled: February 18, 2014Publication date: January 14, 2016Applicants: LINTEC CORPORATION, KYUSHU INSTITUTE OF TECHNOLOGYInventors: Kunihisa KATO, Tsuyoshi MUTOU, Koji MIYAZAKI, Aiko HARADA
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Publication number: 20150228879Abstract: The present invention provides a thermoelectric conversion material capable of being produced in a simplified manner and at a low cost and excellent in thermoelectric conversion characteristics and flexibility, and provides a method for producing the material. The thermoelectric conversion material has, on a support, a thin film of a thermoelectric semiconductor composition containing thermoelectric semiconductor fine particles, a heat-resistant resin and an ionic liquid. The method for producing a thermoelectric conversion material having, on a support, a thin film of a thermoelectric semiconductor composition containing thermoelectric semiconductor fine particles, a heat-resistant resin and an ionic liquid comprises a step of applying a thermoelectric semiconductor composition containing thermoelectric semiconductor fine particles, a heat-resistant resin and an ionic liquid onto a support and drying it to form a thin film thereon, and a step of annealing the thin film.Type: ApplicationFiled: July 25, 2014Publication date: August 13, 2015Applicant: LINTEC CORPORATIONInventors: Kunihisa Kato, Tsuyoshi Mutou, Takeshi Kondo
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Publication number: 20150075578Abstract: The present invention provides a thermoelectric conversion material having a reduced thermal conductivity and having an improved figure of merit, and a method for producing the material. The thermoelectric conversion material has, as formed on a resin substrate having recesses, a thermoelectric semiconductor layer formed of a thermoelectric semiconductor material, wherein the resin substrate comprises one formed by curing a resin layer of a curable resin composition. The production method for the thermoelectric conversion material comprises a resin substrate formation step of transcribing a protruding structure from an original plate having the protruding structure onto a resin layer of a curable resin composition and curing the layer, and a film formation step of forming a thermoelectric semiconductor layer of a thermoelectric semiconductor material on the resin substrate.Type: ApplicationFiled: April 17, 2013Publication date: March 19, 2015Applicant: LINTEC CORPORATIONInventors: Kunihisa Kato, Tsuyoshi Mutou