Patents by Inventor Tsuyoshi Takayama

Tsuyoshi Takayama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240122579
    Abstract: Systems and methods for automated ultrasound credentialing are described. In some embodiments, a credentialing system for issuing a sonographer credential to a sonography candidate includes an ultrasound probe coupled to a computing device and configured to generate ultrasound data. The computing device is configured to generate, based on the ultrasound data and as part of an automated review, an ultrasound examination score. The computing device is configured to transfer, based on the ultrasound examination score, the sonography candidate from the automated review to a manual review by a reviewer.
    Type: Application
    Filed: October 18, 2022
    Publication date: April 18, 2024
    Inventors: Davin Dhatt, Paul Danset, Thomas Duffy, Hidetoshi Takayama, Tomoki Inoue, Tsuyoshi Matsumoto
  • Publication number: 20240090535
    Abstract: Provided is a method of producing a feed or food product in which an inner layer is encrusted with a gelled outer layer composition, the method including the steps of: preparing an outer layer composition feedstock by adding a secondary feedstock to a protein feedstock and/or a starch feedstock that forms a gel upon heating and then mixing by stirring, and preparing an inner layer composition that is encrusted with the outer layer composition; extrusion molding with an extruder provided with a double nozzle so as to cover a surface of the inner layer composition while simultaneously gelling the outer layer composition feedstock by heat treatment; and cutting a continuously extruded cylindrically shaped product to a fixed length with a shutter mechanism while simultaneously encrusting a cut surface with the gelled outer layer composition.
    Type: Application
    Filed: November 29, 2023
    Publication date: March 21, 2024
    Inventors: Tsuyoshi GOTO, Kazuya SHIMIZU, Hiromi ITO, Minoru MORITA, Yuji TAKAYAMA
  • Publication number: 20220189851
    Abstract: It is an object to provide a technique allowing for suppression of the height of a protrusion from the surface of a semiconductor module. A semiconductor device includes: a semiconductor module having a first groove; a Belleville washer having a recess in an outer surface and a protrusion on an inner surface; and a screw passing through the hole of the Belleville washer and the first groove of the semiconductor module to fasten the semiconductor module and an attached body. A head of the screw is accommodated in the recess of the Belleville washer, and at least portion of the protrusion of the Belleville washer is accommodated in the first groove of the semiconductor module.
    Type: Application
    Filed: June 25, 2019
    Publication date: June 16, 2022
    Applicant: Mitsubishi Electric Corporation
    Inventors: Tsuyoshi TAKAYAMA, Takaaki SHIRASAWA, Mitsunori AIKO
  • Patent number: 9133604
    Abstract: A hydraulic control device for work machine includes: a driving device that generates a driving force for traveling of the work machine; a park braking device that parks the work machine; an operating unit that is provided in a cab of the work machine and operated by an operator for driving a work device; a hydraulic brake device that generates a braking force according to operation of a brake pedal; a hydraulic lock unit that hydraulically locks the hydraulic brake device to cause the hydraulic brake device to be continuously operated; a work device drivable state judging unit that judges whether or not the work device is in a work device drivable state in which the work device can be driven; and a park brake control unit that brings the park braking device into operation when the hydraulic lock unit hydraulically locks the hydraulic brake device and the work device drivable state judging unit judges that the work device drivable state has not been established.
    Type: Grant
    Filed: January 18, 2013
    Date of Patent: September 15, 2015
    Assignee: Hitachi Construction Machinery Co., Ltd.
    Inventors: Katsuaki Kodaka, Tsuyoshi Takayama, Yukihiro Tatsuno
  • Patent number: 8933568
    Abstract: A semiconductor device according to the present invention includes: a power semiconductor element that is a semiconductor element; bonding parts provided for bonding of an upper surface and a lower surface of the semiconductor element; and metal plates bonded to the power semiconductor element from above and below through the bonding parts, wherein the bonding part includes a mesh metal body disposed between the semiconductor element and the metal plate, and a bonding member in which the mesh metal body is embedded.
