Abstract: It is an object to provide a technique allowing for suppression of the height of a protrusion from the surface of a semiconductor module. A semiconductor device includes: a semiconductor module having a first groove; a Belleville washer having a recess in an outer surface and a protrusion on an inner surface; and a screw passing through the hole of the Belleville washer and the first groove of the semiconductor module to fasten the semiconductor module and an attached body. A head of the screw is accommodated in the recess of the Belleville washer, and at least portion of the protrusion of the Belleville washer is accommodated in the first groove of the semiconductor module.

Abstract: A hydraulic control device for work machine includes: a driving device that generates a driving force for traveling of the work machine; a park braking device that parks the work machine; an operating unit that is provided in a cab of the work machine and operated by an operator for driving a work device; a hydraulic brake device that generates a braking force according to operation of a brake pedal; a hydraulic lock unit that hydraulically locks the hydraulic brake device to cause the hydraulic brake device to be continuously operated; a work device drivable state judging unit that judges whether or not the work device is in a work device drivable state in which the work device can be driven; and a park brake control unit that brings the park braking device into operation when the hydraulic lock unit hydraulically locks the hydraulic brake device and the work device drivable state judging unit judges that the work device drivable state has not been established.

Abstract: A semiconductor device according to the present invention includes: a power semiconductor element that is a semiconductor element; bonding parts provided for bonding of an upper surface and a lower surface of the semiconductor element; and metal plates bonded to the power semiconductor element from above and below through the bonding parts, wherein the bonding part includes a mesh metal body disposed between the semiconductor element and the metal plate, and a bonding member in which the mesh metal body is embedded.

Abstract: A hydraulic control device for work machine includes: a driving device that generates a driving force for traveling of the work machine; a park braking device that parks the work machine; an operating unit that is provided in a cab of the work machine and operated by an operator for driving a work device; a hydraulic brake device that generates a braking force according to operation of a brake pedal; a hydraulic lock unit that hydraulically locks the hydraulic brake device to cause the hydraulic brake device to be continuously operated; a work device drivable state judging unit that judges whether or not the work device is in a work device drivable state in which the work device can be driven; and a park brake control unit that brings the park braking device into operation when the hydraulic lock unit hydraulically locks the hydraulic brake device and the work device drivable state judging unit judges that the work device drivable state has not been established.

Abstract: A decoding device includes an interface unit, a readout unit that reads out a file and recording medium management information from an external recording medium, a decoding unit that analyzes a read out file, a storage unit that stores file analysis information and recording medium management information, a determination unit that determines whether or not the recording medium management information pieces are the same when the external recording medium is connected to the interface unit, and a matching confirmation unit that, when the recording medium management information pieces are determined as being the same, determines whether or not the file contents match. When the determination results in a mismatch, the decoding unit generates new file analysis information and performs file decoding using the generated file analysis information, and when the determination results in a match, the decoding unit performs file decoding using the file analysis information in the storage unit.

Abstract: Provided is a semiconductor device including a heat dissipating fin; an insulating sheet bonded to an upper surface of the heat dissipating fin, with a part of the upper surface being exposed; a heat spreader located on the insulating sheet; a power element located on the heat spreader; and a transfer molding resin located to cover a predetermined surface including the part of the upper surface of the heat dissipating fin, the insulating sheet, the heat spreader and the power element, wherein the upper surface of the heat dissipating fin has a protruding shape and/or recessed shape located so as to bind an edge of the insulating sheet.

Abstract: Provided is a semiconductor device including a heat dissipating fin; an insulating sheet bonded to an upper surface of the heat dissipating fin, with a part of the upper surface being exposed; a heat spreader located on the insulating sheet; a power element located on the heat spreader; and a transfer molding resin located to cover a predetermined surface including the part of the upper surface of the heat dissipating fin, the insulating sheet, the heat spreader and the power element, wherein the upper surface of the heat dissipating fin has a protruding shape and/or recessed shape located so as to bind an edge of the insulating sheet.

Abstract: When an external recording medium connected to an interface is removed therefrom and a new external recording medium is connected to the interface, a processor selects either first file analysis information read from a memory or second file analysis information generated based on analysis of data recorded on the new external recording medium as file analysis information to be used for decoding a file stored in the new external recording medium, and the processor makes such selection based on comparison between first recording medium management information and second recording medium management information.

Abstract: A semiconductor device according to the present invention includes: a power semiconductor element that is a semiconductor element; bonding parts provided for bonding of an upper surface and a lower surface of the semiconductor element; and metal plates bonded to the power semiconductor element from above and below through the bonding parts, wherein the bonding part includes a mesh metal body disposed between the semiconductor element and the metal plate, and a bonding member in which the mesh metal body is embedded.

Abstract: When an external recording medium connected to an interface is removed therefrom and a new external recording medium is connected to the interface, a processor selects either first file analysis information read from a memory or second file analysis information generated based on analysis of data recorded on the new external recording medium as file analysis information to be used for decoding a file stored in the new external recording medium, and the processor makes such selection based on comparison between first recording medium management information and second recording medium management information.

