Abstract: A wired circuit board, including a metal supporting layer; an insulating layer formed on one side of the metal supporting layer in a thickness direction thereof; and a conductive layer having a plurality of terminal portions placed to be spaced apart from each other and formed on one side of the insulating layer in the thickness direction. The insulating layer has a first opening which is formed to include the plurality of terminal portions, and the metal supporting layer includes a second opening formed to include the plurality of terminal portions, when projected in the thickness direction. The wired circuit board further includes at least one reinforcing insulating portion which is placed between the plurality of terminal portions in the first opening, and/or at least one reinforcing metal supporting portion which is placed between the plurality of terminal portions in the second opening, when projected in the thickness direction.

Abstract: A wired circuit board, including a metal supporting layer; an insulating layer formed on one side of the metal supporting layer in a thickness direction thereof; and a conductive layer having a plurality of terminal portions placed to be spaced apart from each other and formed on one side of the insulating layer in the thickness direction. The insulating layer has a first opening which is formed to include the plurality of terminal portions, and the metal supporting layer includes a second opening formed to include the plurality of terminal portions, when projected in the thickness direction. The wired circuit board further includes at least one reinforcing insulating portion which is placed between the plurality of terminal portions in the first opening, and/or at least one reinforcing metal supporting portion which is placed between the plurality of terminal portions in the second opening, when projected in the thickness direction.

Abstract: A method of producing a wired circuit board includes a first step of preparing a metal supporting layer, a second step of forming, on one side of the metal supporting layer in a thickness direction thereof, an insulating layer having a first opening, and a plurality of terminal formation portions, a third step of forming, on one side of the insulating layer in the thickness direction, a conductive layer having a plurality of terminal portions each corresponding to the plurality of terminal formation portions, a fourth step of partially removing the metal supporting layer to form a second opening and at least one reinforcing metal supporting portion placed between the plurality of terminal formation portions, and a fifth step of removing the plurality of terminal formation portions exposed from the second opening to expose both side surfaces of the plurality of terminal portions in the thickness direction.

Abstract: A method of producing a wired circuit board includes a first step of preparing a metal supporting layer, a second step of forming, on one side of the metal supporting layer in a thickness direction thereof, an insulating layer having a first opening, and a plurality of terminal formation portions, a third step of forming, on one side of the insulating layer in the thickness direction, a conductive layer having a plurality of terminal portions each corresponding to the plurality of terminal formation portions, a fourth step of partially removing the metal supporting layer to form a second opening and at least one reinforcing metal supporting portion placed between the plurality of terminal formation portions, and a fifth step of removing the plurality of terminal formation portions exposed from the second opening to expose both side surfaces of the plurality of terminal portions in the thickness direction.