    Type: Grant
    Filed: October 19, 2010
    Date of Patent: January 13, 2015
    Assignee: Mitsubishi Electric Corporation
    Inventors: Tsuyoshi Takayama, Yukio Yasuda, Hajime Kato, Kazuaki Hiyama, Taishi Sasaki, Mikio Ishihara
  • Publication number: 20140367187
    Abstract: A hydraulic control device for work machine includes: a driving device that generates a driving force for traveling of the work machine; a park braking device that parks the work machine; an operating unit that is provided in a cab of the work machine and operated by an operator for driving a work device; a hydraulic brake device that generates a braking force according to operation of a brake pedal; a hydraulic lock unit that hydraulically locks the hydraulic brake device to cause the hydraulic brake device to be continuously operated; a work device drivable state judging unit that judges whether or not the work device is in a work device drivable state in which the work device can be driven; and a park brake control unit that brings the park braking device into operation when the hydraulic lock unit hydraulically locks the hydraulic brake device and the work device drivable state judging unit judges that the work device drivable state has not been established.
    Type: Application
    Filed: January 18, 2013
    Publication date: December 18, 2014
    Applicant: Hitachi Construction Machinery Co., Ltd.
    Inventors: Katsuaki Kodaka, Tsuyoshi Takayama, Yukihiro Tatsuno
  • Patent number: 8806120
    Abstract: A decoding device includes an interface unit, a readout unit that reads out a file and recording medium management information from an external recording medium, a decoding unit that analyzes a read out file, a storage unit that stores file analysis information and recording medium management information, a determination unit that determines whether or not the recording medium management information pieces are the same when the external recording medium is connected to the interface unit, and a matching confirmation unit that, when the recording medium management information pieces are determined as being the same, determines whether or not the file contents match. When the determination results in a mismatch, the decoding unit generates new file analysis information and performs file decoding using the generated file analysis information, and when the determination results in a match, the decoding unit performs file decoding using the file analysis information in the storage unit.
    Type: Grant
    Filed: March 13, 2013
    Date of Patent: August 12, 2014
    Assignee: Panasonic Corporation
    Inventor: Tsuyoshi Takayama
  • Patent number: 8426962
    Abstract: Provided is a semiconductor device including a heat dissipating fin; an insulating sheet bonded to an upper surface of the heat dissipating fin, with a part of the upper surface being exposed; a heat spreader located on the insulating sheet; a power element located on the heat spreader; and a transfer molding resin located to cover a predetermined surface including the part of the upper surface of the heat dissipating fin, the insulating sheet, the heat spreader and the power element, wherein the upper surface of the heat dissipating fin has a protruding shape and/or recessed shape located so as to bind an edge of the insulating sheet.
    Type: Grant
    Filed: May 20, 2011
    Date of Patent: April 23, 2013
    Assignee: Mitsubishi Electric Corporation
    Inventors: Taishi Sasaki, Tsuyoshi Takayama, Mikio Ishihara
  • Publication number: 20120091573
    Abstract: Provided is a semiconductor device including a heat dissipating fin; an insulating sheet bonded to an upper surface of the heat dissipating fin, with a part of the upper surface being exposed; a heat spreader located on the insulating sheet; a power element located on the heat spreader; and a transfer molding resin located to cover a predetermined surface including the part of the upper surface of the heat dissipating fin, the insulating sheet, the heat spreader and the power element, wherein the upper surface of the heat dissipating fin has a protruding shape and/or recessed shape located so as to bind an edge of the insulating sheet.
    Type: Application
    Filed: May 20, 2011
    Publication date: April 19, 2012
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Taishi SASAKI, Tsuyoshi TAKAYAMA, Mikio ISHIHARA
  • Patent number: 8032696
    Abstract: When an external recording medium connected to an interface is removed therefrom and a new external recording medium is connected to the interface, a processor selects either first file analysis information read from a memory or second file analysis information generated based on analysis of data recorded on the new external recording medium as file analysis information to be used for decoding a file stored in the new external recording medium, and the processor makes such selection based on comparison between first recording medium management information and second recording medium management information.
