Patents by Inventor Tsuyoshi Tamaru

Tsuyoshi Tamaru has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190244855
    Abstract: The reliability of wirings, each of which includes a main conductive film containing copper as a primary component, is improved. On an insulating film including the upper surface of a wiring serving as a lower layer wiring, an insulating film formed of a silicon carbonitride film having excellent barrier properties to copper is formed; on the insulating film, an insulating film formed of a silicon carbide film having excellent adhesiveness to a low dielectric constant material film is formed; on the insulating film, an insulating film formed of a low dielectric constant material as an interlayer insulating film is formed; and thereafter a wiring as an upper layer wiring is formed.
    Type: Application
    Filed: April 16, 2019
    Publication date: August 8, 2019
    Inventors: Junji NOGUCHI, Takayuki OSHIMA, Noriko MIURA, Kensuke ISHIKAWA, Tomio IWASAKI, Kiyomi KATSUYAMA, Tatsuyuki SAITO, Tsuyoshi TAMARU, Hizuru YAMAGUCHI
  • Patent number: 10304726
    Abstract: The reliability of wirings, each of which includes a main conductive film containing copper as a primary component, is improved. On an insulating film including the upper surface of a wiring serving as a lower layer wiring, an insulating film formed of a silicon carbonitride film having excellent barrier properties to copper is formed; on the insulating film, an insulating film formed of a silicon carbide film having excellent adhesiveness to a low dielectric constant material film is formed; on the insulating film, an insulating film formed of a low dielectric constant material as an interlayer insulating film is formed; and thereafter a wiring as an upper layer wiring is formed.
    Type: Grant
    Filed: September 21, 2018
    Date of Patent: May 28, 2019
    Assignee: Renesas Electronics Corporation
    Inventors: Junji Noguchi, Takayuki Oshima, Noriko Miura, Kensuke Ishikawa, Tomio Iwasaki, Kiyomi Katsuyama, Tatsuyuki Saito, Tsuyoshi Tamaru, Hizuru Yamaguchi
  • Publication number: 20190035678
    Abstract: The reliability of wirings, each of which includes a main conductive film containing copper as a primary component, is improved. On an insulating film including the upper surface of a wiring serving as a lower layer wiring, an insulating film formed of a silicon carbonitride film having excellent barrier properties to copper is formed; on the insulating film, an insulating film formed of a silicon carbide film having excellent adhesiveness to a low dielectric constant material film is formed; on the insulating film, an insulating film formed of a low dielectric constant material as an interlayer insulating film is formed; and thereafter a wiring as an upper layer wiring is formed.
    Type: Application
    Filed: September 21, 2018
    Publication date: January 31, 2019
    Inventors: Junji NOGUCHI, Takayuki OSHIMA, Noriko MIURA, Kensuke ISHIKAWA, Tomio IWASAKI, Kiyomi KATSUYAMA, Tatsuyuki SAITO, Tsuyoshi TAMARU, Hizuru YAMAGUCHI
  • Patent number: 10121693
    Abstract: The reliability of wirings, each of which includes a main conductive film containing copper as a primary component, is improved. On an insulating film including the upper surface of a wiring serving as a lower layer wiring, an insulating film formed of a silicon carbonitride film having excellent barrier properties to copper is formed; on the insulating film, an insulating film formed of a silicon carbide film having excellent adhesiveness to a low dielectric constant material film is formed; on the insulating film, an insulating film formed of a low dielectric constant material as an interlayer insulating film is formed; and thereafter a wiring as an upper layer wiring is formed.
    Type: Grant
    Filed: October 9, 2017
    Date of Patent: November 6, 2018
    Assignee: Renesas Electronics Corporation
    Inventors: Junji Noguchi, Takayuki Oshima, Noriko Miura, Kensuke Ishikawa, Tomio Iwasaki, Kiyomi Katsuyama, Tatsuyuki Saito, Tsuyoshi Tamaru, Hizuru Yamaguchi
  • Patent number: 10031453
    Abstract: A fixing apparatus includes the following. A heating unit includes an outer surface driven to rotate and heats a sheet on which color material is transferred. A reflecting unit reflects heat emitted from the heating unit. The reflecting unit further includes, a covering unit which covers at least a portion of the outer surface of the heating unit so that there is a predetermined space; and a movable unit which is provided in the covering unit and which can be switched between a first position and a second position in which air in the space can flow more easily than the first position. The fixing apparatus also includes, a switching unit which switches the movable unit between the first position and the second position; and a controller which controls the switching unit.
    Type: Grant
    Filed: October 25, 2016
    Date of Patent: July 24, 2018
    Assignee: KONICA MINOLTA, INC.
