Abstract: Provided is a semiconductor device including electronic components electrically joined to each other via a metal nanoparticle sintered layer, wherein the metal nanoparticle sintered layer has formed therein a metal diffusion region in which a metal constituting a metallization layer formed on a surface of one of the electronic components is diffused, and in which the metal is present in an amount of 10 mass % or more and less than 100 mass % according to TEM-EDS analysis, and wherein the metal diffusion region has a thickness smaller than a thickness of the metallization layer.

Abstract: Provided is a semiconductor device including electronic components electrically joined to each other via a metal nanoparticle sintered layer, wherein the metal nanoparticle sintered layer has formed therein a metal diffusion region in which a metal constituting a metallization layer formed on a surface of one of the electronic components is diffused, and in which the metal is present in an amount of 10 mass % or more and less than 100 mass % according to TEM-EDS analysis, and wherein the metal diffusion region has a thickness smaller than a thickness of the metallization layer.

Abstract: A method of predicting deformation of a resin molded article includes: a step of acquiring resin temperature distribution data at the time of forming the resin molded article; a step of creating crystallinity distribution data, corresponding to the resin temperature distribution data, based on a first correlation between a temperature and crystallinity of the resin molded article, which is obtained using an actually measured crystallinity of the resin molded article; a step of creating mechanical property value distribution data, corresponding to the crystallinity distribution data, based on a second correlation between the crystallinity and the mechanical property value of the resin molded article, which is obtained from the actually measured crystallinity and the mechanical property value of the resin molded article; and a step of predicting the deformation of the resin molded article using the resin temperature distribution data and the mechanical property value distribution data.

Abstract: A process is for laser-welding resinous members, and includes the steps of overlapping a transparent resinous member on an absorptive resinous material, and irradiating the transparent resinous member with a laser beam, thereby welding an interface between the transparent resinous member and the absorptive resinous member as a strip shape, wherein the energy of the laser beam acting on a side of a major-curvature-radius curved part of the strip-shaped welded interface and the energy of the laser beam acting on a side of a minor-curvature-radius curved part thereof are averaged.

Abstract: A valve gate of an injection valve includes a center pin whose end portion is exposed to a cavity, a valve main body accommodating the center pin, a valve tip surrounding an outer circumferential portion of the end portion of the center pin and fixed at an inner circumferential portion of the valve main body, a sleeve pin provided so as to be slidable along the center pin, a reservoir portion formed between the valve main body and the sleeve pin and accommodating a molten resin, and a heater surrounding the reservoir portion, wherein the sleeve pin is displaceable between a position where an opened state is established and a position where a closed state is established, and an end portion of the heater facing the cavity is positioned closer to the cavity than an end portion of the reservoir portion facing the cavity when the closed state is established.

Abstract: A valve gate of an injection valve includes a center pin whose end portion is exposed to a cavity, a valve main body accommodating the center pin, a valve tip surrounding an outer circumferential portion of the end portion of the center pin and fixed at an inner circumferential portion of the valve main body, a sleeve pin provided so as to be slidable along the center pin, a reservoir portion formed between the valve main body and the sleeve pin and accommodating a molten resin, and a heater surrounding the reservoir portion, wherein the sleeve pin is displaceable between a position where an opened state is-established and a position where a closed state is established, and an end portion of the heater facing the cavity is positioned closer to the cavity than an end portion of the reservoir portion facing the cavity when the closed state is established.

Abstract: A process is for laser-welding resinous members, and includes the steps of overlapping a transparent resinous member on an absorptive resinous material, and irradiating the transparent resinous member with a laser beam, thereby welding an interface between the transparent resinous member and the absorptive resinous member as a strip shape, wherein the energy of the laser beam acting on a side of a major-curvature-radius curved part of the strip-shaped welded interface and the energy of the laser beam acting on a side of a minor-curvature-radius curved part thereof are averaged.

Abstract: A process is for laser-welding resinous members, and includes the steps of overlapping a transparent resinous member on an absorptive resinous material, and irradiating the transparent resinous member with a laser beam, thereby welding an interface between the transparent resinous member and the absorptive resinous member as a strip shape, wherein the energy of the laser beam acting on a side of a major-curvature-radius curved part of the strip-shaped welded interface and the energy of the laser beam acting on a side of a minor-curvature-radius curved part thereof are averaged.

Abstract: A method for connecting a metal material with an electric conductive resin material including the steps of heating the connecting portion of the electric conductive resin material with the metal material to a temperature equal to or more than a softening point of the connecting portion and depressing the metal material to the heated portion for melting joint.

Abstract: A process is for laser-welding resinous members, and includes the steps of overlapping a transparent resinous member on an absorptive resinous material, and irradiating the transparent resinous member with a laser beam, thereby welding an interface between the transparent resinous member and the absorptive resinous member as a strip shape, wherein the energy of the laser beam acting on a side of a major-curvature-radius curved part of the strip-shaped welded interface and the energy of the laser beam acting on a side of a minor-curvature-radius curved part thereof are averaged.

Abstract: A method for connecting a metal material with an electric conductive resin material including the steps of heating the connecting portion of the electric conductive resin material with the metal material to a temperature equal to or more than a softening point of the connecting portion and depressing the metal material to the heated portion for melting joint.

Abstract: A roof drip molding having a resin layer of varying width on the surface of a supporting member having a varying width. The resin material is adhesively applied to the surface of the supporting member of varying width.

Abstract: Provided are a conductive resin composition having little negative impact on the environment, a resin molding which includes conductive parts of the conductive resin composition and insulating parts, and their methods of production. The production costs for the resin molding are low. The conductive resin composition is formed by kneading a thermoplastic or thermosetting resin with a low melting point alloy, wherein the low melting point alloy is moldable with the resin and consists essentially of tin and is free of lead. An insulating body is formed through primary molding of a thermoplastic or thermosetting resin, and is integrated with conductive parts of the conductive resin composition through secondary molding; or alternatively, conductive parts are formed through primary molding of the conductive resin composition and an insulating body is formed while being integrated with the conductive parts through secondary molding.

Abstract: Provided are a conductive resin composition having little negative impact on the environment, a resin molding which includes conductive parts of the conductive resin composition and insulating parts, and their methods of production. The production costs for the resin molding are low. The conductive resin composition is formed by kneading a thermoplastic or thermosetting resin with a low melting point alloy, wherein the low melting point alloy is moldable with the resin and consists essentially of tin and is free of lead. An insulating body is formed through primary molding of a thermoplastic or thermosetting resin, and is integrated with conductive parts of the conductive resin composition through secondary molding; or alternatively, conductive parts are formed through primary molding of the conductive resin composition and an insulating body is formed while being integrated with the conductive parts through secondary molding.

Abstract: An apparatus for applying a resin layer of varying width to a surface portion of a supporting member having a varying width includes a stationary die in which is provided a cavity, a resin passage in the cavity, and an injector disposed at the outlet of the resin passage. An extruder extrudes resin material into the cavity via the resin passage. A sliding shutter mechanism is disposed in the cavity for varying the width-wise extent over which the resin is applied to the surface portion of the supporting member to permit application of a resin layer of varying width to the surface portion of the supporting member. A control unit is connected to the extruder and the shutter mechanism for controlling extrusion of the resin and the position of the shutter within the cavity.