    Type: Grant
    Filed: February 2, 2009
    Date of Patent: October 4, 2011
    Assignee: Panasonic Corporation
    Inventors: Tsuyoshi Takayama, Akihiro Shibata
  • Publication number: 20110221076
    Abstract: A semiconductor device according to the present invention includes: a power semiconductor element that is a semiconductor element; bonding parts provided for bonding of an upper surface and a lower surface of the semiconductor element; and metal plates bonded to the power semiconductor element from above and below through the bonding parts, wherein the bonding part includes a mesh metal body disposed between the semiconductor element and the metal plate, and a bonding member in which the mesh metal body is embedded.
    Type: Application
    Filed: October 19, 2010
    Publication date: September 15, 2011
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Tsuyoshi TAKAYAMA, Yukio Yasuda, Hajime Katou, Kazuaki Hiyama, Taishi Sasaki, Mikio Ishihara
  • Publication number: 20090204568
    Abstract: When an external recording medium connected to an interface is removed therefrom and a new external recording medium is connected to the interface, a processor selects either first file analysis information read from a memory or second file analysis information generated based on analysis of data recorded on the new external recording medium as file analysis information to be used for decoding a file stored in the new external recording medium, and the processor makes such selection based on comparison between first recording medium management information and second recording medium management information.
    Type: Application
    Filed: February 2, 2009
    Publication date: August 13, 2009
    Inventors: Tsuyoshi TAKAYAMA, Akihiro Shibata
  • Patent number: 7532141
    Abstract: In a pulse width modulation method of the present invention, a digital signal is modulated and a pulse width modulation signal is generated in a pulse width modulator by using a digital signal output unit and the pulse width modulator The pulse width modulation method includes: outputting to the pulse width modulator a first value corresponding to the input signal as a first digital signal at a first timing by the digital signal output unit; determining a limited value range based on the first value by the digital signal output unit; determining a second value corresponding to a new input signal by the digital signal output unit; judging whether or not the second value is included in the limited value range, and when the second value being judged to be included, outputting the second value to the pulse width modulator as a second digital signal, and when the second value being judged not to be included, outputting a value included in the limited value range to the pulse width modulator as the second digital s
    Type: Grant
    Filed: January 18, 2008
    Date of Patent: May 12, 2009
    Assignee: Panasonic Corporation
    Inventors: Naotake Kitahira, Tsuyoshi Takayama
  • Patent number: 7425673
    Abstract: In a tone output device 100, an oscillator 102 outputs a clock 141 that is emitted by a crystal resonator. A multiplication circuit 103 outputs a clock 142 that is generated by multiplying the clock 141. A timing control circuit 104 outputs a timing signal 150 generated based on the clock 142 for operations of a CPU 105. The CPU 105 operates in sync with the timing signal 150. The DA converter 115 operates in sync with a signal generated based on the clock 141. The timing adjustment circuit 114 detects deviation of the clock 142 from the clock 141 resulting from frequency jitter of the clock 142, and prevents occurrence of clock racing.
