Abstract: A method for forming a layer comprises (a) disposing a first droplet to two parts on an underlayer surface so as to form two dot patterns isolated each other on the underlayer surface, (b) fixing the two dot patterns to the underlayer surface, (c) giving lyophilicity with respect to a second droplet to at least the underlayer surface between the two dot patterns, and (d) disposing the second droplet to the underlayer surface between the two dot patterns so as to join the two dot patterns after the step (c).

Abstract: A method for forming a conductive post include: a) forming a liquid repellent portion having a thickness of 100 nm or less by disposing a liquid repellent material in a conductive post forming region on a conductive layer; b) forming an insulation layer having an opening in a region overlapping with the conductive post forming region by disposing a liquid including an insulation layer forming material on the conductive layer having the liquid repellent portion formed thereon and polymerizing the insulation layer forming material; c) disposing metal particulates in the opening; and d) heating the metal particulates at a fusing temperature of the metal particulates or higher so as to fusion bond the metal particulates to each other in order to form the conductive post, and to fusion bond the metal particulates and the conductive layer in order to couple the conductive post with the conductive layer.

Abstract: A method for forming a multi-layered structure using a droplet-discharging device; the method comprises: (A) forming a first insulating-material layer covering the material-body surface by discharging a droplet of a first insulating material including a first photosensitive resin to a material-body surface; (B) obtaining a first insulating layer by curing in the first insulating-material layer; (C) forming a pattern of an electric conductive material layer on the first insulating layer by discharging a droplet of an electric conductive material to the first insulating layer; and (D) forming a wiring pattern on the first insulating layer by activating the pattern of the electric conductive material layer.

Abstract: A pattern forming system including a feeding reel for feeding a tape form substrate that is wound up, a winding reel for winding up the tape form substrate that is fed up, and a droplet discharge apparatus for discharging a droplet onto the tape form substrate, between the feeding reel and the winding reel, to form a pattern, wherein the droplet discharge apparatus includes a table that can move while sucking the tape form substrate, with a slack mechanism for the tape form substrate being placed on the both ends of the table in the longitudinal direction of the tape form substrate.

Abstract: A pattern forming system including a feeding reel for feeding a tape form substrate that is wound up, a winding reel for winding up the tape form substrate that is fed up, and a droplet discharge apparatus for discharging a droplet onto the tape form substrate, between the feeding reel and the winding reel, to form a pattern, wherein the droplet discharge apparatus includes a table that can move while sucking the tape form substrate, with a slack mechanism for the tape form substrate being placed on the both ends of the table in the longitudinal direction of the tape form substrate.

Abstract: A manufacturing method of an electronic board includes: placing an electronic component including conductive parts on a first insulation layer with the conductive parts facing up as well as providing projections having conductivities on the conductive parts; applying an insulation material by means of a droplet discharging method providing a second insulation layer on an upper surface of the electronic component while dodging the projections, the second insulation layer having a height the projections project out from the layer; providing conductive wirings to be connected to the projections on the second layer; and applying the insulation material around the electronic component by means of the droplet discharging method to provide a third insulation layer having a height generally equal to the second insulation layer.

Abstract: A method for manufacturing an electronic substrate including an electronic component bonded with adhesive to a base part, comprises (a) applying a droplet containing the adhesive to an area on the base part, the area facing to the electronic component, within a range substantially equal to a size of the electronic component by using a droplet ejection head moving in relatively to the base part, and (b) mounting the electronic component on the adhesive applied to the base part.

Abstract: A droplet discharge apparatus is used in a multilayer structure forming method of the invention.

Abstract: There is provided a multi-layered structure forming method comprising: (A) forming a first insulating material layer containing a first photo-curing material on a substrate; (B) semi-hardening the first insulating material layer by radiating light having a first wavelength to the first insulating material layer; (C) forming a conductive material layer on the semi-hardened first insulating material layer by ejecting droplets of a conductive material to the semi-hardened first insulating material layer from a nozzle of a liquid droplet ejecting apparatus; (D) forming a second insulating material layer containing a second photo-curing material so as to cover the semi-hardened first insulating material layer and the conductive material layer; and (E) forming a first insulating layer, a conductive layer positioned on the first insulating material, and a second insulating layer covering the first insulating layer and the conductive layer by simultaneously heating the first insulating material layer, the conductive

Abstract: A method for forming a wiring pattern in which a plurality of electrical wirings deposited onto a substrate is conductively connected with each other through a plurality of conductive posts, the method including relatively moving a discharge head having a plurality of nozzles and a substrate in a predetermined direction while discharging droplets from predetermined nozzles among the plural nozzles to form the plural conductive posts, wherein, in the orthogonal direction of the above-referenced predetermined direction, the interval among the plural nozzles “a” and the interval among the plural conductive posts “b” satisfy an equation “b=m×a” (“m” may be any positive integer).

