Abstract: One object is to provide an electronic component in which a standoff for filling solder is maintained. An electronic component according to an embodiment of the present invention is configured to be surface-mountable on a circuit board. The electronic component includes: an insulating base member; an internal conductor provided in the base member; a first external electrode provided on the mounting surface of the base member so as to be electrically connected to the internal conductor; and a second external electrode provided on the mounting surface of the base member so as to be electrically connected to the internal conductor. The first external electrode has a first protrusion, and the second external electrode has a second protrusion. The first protrusion and the second protrusion enables a standoff for filling solder to be maintained within a region defined by the mounting surface of the base member and the circuit board.

Abstract: One object is to provide an electronic component in which a standoff for filling solder is maintained. An electronic component according to an embodiment of the present invention is configured to be surface-mountable on a circuit board. The electronic component includes: an insulating base member; an internal conductor provided in the base member; a first external electrode provided on the mounting surface of the base member so as to be electrically connected to the internal conductor; and a second external electrode provided on the mounting surface of the base member so as to be electrically connected to the internal conductor. The first external electrode has a first protrusion, and the second external electrode has a second protrusion. The first protrusion and the second protrusion enables a standoff for filling solder to be maintained within a region defined by the mounting surface of the base member and the circuit board.

Abstract: One object is to provide an electronic component in which a standoff for filling solder is maintained. An electronic component according to an embodiment of the present invention is configured to be surface-mountable on a circuit board. The electronic component includes: an insulating base member; an internal conductor provided in the base member; a first external electrode provided on the mounting surface of the base member so as to be electrically connected to the internal conductor; and a second external electrode provided on the mounting surface of the base member so as to be electrically connected to the internal conductor. The first external electrode has a first protrusion, and the second external electrode has a second protrusion. The first protrusion and the second protrusion enables a standoff for filling solder to be maintained within a region defined by the mounting surface of the base member and the circuit board.

Abstract: One object of the present invention is to provide a compact coil component with superior characteristics. An electronic component according one embodiment includes an insulator and a coil portion. The insulator is formed of a non-magnetic material. The insulator includes a width direction in a first axial direction, a length direction in a second axial direction, and a height direction in a third axial direction. The coil portion includes a circumference section. The circumference section is wound around the first axial direction. The coil portion is arranged inside the insulator. The first ratio of a height to a length of the insulator is 1.5 times or less of a second ratio of a height between first inner peripheral portions of the circumference section along the third axial direction with respect to a length between second inner peripheral portions of the circumference section along the second axial direction.

Abstract: An electronic component according one embodiment of the disclosure includes an insulator, an internal conductor, and an external electrode. The insulator may be formed of a material that contains resin. The internal conductor is provided inside the insulator and includes a conductive main body and an outer coating film that is provided on at least a part of a peripheral surface of the conductive main body and has a resistivity higher than the conductive main body. The external electrode is disposed on the insulator and electrically coupled to the internal conductor.

Abstract: An electronic component according one embodiment of the disclosure includes an insulator, an internal conductor, and an external electrode. The insulator is made of a material containing resin. The insulator includes a first insulating layer that has a first bonding surface perpendicular to one axial direction and a second insulating layer bonded to the first bonding surface. The internal conductor includes a plurality of first via conductive members provided in the first insulating layer and a plurality of second via conductive members provided in the second insulating layer. Each of the first via conductive members has a first contact connected to the corresponding second via conductive member at a position offset in the one axial direction with respect to the first bonding surface.

Abstract: Disclosed is a conductor structure provided with a transparent conductive film that can reduce a resistance value in a high-frequency band, while ensuring transparency. Also disclosed is an electronic device provided with the conductor structure. On the main surface of a glass substrate (10) that constitutes a display section of a mobile phone and the like, a signal electrode (20) as a signal line is formed, and GND electrodes (30, 40) connected to the ground are formed so as to sandwich the signal electrode (20). On the side faces at both edges of the signal electrode (20), metal auxiliary lines (22, 24) having a fine line width are formed. Furthermore, on the respective edge portion side faces of the GND electrodes (30, 40) facing the signal electrode (20), metal auxiliary lines (32, 42) having a fine line width are also formed.

Abstract: Disclosed is a conductor structure provided with a transparent conductive film that can reduce a resistance value in a high-frequency band, while ensuring transparency. Also disclosed is an electronic device provided with the conductor structure. On the main surface of a glass substrate (10) that constitutes a display section of a mobile phone and the like, a signal electrode (20) as a signal line is formed, and GND electrodes (30, 40) connected to the ground are formed so as to sandwich the signal electrode (20). On the side faces at both edges of the signal electrode (20), metal auxiliary lines (22, 24) having a fine line width are formed. Furthermore, on the respective edge portion side faces of the GND electrodes (30, 40) facing the signal electrode (20), metal auxiliary lines (32, 42) having a fine line width are also formed.

Abstract: A variable frequency amplifier suffering less deterioration of strain characteristic and capable of operating at plural frequencies is disclosed. In one aspect, a changeable amplifier comprises an amplifying element, a changeable matching circuit disposed at an input side of the amplifying element and including a first variable capacity element connected in series with a signal conductor and a second variable capacity element connected in parallel with the signal conductor, and a control circuit for controlling the changeable matching circuit. Based on a feedback signal, the control circuit applies DC bias voltages to the first variable capacity element and the second variable capacity element of the changeable matching circuit and also applies thereto a correction signal.

Abstract: An object of the present invention is to introduce a sample solution into the minute and hydrophobic inside of a reactor for a pretreatment while avoiding bubble formation. According to the present invention, a reactor that has at least one portion having a width of 90% or less of its whole width between an inflow opening and an outflow opening is constructed on a planar substrate.

Abstract: The object of the present invention is to promote the efficiency and simplify a sample pretreatment step for analysis of molecules contained in the sample. In the present invention, a plurality of various enzymes necessary for pretreatment of sample for analysis of various molecules contained in the sample are immobilized on a solid phase separately for each kind of enzyme, and the enzyme reactions are carried out simultaneously. That is, a sample is reacted with plural kinds of enzymes under the same conditions, and contamination caused by the enzyme reactions is inhibited and the sample is subjected to a given pretreatment.