Abstract: The present disclosure provides a thermoplastic polymer composition comprising a fluororesin (A), a crosslinked fluoroelastomer (B), and magnesium oxide (C), wherein the fluororesin (A) is a copolymer that contains ethylene unit and tetrafluoroethylene unit; wherein the crosslinked fluoroelastomer (B) is obtained by subjecting a fluoroelastomer (b) to a dynamic crosslinking treatment in the presence of the fluororesin (A), the magnesium oxide (C), and a cross-linking agent (D) under conditions for melting the fluororesin (A); wherein the magnesium oxide (C) has a volume-based 10% particle size of 1.0 ?m or less; and wherein a mass ratio between the fluororesin (A) and the crosslinked fluoroelastomer (B) ((A)/(B)) is 50/50 to 95/5.

Abstract: Apparatuses and methods for sending comments are disclosed. An example information processing apparatus includes one or more processors having hardware, wherein the one or more processors receive a comment to be entered in relation to a play unit performed by a user, and send the comment together with information specifying the performed play unit to a server device.

Abstract: An execution section executes a game according to a user's operation input. At a timing for restricting a game play of a user, a restriction processing section restricts the game play of the user in principle. If, at the timing for restricting the game play of the user, the execution section is executing an activity for which a termination condition has been defined, the restriction processing section refrains from restricting the game play of the user.

Abstract: A thermoplastic resin composition including a fluororesin (A) and a crosslinked fluoroelastomer (B), wherein the fluororesin (A) is a copolymer that contains a chlorotrifluoroethylene unit and a tetrafluoroethylene unit and that has at least one functional group selected from a carbonyl group, an olefinic group and an amino group at a main chain terminal or side chain terminal of the polymer. The crosslinked fluoroelastomer (B) is obtained by subjecting a fluoroelastomer (b) to a dynamic crosslinking treatment along with a polyamine compound (c) having a thermal decomposition temperature of 210° C. or higher and a crosslinking accelerator (d) in the presence of the fluororesin (A) under conditions for melting the fluororesin (A). Also disclosed is a method for producing the thermoplastic composition, a molded article formed from the thermoplastic composition, and a laminated product including a resin layer formed from the thermoplastic composition.

Abstract: A thermoplastic resin composition including a fluororesin (A) and a crosslinked fluoroelastomer (B). The fluororesin (A) is a copolymer containing a chlorotrifluoroethylene unit and a tetrafluoroethylene unit and having at least one functional group selected from a carbonyl group, an olefinic group and an amino group at a main chain terminal or side chain terminal of the polymer. The crosslinked fluoroelastomer (B) is obtained by subjecting a fluoroelastomer (b) to a dynamic crosslinking treatment along with a polyamine compound (c) having a thermal decomposition temperature of 210° C. or higher and a crosslinking accelerator (d) in the presence of the fluororesin (A) under conditions for melting the fluororesin (A). Further, a mass ratio between the fluororesin (A) and the fluoroelastomer (b) (fluororesin (A)/fluoroelastomer (b)) is less than 70/30 and 20/80 or more. Also disclosed is a method for producing the composition as well as various molded and laminated products formed therefrom.

Abstract: A semiconductor module includes a ground substrate that is provided with a drive circuit, and a plurality of light emitting elements that are electrically coupled to the drive circuit, in which a distance between the light emitting elements adjacent to each other is equal to or less than 20 ?m in a top view.

Abstract: A light-emitting device comprises a casing including an upper surface portion having one or more first through holes, and a front surface portion having an opening; a transparent member that closes off the one or more first through holes; one or more light-emitting elements that face the one or more first through holes, respectively, within the casing; and a lid member provided so as to close off the opening, wherein the casing is integrally formed using one material.

Abstract: A semiconductor module includes a base substrate; a plurality of light emitting elements; a plurality of color conversion layers being in contact with each upper portion of the plurality of light emitting elements adjacent to each other; and a light shielding layer disposed between the plurality of light emitting elements adjacent each other and between the color conversion layers adjacent to each other, and separating the plurality of light emitting elements and a plurality of color conversion layers.

Abstract: To enable manufacturing of a display device with a low defect rate and high yield, an integrated circuit chip includes a drive circuit that drives a light emitting unit, and the drive circuit includes a P-side electrode connected to an anode of the light emitting unit and a nonvolatile memory transistor that controls current supply to the P-side electrode.

Abstract: A light-emitting device having four or more LEDs arranged on a substrate includes a first color conversion layer and a second color conversion layer. The first color conversion layer is continuously formed on light exit surfaces of two or more of the LEDs, and the second color conversion layer is continuously formed on light exit surfaces of two or more of the LEDs that are different from the LEDs on which the first color conversion layer is formed.