Abstract: A method for forming a film pattern disposed adjacent to a pattern non-forming region by coating a pattern forming region with a functional liquid, includes (a) forming a liquid repellent film by coating the pattern non-forming region with a droplet containing a liquid repellent material having repellency to the functional liquid, and (b) forming the film pattern by coating the pattern forming region adjacent to the liquid repellent film with the functional liquid. The step (a) of forming of the liquid repellent film and the step (b) of forming of the film pattern are alternately repeated at least two times, respectively.

Abstract: In a method for forming a layer using a droplet discharging device that discharges droplets from a plurality of nozzles while relatively moving a surface in a first direction with respect to a head including the plurality of nozzles, the method for forming a layer comprises: a) respectively arranging a first droplet on each of two reference regions on the surface and providing two separate patterns corresponding to the two reference regions; b) fixing the two patterns; c) making the surface lyophilic after fixing the two patterns; and d) arranging a second droplet between the two reference regions and connecting the two patterns after making the surface lyophilic.

Abstract: A method of manufacturing a wiring substrate having a wiring layer formation step that includes: a first surface processing step in which surface processing is performed on a film formation area of a substrate; a wiring formation step in which a wiring pattern is formed by placing a first liquid material on the film formation area; a second surface processing step in which surface processing is once again performed on the film formation area; and an insulating film formation step in which an insulating film is formed by placing a second liquid material in gaps in the wiring pattern, wherein an affinity between the second liquid material and the film formation area in the insulating film formation step is greater than an affinity between the first liquid material and the film formation area in the wiring formation step.

Abstract: A method for forming a conductive post include: a) forming a liquid repellent portion having a thickness of 100 nm or less by disposing a liquid repellent material in a conductive post forming region on a conductive layer; b) forming an insulation layer having an opening in a region overlapping with the conductive post forming region by disposing a liquid including an insulation layer forming material on the conductive layer having the liquid repellent portion formed thereon and polymerizing the insulation layer forming material; c) disposing metal particulates in the opening; and d) heating the metal particulates at a fusing temperature of the metal particulates or higher so as to fusion bond the metal particulates to each other in order to form the conductive post, and to fusion bond the metal particulates and the conductive layer in order to couple the conductive post with the conductive layer.

Abstract: A method for producing a multilayered wiring substrate includes forming a lyophobic area on a first conductive layer, forming an insulating layer with an opening portion on the first conductive layer by applying a functional liquid containing an insulating layer forming material on a periphery of the lyophobic area, laminating the first conductive layer and a second conductive layer via the insulating layer, and electrically connecting the first and the second conductive layers to each other via the opening portion formed in the insulating layer.

Abstract: A pattern forming system including a feeding reel for feeding a tape form substrate that is wound up, a winding reel for winding up the tape form substrate that is fed up, and a droplet discharge apparatus for discharging a droplet onto the tape form substrate, between the feeding reel and the winding reel, to form a pattern, wherein the droplet discharge apparatus includes a table that can move while sucking the tape form substrate, with a slack mechanism for the tape form substrate being placed on the both ends of the table in the longitudinal direction of the tape form substrate.

Abstract: A pattern forming system including a feeding reel for feeding a tape form substrate that is wound up, a winding reel for winding up the tape form substrate that is fed up, and a droplet discharge apparatus for discharging a droplet onto the tape form substrate, between the feeding reel and the winding reel, to form a pattern, wherein the droplet discharge apparatus includes a table that can move while sucking the tape form substrate, with a slack mechanism for the tape form substrate being placed on the both ends of the table in the longitudinal direction of the tape form substrate.

Abstract: In a method of forming a wiring pattern, a plurality of electrical wirings deposited to be multilayered are conductively connected to one another through a conducting post. The method has forming the electrical wiring by discharging a first droplet including a material for forming the electrical wiring, and forming the conducting post by discharging a second droplet including a material for forming the conducting post, wherein a volume of the second droplet is greater than a volume of the first droplet.

Abstract: A method for manufacturing a wiring board having an electronic component disposed on a substrate and an insulating film formed around the electronic component through application of an insulating material, is disclosed. The method includes: cutting off an electronic component forming substrate on which a plurality of the electronic components are formed, after the electronic component forming substrate has been fixed on a supporting member, to individually separate the plurality of the electronic components; performing lyophilic processing on surface of the plurality of the electronic components while the electronic component forming substrate is fixed on the supporting member; and forming an insulating film around an individually separated electronic component, the electronic component being disposed on the substrate in such a manner that the individually separated electronic component is distanced from the supporting member.

Abstract: A manufacturing method of an electronic board includes: placing an electronic component including conductive parts on a first insulation layer with the conductive parts facing up as well as providing projections having conductivities on the conductive parts; applying an insulation material by means of a droplet discharging method providing a second insulation layer on an upper surface of the electronic component while dodging the projections, the second insulation layer having a height the projections project out from the layer; providing conductive wirings to be connected to the projections on the second layer; and applying the insulation material around the electronic component by means of the droplet discharging method to provide a third insulation layer having a height generally equal to the second insulation layer.