    Inventors: Miho Yamano, Hiroyuki Maeda, Dai Suwama, Midori Shimomura, Tsuyoshi Tamaru
  • Publication number: 20180047620
    Abstract: The reliability of wirings, each of which includes a main conductive film containing copper as a primary component, is improved. On an insulating film including the upper surface of a wiring serving as a lower layer wiring, an insulating film formed of a silicon carbonitride film having excellent barrier properties to copper is formed; on the insulating film, an insulating film formed of a silicon carbide film having excellent adhesiveness to a low dielectric constant material film is formed; on the insulating film, an insulating film formed of a low dielectric constant material as an interlayer insulating film is formed; and thereafter a wiring as an upper layer wiring is formed.
    Type: Application
    Filed: October 9, 2017
    Publication date: February 15, 2018
    Inventors: Junji NOGUCHI, Takayuki OSHIMA, Noriko MIURA, Kensuke ISHIKAWA, Tomio IWASAKI, Kiyomi KATSUYAMA, Tatsuyuki SAITO, Tsuyoshi TAMARU, Hizuru YAMAGUCHI
  • Patent number: 9818639
    Abstract: The reliability of wirings, each of which includes a main conductive film containing copper as a primary component, is improved. On an insulating film including the upper surface of a wiring serving as a lower layer wiring, an insulating film formed of a silicon carbonitride film having excellent barrier properties to copper is formed; on the insulating film, an insulating film formed of a silicon carbide film having excellent adhesiveness to a low dielectric constant material film is formed; on the insulating film, an insulating film formed of a low dielectric constant material as an interlayer insulating film is formed; and thereafter a wiring as an upper layer wiring is formed.
    Type: Grant
    Filed: March 27, 2017
    Date of Patent: November 14, 2017
    Assignee: Renesas Electronics Corporation
    Inventors: Junji Noguchi, Takayuki Oshima, Noriko Miura, Kensuke Ishikawa, Tomio Iwasaki, Kiyomi Katsuyama, Tatsuyuki Saito, Tsuyoshi Tamaru, Hizuru Yamaguchi
  • Publication number: 20170200637
    Abstract: The reliability of wirings, each of which includes a main conductive film containing copper as a primary component, is improved. On an insulating film including the upper surface of a wiring serving as a lower layer wiring, an insulating film formed of a silicon carbonitride film having excellent barrier properties to copper is formed; on the insulating film, an insulating film formed of a silicon carbide film having excellent adhesiveness to a low dielectric constant material film is formed; on the insulating film, an insulating film formed of a low dielectric constant material as an interlayer insulating film is formed; and thereafter a wiring as an upper layer wiring is formed.
    Type: Application
    Filed: March 27, 2017
    Publication date: July 13, 2017
    Inventors: Junji NOGUCHI, Takayuki OSHIMA, Noriko MIURA, Kensuke ISHIKAWA, Tomio IWASAKI, Kiyomi KATSUYAMA, Tatsuyuki SAITO, Tsuyoshi TAMARU, Hizuru YAMAGUCHI
  • Patent number: 9659867
    Abstract: The reliability of wirings, each of which includes a main conductive film containing copper as a primary component, is improved. On an insulating film including the upper surface of a wiring serving as a lower layer wiring, an insulating film formed of a silicon carbonitride film having excellent barrier properties to copper is formed; on the insulating film, an insulating film formed of a silicon carbide film having excellent adhesiveness to a low dielectric constant material film is formed; on the insulating film, an insulating film formed of a low dielectric constant material as an interlayer insulating film is formed; and thereafter a wiring as an upper layer wiring is formed.
    Type: Grant
    Filed: September 22, 2016
    Date of Patent: May 23, 2017
    Assignee: Renesas Electronics Corporation
    Inventors: Junji Noguchi, Takayuki Oshima, Noriko Miura, Kensuke Ishikawa, Tomio Iwasaki, Kiyomi Katsuyama, Tatsuyuki Saito, Tsuyoshi Tamaru, Hizuru Yamaguchi
  • Publication number: 20170123355
    Abstract: A fixing apparatus includes the following. A heating unit includes an outer surface driven to rotate and heats a sheet on which color material is transferred. A reflecting unit reflects heat emitted from the heating unit. The reflecting unit further includes, a covering unit which covers at least a portion of the outer surface of the heating unit so that there is a predetermined space; and a movable unit which is provided in the covering unit and which can be switched between a first position and a second position in which air in the space can flow more easily than the first position. The fixing apparatus also includes, a switching unit which switches the movable unit between the first position and the second position; and a controller which controls the switching unit.
    Type: Application
    Filed: October 25, 2016
    Publication date: May 4, 2017
    Applicant: Konica Minolta, Inc.