Abstract: In a pulse width modulation method of the present invention, a digital signal is modulated and a pulse width modulation signal is generated in a pulse width modulator by using a digital signal output unit and the pulse width modulator The pulse width modulation method includes: outputting to the pulse width modulator a first value corresponding to the input signal as a first digital signal at a first timing by the digital signal output unit; determining a limited value range based on the first value by the digital signal output unit; determining a second value corresponding to a new input signal by the digital signal output unit; judging whether or not the second value is included in the limited value range, and when the second value being judged to be included, outputting the second value to the pulse width modulator as a second digital signal, and when the second value being judged not to be included, outputting a value included in the limited value range to the pulse width modulator as the second digital s

Abstract: In a tone output device 100, an oscillator 102 outputs a clock 141 that is emitted by a crystal resonator. A multiplication circuit 103 outputs a clock 142 that is generated by multiplying the clock 141. A timing control circuit 104 outputs a timing signal 150 generated based on the clock 142 for operations of a CPU 105. The CPU 105 operates in sync with the timing signal 150. The DA converter 115 operates in sync with a signal generated based on the clock 141. The timing adjustment circuit 114 detects deviation of the clock 142 from the clock 141 resulting from frequency jitter of the clock 142, and prevents occurrence of clock racing.

Abstract: In a pulse width modulation method of the present invention, a digital signal is modulated and a pulse width modulation signal is generated in a pulse width modulator by using a digital signal output unit and the pulse width modulator The pulse width modulation method includes: outputting to the pulse width modulator a first value corresponding to the input signal as a first digital signal at a first timing by the digital signal output unit; determining a limited value range based on the first value by the digital signal output unit; determining a second value corresponding to a new input signal by the digital signal output unit; judging whether or not the second value is included in the limited value range, and when the second value being judged to be included, outputting the second value to the pulse width modulator as a second digital signal, and when the second value being judged not to be included, outputting a value included in the limited value range to the pulse width modulator as the second digital s

Abstract: In a tone output device 100, an oscillator 102 outputs a clock 141 that is emitted by a crystal resonator. A multiplication circuit 103 outputs a clock 142 that is generated by multiplying the clock 141. A timing control circuit 104 outputs a timing signal 150 generated based on the clock 142 for operations of a CPU 105. The CPU 105 operates in sync with the timing signal 150. The DA converter 115 operates in sync with a signal generated based on the clock 141. The timing adjustment circuit 114 detects deviation of the clock 142 from the clock 141 resulting from frequency jitter of the clock 142, and prevents occurrence of clock racing.

Abstract: The present invention provides a construction machine adopting a structure that assures a predetermined sound pressure level along a forward direction relative to the construction machine and allows a warning horn to be miniaturized. Warning horns 12 and 13 are mounted in the vicinity of at least either a left headlamp 9 or a right headlamp 10 provided on the left side and the right side of a vehicle body 3 of the construction machine. The warning horns 12 and 13 are housed inside a bracket 11 used to mount the headlamp 9 or 10. The plurality of warning horns 12 and 13 are disposed on a single side toward the left headlamp 9 or the right headlamp 10. Since a front attachment 7 does not block the sound generated from the warning horns 12 and 13 and thus the warning sound can travel without hindrance along the forward direction, a predetermined sound pressure level is achieved with ease along the forward direction relative to the vehicle body 3.

Abstract: The present invention provides a clock control type processor which can permit and accommodate a temporary delay in a processing operation also in a system in which processing times are not constant, and realize the accommodation while reducing the power consumption as much as possible. In this clock control type processor, a block difference detection circuit 20 detects a difference between a processing block address and a writing block address and outputs a block difference signal 105, and a clock control circuit 16 controls a clock.

Abstract: One of the aspects of the present invention is to provide a semiconductor device including a semiconductor element or chip, which has a peripheral edge and a central portion and is mounted on an insulating substrate via a conductive bonding layer. At least one peripheral thermal sensor is arranged adjacent the peripheral edge on the semiconductor element, and at least one central thermal sensor is arranged adjacent the central portion on the semiconductor element.

Abstract: In a circuit having MOS transistors connected in series, a surge voltage that occurs during off periods is reduced, while suppressing an increase in switching loss at turning off of the MOS transistors. When a first power MOSFET (1) is turned off and then a second power MOSFET (2) is turned on after that according to predetermined timing, the first power MOSFET (1) is temporarily placed in an on state for a predetermined time period synchronized with that predetermined timing. On the other hand, when the second power MOSFET (2) is turned off and then the first power MOSFET (1) is turned on after that according to predetermined timing, the second power MOSFET (2) is temporarily placed in an on state for a predetermined time period synchronized with that predetermined timing.

Abstract: In a circuit having MOS transistors connected in series, a surge voltage that occurs during off periods is reduced, while suppressing an increase in switching loss at turning off of the MOS transistors. When a first power MOSFET (1) is turned off and then a second power MOSFET (2) is turned on after that according to predetermined timing, the first power MOSFET (1) is temporarily placed in an on state for a predetermined time period synchronized with that predetermined timing. On the other hand, when the second power MOSFET (2) is turned off and then the first power MOSFET (1) is turned on after that according to predetermined timing, the second power MOSFET (2) is temporarily placed in an on state for a predetermined time period synchronized with that predetermined timing.