Patents by Inventor Tsuyoshi SUNADA

Tsuyoshi SUNADA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wiring board
    Patent number: 11322417
    Abstract: A wiring board of the present disclosure includes: a first insulating layer including a surface; a second insulating layer including un upper surface and a lower surface and locating above the surface of the first insulating layer; a wiring conductor layer formed on the surface of the first insulating layer, includes a via land; and a via hole conductor penetrating from the upper surface to the lower surface of the second insulating layer. The via hole conductor includes a via bottom being in contact with the via land. Crystal grains in the via bottom are smaller than crystal grains in the via land.
    Type: Grant
    Filed: July 25, 2019
    Date of Patent: May 3, 2022
    Assignee: KYOCERA CORPORATION
    Inventors: Tsuyoshi Sunada, Hidetoshi Yugawa
  • WIRING BOARD
    Publication number: 20200035575
    Abstract: A wiring board of the present disclosure includes: a first insulating layer including a surface; a second insulating layer including un upper surface and a lower surface and locating above the surface of the first insulating layer; a wiring conductor layer formed on the surface of the first insulating layer, includes a via land; and a via hole conductor penetrating from the upper surface to the lower surface of the second insulating layer. The via hole conductor includes a via bottom being in contact with the via land. Crystal grains in the via bottom are smaller than crystal grains in the via land.
    Type: Application
    Filed: July 25, 2019
    Publication date: January 30, 2020
    Applicant: KYOCERA Corporation
    Inventors: Tsuyoshi SUNADA, Hidetoshi YUGAWA