Abstract: A light-emitting device comprises a casing including an upper surface portion having one or more first through holes, and a front surface portion having an opening; a transparent member that closes off the one or more first through holes; one or more light-emitting elements that face the one or more first through holes, respectively, within the casing; and a lid member provided so as to close off the opening, wherein the casing is integrally formed using one material.

Abstract: A light source device includes: a driving circuit; a blue light emitting element made of a group III nitride semiconductor which has a light outgoing surface on a side opposite to a side with the driving circuit, is arranged on the driving circuit, and is electrically connected to the driving circuit; and a color conversion layer which is in contact with the light outgoing surface and converts a wavelength of light emitted from the light outgoing surface. The light outgoing surface is made of a group III nitride semiconductor.

Abstract: A thermoplastic resin composition including a fluororesin (A) and a crosslinked fluoroelastomer (B). The fluororesin (A) is a copolymer containing a chlorotrifluoroethylene unit and a tetrafluoroethylene unit and having at least one functional group selected from a carbonyl group, an olefinic group and an amino group at a main chain terminal or side chain terminal of the polymer. The crosslinked fluoroelastomer (B) is obtained by subjecting a fluoroelastomer (b) to a dynamic crosslinking treatment along with a polyamine compound (c) having a thermal decomposition temperature of 210° C. or higher and a crosslinking accelerator (d) in the presence of the fluororesin (A) under conditions for melting the fluororesin (A). Further, a mass ratio between the fluororesin (A) and the fluoroelastomer (b) (fluororesin (A)/fluoroelastomer (b)) is less than 70/30 and 20/80 or more. Also disclosed is a method for producing the composition as well as various molded and laminated products formed therefrom.

Abstract: To enable manufacturing of a display device with a low defect rate and high yield, an integrated circuit chip includes a drive circuit that drives a light emitting unit, and the drive circuit includes a P-side electrode connected to an anode of the light emitting unit and a nonvolatile memory transistor that controls current supply to the P-side electrode.

Abstract: A semiconductor module includes a ground substrate that is provided with a drive circuit, and a plurality of light emitting elements that are electrically coupled to the drive circuit, in which a distance between the light emitting elements adjacent to each other is equal to or less than 20 ?m in a top view.

Abstract: A thermoplastic resin composition including a fluororesin (A) and a crosslinked fluoroelastomer (B), wherein the fluororesin (A) is a copolymer that contains a chlorotrifluoroethylene unit and a tetrafluoroethylene unit and that has at least one functional group selected from a carbonyl group, an olefinic group and an amino group at a main chain terminal or side chain terminal of the polymer. The crosslinked fluoroelastomer (B) is obtained by subjecting a fluoroelastomer (b) to a dynamic crosslinking treatment along with a polyamine compound (c) having a thermal decomposition temperature of 210° C. or higher and a crosslinking accelerator (d) in the presence of the fluororesin (A) under conditions for melting the fluororesin (A). Also disclosed is a method for producing the thermoplastic composition, a molded article formed from the thermoplastic composition, and a laminated product including a resin layer formed from the thermoplastic composition.

Abstract: To enable manufacturing of a display device with a low defect rate and high yield, an integrated circuit chip includes a drive circuit that drives a light emitting unit, and the drive circuit includes a P-side electrode connected to an anode of the light emitting unit and a nonvolatile memory transistor that controls current supply to the P-side electrode.

Abstract: A semiconductor module includes a base substrate; a plurality of light emitting elements; a plurality of color conversion layers being in contact with each upper portion of the plurality of light emitting elements adjacent to each other; and a light shielding layer disposed between the plurality of light emitting elements adjacent each other and between the color conversion layers adjacent to each other, and separating the plurality of light emitting elements and a plurality of color conversion layers.

Abstract: In a light-emitting element module, at least two or more first electrodes of a first substrate that includes a circuit element are joined to at least two or more light-emitting elements. The first substrate includes a first wiring line to an n-th wiring line (n is an integer of 2 or more) that are formed into layers in order from the at least two or more light-emitting elements in a thickness direction of the first substrate. The first wiring line that is located in one of the layers of the first substrate nearest to the at least two or more light-emitting elements is formed at least in an interelectrode region between the adjacent first electrodes of the first substrate in a plan view.

Abstract: A light-emitting device having four or more LEDs arranged on a substrate includes a first color conversion layer and a second color conversion layer. The first color conversion layer is continuously formed on light exit surfaces of two or more of the LEDs, and the second color conversion layer is continuously formed on light exit surfaces of two or more of the LEDs that are different from the LEDs on which the first color conversion layer is formed.