    Inventors: Miho Yamano, Hiroyuki Maeda, Dai Suwama, Midori Shimomura, Tsuyoshi Tamaru
  • Publication number: 20170011994
    Abstract: The reliability of wirings, each of which includes a main conductive film containing copper as a primary component, is improved. On an insulating film including the upper surface of a wiring serving as a lower layer wiring, an insulating film formed of a silicon carbonitride film having excellent barrier properties to copper is formed; on the insulating film, an insulating film formed of a silicon carbide film having excellent adhesiveness to a low dielectric constant material film is formed; on the insulating film, an insulating film formed of a low dielectric constant material as an interlayer insulating film is formed; and thereafter a wiring as an upper layer wiring is formed.
    Type: Application
    Filed: September 22, 2016
    Publication date: January 12, 2017
    Inventors: Junji NOGUCHI, Takayuki OSHIMA, Noriko MIURA, Kensuke ISHIKAWA, Tomio IWASAKI, Kiyomi KATSUYAMA, Tatsuyuki SAITO, Tsuyoshi TAMARU, Hizuru YAMAGUCHI
  • Patent number: 9507300
    Abstract: A fixing device having: a heating unit; a first rotating member and rotating in a first rotational direction; a second rotating member contacting the first rotating member and thereby forming a nip through which a printing medium passes, wherein the second rotating member rotates in a second rotational direction opposite to the first rotational direction; a reflective member provided around the first rotating member and having a reflection surface provided so as to face the first rotating member; and an inhibitory member inhibiting air in a space between the reflective member and the first rotating member from flowing out through a first gap between a downstream end of the reflective member in the first rotational direction and a closest portion of the first rotating member to the downstream end of the reflective member, wherein the inhibitory member overlaps with a part of the first gap.
    Type: Grant
    Filed: March 20, 2015
    Date of Patent: November 29, 2016
    Assignee: KONICA MINOLTA, INC.
    Inventors: Toru Hayase, Mamoru Fukaya, Naoki Kataoka, Tsuyoshi Tamaru
  • Patent number: 9490213
    Abstract: The reliability of wirings, each of which includes a main conductive film containing copper as a primary component, is improved. On an insulating film including the upper surface of a wiring serving as a lower layer wiring, an insulating film formed of a silicon carbonitride film having excellent barrier properties to copper is formed; on the insulating film, an insulating film formed of a silicon carbide film having excellent adhesiveness to a low dielectric constant material film is formed; on the insulating film, an insulating film formed of a low dielectric constant material as an interlayer insulating film is formed; and thereafter a wiring as an upper layer wiring is formed.
    Type: Grant
    Filed: May 1, 2015
    Date of Patent: November 8, 2016
    Assignee: Renesas Electronics Corporation
    Inventors: Junji Noguchi, Takayuki Oshima, Noriko Miura, Kensuke Ishikawa, Tomio Iwasaki, Kiyomi Katsuyama, Tatsuyuki Saito, Tsuyoshi Tamaru, Hizuru Yamaguchi
  • Patent number: 9207599
    Abstract: A fixing device having: a first rotating member rotating in a first rotational direction; a second rotating member contacting the first rotating member and thereby forming a nip through which a printing medium passes, wherein the second rotating member rotates in a second rotational direction opposite to the first rotational direction; a heating unit heating the first rotating member in a heating section not overlapping with the nip when viewed in a plan view in the predetermined direction; and a first reflective member facing at least a part of a portion of the first rotating member that is located on a downstream side in the first rotational direction relative to the heating section but on an upstream side in the first rotational direction relative to the nip, the first reflective member having a reflection surface on the side facing the first rotating member.
    Type: Grant
    Filed: March 20, 2015
    Date of Patent: December 8, 2015
    Assignee: KONICA MINOLTA, INC.
    Inventors: Toru Hayase, Mamoru Fukaya, Naoki Kataoka, Tsuyoshi Tamaru
  • Publication number: 20150268606
    Abstract: A fixing device having: a first rotating member rotating in a first rotational direction; a second rotating member contacting the first rotating member and thereby forming a nip through which a printing medium passes, wherein the second rotating member rotates in a second rotational direction opposite to the first rotational direction; a heating unit heating the first rotating member in a heating section not overlapping with the nip when viewed in a plan view in the predetermined direction; and a first reflective member facing at least a part of a portion of the first rotating member that is located on a downstream side in the first rotational direction relative to the heating section but on an upstream side in the first rotational direction relative to the nip, the first reflective member having a reflection surface on the side facing the first rotating member.
    Type: Application
    Filed: March 20, 2015
    Publication date: September 24, 2015
    Applicant: Konica Minolta, Inc.