    Type: Grant
    Filed: October 20, 2006
    Date of Patent: September 16, 2008
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Kosei Fujisaka, Tetsuro Sugioka, Kazuki Adachi, Kiyomi Kimura, Tsuyoshi Takayama
  • Publication number: 20080180293
    Abstract: In a pulse width modulation method of the present invention, a digital signal is modulated and a pulse width modulation signal is generated in a pulse width modulator by using a digital signal output unit and the pulse width modulator The pulse width modulation method includes: outputting to the pulse width modulator a first value corresponding to the input signal as a first digital signal at a first timing by the digital signal output unit; determining a limited value range based on the first value by the digital signal output unit; determining a second value corresponding to a new input signal by the digital signal output unit; judging whether or not the second value is included in the limited value range, and when the second value being judged to be included, outputting the second value to the pulse width modulator as a second digital signal, and when the second value being judged not to be included, outputting a value included in the limited value range to the pulse width modulator as the second digital s
    Type: Application
    Filed: January 18, 2008
    Publication date: July 31, 2008
    Inventors: Naotake Kitahira, Tsuyoshi Takayama
  • Publication number: 20070101854
    Abstract: In a tone output device 100, an oscillator 102 outputs a clock 141 that is emitted by a crystal resonator. A multiplication circuit 103 outputs a clock 142 that is generated by multiplying the clock 141. A timing control circuit 104 outputs a timing signal 150 generated based on the clock 142 for operations of a CPU 105. The CPU 105 operates in sync with the timing signal 150. The DA converter 115 operates in sync with a signal generated based on the clock 141. The timing adjustment circuit 114 detects deviation of the clock 142 from the clock 141 resulting from frequency jitter of the clock 142, and prevents occurrence of clock racing.
    Type: Application
    Filed: October 20, 2006
    Publication date: May 10, 2007
    Inventors: Kosei Fujisaka, Tetsuro Sugioka, Kazuki Adachi, Kiyomi Kimura, Tsuyoshi Takayama
  • Publication number: 20060225940
    Abstract: The present invention provides a construction machine adopting a structure that assures a predetermined sound pressure level along a forward direction relative to the construction machine and allows a warning horn to be miniaturized. Warning horns 12 and 13 are mounted in the vicinity of at least either a left headlamp 9 or a right headlamp 10 provided on the left side and the right side of a vehicle body 3 of the construction machine. The warning horns 12 and 13 are housed inside a bracket 11 used to mount the headlamp 9 or 10. The plurality of warning horns 12 and 13 are disposed on a single side toward the left headlamp 9 or the right headlamp 10. Since a front attachment 7 does not block the sound generated from the warning horns 12 and 13 and thus the warning sound can travel without hindrance along the forward direction, a predetermined sound pressure level is achieved with ease along the forward direction relative to the vehicle body 3.
    Type: Application
    Filed: September 21, 2004
    Publication date: October 12, 2006
    Inventors: Hideaki Tanaka, Hiroshi Onoue, Kazuhiro Ichimura, Yoshikatsu Suzuki, Mitsugu Ojima, Hideharu Ishimaru, JUjitsu Murota, Masaki Yoshikawa, Tsuyoshi Takayama
  • Patent number: 7013401
    Abstract: The present invention provides a clock control type processor which can permit and accommodate a temporary delay in a processing operation also in a system in which processing times are not constant, and realize the accommodation while reducing the power consumption as much as possible. In this clock control type processor, a block difference detection circuit 20 detects a difference between a processing block address and a writing block address and outputs a block difference signal 105, and a clock control circuit 16 controls a clock.
    Type: Grant
    Filed: September 5, 2002
    Date of Patent: March 14, 2006
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Shiro Shimizu, Tsuyoshi Takayama, Hiroshi Yasuda
  • Publication number: 20050199999
    Abstract: One of the aspects of the present invention is to provide a semiconductor device including a semiconductor element or chip, which has a peripheral edge and a central portion and is mounted on an insulating substrate via a conductive bonding layer. At least one peripheral thermal sensor is arranged adjacent the peripheral edge on the semiconductor element, and at least one central thermal sensor is arranged adjacent the central portion on the semiconductor element.
    Type: Application
    Filed: February 25, 2005
    Publication date: September 15, 2005
    Applicant: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Takaaki Shirasawa, Tsuyoshi Takayama
  • Patent number: D692029
    Type: Grant
    Filed: April 10, 2013
    Date of Patent: October 22, 2013
    Assignee: Hitachi Construction Machinery Co., Ltd.
    Inventors: Kazuhiko Hiraoka, Masashi Nakanishi, Koji Kawasaki, Tsuyoshi Takayama