Patents by Inventor Tsuyoshi OKAHISA

Tsuyoshi OKAHISA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20160351760
    Abstract: A method of manufacturing a covering member includes providing a first light-reflective member having a through-hole, the through-hole having first and second openings; arranging a light-transmissive resin containing a wavelength-conversion material within the through-hole; distributing the wavelength-conversion material predominantly on a side of the first opening of the through-hole within the light-transmissive resin; and after the distributing of the wavelength-conversion material, removing a portion of the light-transmissive resin from a side of the second opening of the through-hole.
    Type: Application
    Filed: May 27, 2016
    Publication date: December 1, 2016
    Applicant: NICHIA CORPORATION
    Inventors: Tadao HAYASHI, Teruhito AZUMA, Suguru BEPPU, Kunihiro IZUNO, Tsuyoshi OKAHISA
  • Publication number: 20150060921
    Abstract: A light emitting device includes a base member including a resin-molded body having an upper surface, a lower surface and a front surface, and formed with a groove-shaped recess in the front surface across the front surface from the upper surface to the lower surface. A lead can be embedded in the resin-molded body. A light emitting element is provided, and can include a light emitting element chip and a reflecting layer limiting a light-emitting region to a predetermined range. The reflecting layer can be disposed on or over a side surface of the light emitting element. The light emitting element is disposed on a bottom surface of the recess such that the reflecting layer is spaced apart from a side wall of the recess.
    Type: Application
    Filed: August 26, 2014
    Publication date: March 5, 2015
    Inventor: Tsuyoshi OKAHISA
  • Publication number: 20150041844
    Abstract: A light emitting device has a lens, extended to outside of the mounting substrate on which a semiconductor a light emitting element is mounted, and leakage of light is reduced. A light emitting element, a substrate having the light emitting element mounted on its upper surface, and a lens, having a curved upper surface encloses the light emitting element and the upper surface of the substrate is included. From the bottom surface of the lens, a lower surface of the substrate is exposed. In a top view from a perpendicular direction to the upper surface of the substrate, the bottom surface of the lens includes an outer extending portion where the bottom surface is extended to outside of the substrate, and a inclined portion, which inclines with respect to a direction approximately in parallel to the upper surface of the substrate, at an end portion of the outer extending portion.
    Type: Application
    Filed: August 6, 2014
    Publication date: February 12, 2015
    Inventors: Tsuyoshi OKAHISA, Yuta OKA, Daisuke SANGA