    Inventors: Toru HAYASE, Mamoru FUKAYA, Naoki KATAOKA, Tsuyoshi TAMARU
  • Publication number: 20150268607
    Abstract: A fixing device having: a heating unit; a first rotating member and rotating in a first rotational direction; a second rotating member contacting the first rotating member and thereby forming a nip through which a printing medium passes, wherein the second rotating member rotates in a second rotational direction opposite to the first rotational direction; a reflective member provided around the first rotating member and having a reflection surface provided so as to face the first rotating member; and an inhibitory member inhibiting air in a space between the reflective member and the first rotating member from flowing out through a first gap between a downstream end of the reflective member in the first rotational direction and a closest portion of the first rotating member to the downstream end of the reflective member, wherein the inhibitory member overlaps with a part of the first gap.
    Type: Application
    Filed: March 20, 2015
    Publication date: September 24, 2015
    Applicant: KONICA MINOLTA, INC.
    Inventors: Toru HAYASE, Mamoru FUKAYA, Naoki KATAOKA, Tsuyoshi TAMARU
  • Publication number: 20150235962
    Abstract: The reliability of wirings, each of which includes a main conductive film containing copper as a primary component, is improved. On an insulating film including the upper surface of a wiring serving as a lower layer wiring, an insulating film formed of a silicon carbonitride film having excellent barrier properties to copper is formed; on the insulating film, an insulating film formed of a silicon carbide film having excellent adhesiveness to a low dielectric constant material film is formed; on the insulating film, an insulating film formed of a low dielectric constant material as an interlayer insulating film is formed; and thereafter a wiring as an upper layer wiring is formed.
    Type: Application
    Filed: May 1, 2015
    Publication date: August 20, 2015
    Inventors: Junji NOGUCHI, Takayuki OSHIMA, Noriko MIURA, Kensuke ISHIKAWA, Tomio IWASAKI, Kiyomi KATSUYAMA, Tatsuyuki SAITO, Tsuyoshi TAMARU, Hizuru YAMAGUCHI
  • Patent number: 9064870
    Abstract: The reliability of wirings, each of which includes a main conductive film containing copper as a primary component, is improved. On an insulating film including the upper surface of a wiring serving as a lower layer wiring, an insulating film formed of a silicon carbonitride film having excellent barrier properties to copper is formed; on the insulating film, an insulating film formed of a silicon carbide film having excellent adhesiveness to a low dielectric constant material film is formed; on the insulating film, an insulating film formed of a low dielectric constant material as an interlayer insulating film is formed; and thereafter a wiring as an upper layer wiring is formed.
    Type: Grant
    Filed: June 30, 2014
    Date of Patent: June 23, 2015
    Assignee: Renesas Electronics Corporation
    Inventors: Junji Noguchi, Takayuki Oshima, Noriko Miura, Kensuke Ishikawa, Tomio Iwasaki, Kiyomi Katsuyama, Tatsuyuki Saito, Tsuyoshi Tamaru, Hizuru Yamaguchi
  • Publication number: 20140312499
    Abstract: The reliability of wirings, each of which includes a main conductive film containing copper as a primary component, is improved. On an insulating film including the upper surface of a wiring serving as a lower layer wiring, an insulating film formed of a silicon carbonitride film having excellent barrier properties to copper is formed; on the insulating film, an insulating film formed of a silicon carbide film having excellent adhesiveness to a low dielectric constant material film is formed; on the insulating film, an insulating film formed of a low dielectric constant material as an interlayer insulating film is formed; and thereafter a wiring as an upper layer wiring is formed.
    Type: Application
    Filed: June 30, 2014
    Publication date: October 23, 2014
    Applicant: Renesas Electronics Corporation
    Inventors: Junji NOGUCHI, Takayuki OSHIMA, Noriko MIURA, Kensuke ISHIKAWA, Tomio IWASAKI, Kiyomi KATSUYAMA, Tatsuyuki SAITO, Tsuyoshi TAMARU, Hizuru YAMAGUCHI
  • Patent number: 8810034
    Abstract: The reliability of wirings, each of which includes a main conductive film containing copper as a primary component, is improved. On an insulating film including the upper surface of a wiring serving as a lower layer wiring, an insulating film formed of a silicon carbonitride film having excellent barrier properties to copper is formed; on the insulating film, an insulating film formed of a silicon carbide film having excellent adhesiveness to a low dielectric constant material film is formed; on the insulating film, an insulating film formed of a low dielectric constant material as an interlayer insulating film is formed; and thereafter a wiring as an upper layer wiring is formed.
    Type: Grant
    Filed: December 3, 2013
    Date of Patent: August 19, 2014
    Assignee: Renesas Electronics Corporation
    Inventors: Junji Noguchi, Takayuki Oshima, Noriko Miura, Kensuke Ishikawa, Tomio Iwasaki, Kiyomi Katsuyama, Tatsuyuki Saito, Tsuyoshi Tamaru, Hizuru Yamaguchi