Abstract: A sensor includes a sensor element, a package accommodating the sensor element in an inside of the package, a grounding electrode disposed in the package, a lid covering an opening of the package, and a lead extending from the package. The lead includes first and second portions. The first portion of the lead is electrically connected to the grounding electrode and extends along a side surface of the package with a gap provided between the first portion and the side surface. The second portion of the lead is disposed between the lid and the package and extends toward the inside of the package. In this sensor, the opening can be sealed without soldering and reliably connect the lid to the grounding electrode.

Abstract: A sensor includes a first substrate, a supporter connected to the first substrate, a weight facing the first substrate, a beam of which first end is connected to the supporter and of which second end is connected to the weight, a second substrate facing the weight, and a first projection disposed on the first substrate. This senor allows effectively preventing the beam from a breakage caused by the beam twisted due to a rotation of the weight when an impact is applied to the sensor. The sensor thus can improve anti-impact property.

Abstract: An inertial force sensor includes a detector element, a supporting body supporting the detector element, and a case holding the detector element via the first supporting body. The supporting body has flexibility and has a plate shape. The detector element includes a weight, a flexible coupling portion extending along a plane and supporting the weight, a fixing portion holding the weight via the coupling portion, and a detector detecting angular velocities about at least two axes non-parallel to each other. The supporting body extends in parallel with the plane from the detector element, and bends at a bending portion in a direction away from the plane. This inertial force sensor can detect the angular velocities while preventing erroneous detection caused by external impacts and vibrations.

Abstract: A semiconductor mounting substrate according to the present invention comprises: a substrate; a semiconductor device, mounted on this substrate; solder bumps, which connect the semiconductor device and the substrate; a first resin, filled in a space between the semiconductor device and the substrate; and electronic components, mounted on a face side of the semiconductor device where the semiconductor device is mounted, wherein bond strength reinforcing resin section is provided at least between a side face in the vicinity of a corner part of the semiconductor device and a substrate surface of the substrate in a position corresponding to the corner part.

Abstract: An inertial force sensor includes a detector element, a supporting body supporting the detector element, and a case holding the detector element via the first supporting body. The supporting body has flexibility and has a plate shape. The detector element includes a weight, a flexible coupling portion extending along a plane and supporting the weight, a fixing portion holding the weight via the coupling portion, and a detector detecting angular velocities about at least two axes non-parallel to each other. The supporting body extends in parallel with the plane from the detector element, and bends at a bending portion in a direction away from the plane. This inertial force sensor can detect the angular velocities while preventing erroneous detection caused by external impacts and vibrations.

Abstract: A semiconductor mounting substrate according to the present invention comprises: a substrate; a semiconductor device, mounted on this substrate; solder bumps, which connect the semiconductor device and the substrate; a first resin, filled in a space between the semiconductor device and the substrate; and electronic components, mounted on a face side of the semiconductor device where the semiconductor device is mounted, wherein bond strength reinforcing resin section is provided at least between a side face in the vicinity of a corner part of the semiconductor device and a substrate surface of the substrate in a position corresponding to the corner part.

Abstract: A semiconductor mounting substrate according to the present invention comprises: a substrate; a semiconductor device, mounted on this substrate; solder bumps, which connect the semiconductor device and the substrate; a first resin, filled in a space between the semiconductor device and the substrate; and electronic components, mounted on a face side of the semiconductor device where the semiconductor device is mounted, wherein bond strength reinforcing resin section is provided at least between a side face in the vicinity of a corner part of the semiconductor device and a substrate surface of the substrate in a position corresponding to the corner part.

Abstract: A semiconductor mounting substrate according to the present invention comprises: a substrate; a semiconductor device, mounted on this substrate; solder bumps, which connect the semiconductor device and the substrate; a first resin, filled in a space between the semiconductor device and the substrate; and electronic components, mounted on a face side of the semiconductor device where the semiconductor device is mounted, wherein bond strength reinforcing resin section is provided at least between a side face in the vicinity of a corner part of the semiconductor device and a substrate surface of the substrate in a position corresponding to the corner part.

Abstract: A piezoelectric device includes a piezoelectric plate provided with at least one electrode at almost a central portion of each face; a first plate made of an ionic material having a recessed portion to cover the at least one electrode at one face to face the piezoelectric plate; and a second plate made of an ionic material having a recessed portion to cover the at least one electrode at one face to face the piezoelectric plate. Each of the at least one electrode is packaged by direct bonding the piezoelectric plate with the first plate and the second plate so as to be sandwiched therebetween. A package includes a body member made of an ionic material provided with a recessed portion or an opening, having a flat face around the recessed portion or the opening; and a covering member made of an ionic material having a flat face to cover the body member.

Abstract: A piezoelectric device includes a piezoelectric plate provided with at least one electrode at almost a central portion of each face; a first plate made of an ionic material having a recessed portion to cover the at least one electrode at one face to face the piezoelectric plate; and a second plate made of an ionic material having a recessed portion to cover the at least one electrode at one face to face the piezoelectric plate. Each of the at least one electrode is packaged by direct bonding the piezoelectric plate with the first plate and the second plate so as to be sandwiched therebetween. A package includes a body member made of an ionic material provided with a recessed portion or an opening, having a flat face around the recessed portion or the opening; and a covering member made of an ionic material having a flat face to cover the body member.