Abstract: A method for producing a laminated ceramic electronic component includes the steps of preparing ceramic green sheets, transferring an inner conductor pattern layer and a lead conductor pattern layer formed on a support on the ceramic green sheets to form the inner conductor and the lead conductor on the ceramic green sheets, laminating the ceramic green sheets to cover the inner conductor and the lead conductor, and firing the ceramic laminated product. In the step of forming the inner conductor and the lead conductor, the inner conductor pattern layer is transferred onto the ceramic green sheet a plurality of times so as to overlap each other, thereby forming the inner conductor, and the lead conductor pattern layer is transferred onto the ceramic green sheet, wherein the number of times of the transferring is less than the number of times of the transferring of the inner conductor pattern layer.

Abstract: A laminated ceramic electronic component includes a plurality of conductor pattern layers for a coil arranged to overlap each other to form substantially U-shaped conductors for the coil. The conductors for the coil are electrically connected in series through via holes for inner layer connection provided in ceramic green sheets to form a spiral coil. A plurality of lead conductor pattern layers also overlaps each other to form lead conductors. One lead conductor pattern layer is disposed per a predetermined number of conductor pattern layers for the coil. An end of each lead conductor pattern layer is in contact with the corresponding conductor pattern layer for the coil. In other words, the thickness of the lead conductors is less than the thickness of the conductors for the coil.

Abstract: A laminated ceramic electronic component includes a plurality of conductor pattern layers for a coil arranged to overlap each other to form substantially U-shaped conductors for the coil. The conductors for the coil are electrically connected in series through via holes for inner layer connection provided in ceramic green sheets to form a spiral coil. A plurality of leading conductor pattern layers also overlaps each other to form leading conductors. One leading conductor pattern layer is disposed per a predetermined number of conductor pattern layers for the coil. An end of each leading conductor pattern layer is in contact with the corresponding conductor pattern layer for the coil. In other words, the thickness of the lead conductors is less than the thickness of the conductors for the coil.

Abstract: A laminated ceramic electronic component includes a plurality of conductor pattern layers for a coil arranged to overlap each other to form substantially U-shaped conductors for the coil. The conductors for the coil are electrically connected in series through via holes for inner layer connection provided in ceramic green sheets to form a spiral coil. A plurality of lead conductor pattern layers also overlaps each other to form lead conductors. One lead conductor pattern layer is disposed per a predetermined number of conductor pattern layers for the coil. An end of each lead conductor pattern layer is in contact with the corresponding conductor pattern layer for the coil. In other words, the thickness of the lead conductors is less than the thickness of the conductors for the coil.

Abstract: A manufacturing method for a laminated ceramic electronic component is performed such that the thickness of the inner electrode is greatly increased, delamination does not occur, and reliability is superior. The manufacturing method for the laminated ceramic electronic component includes a process in which a green sheet including the inner electrode paste layer and the ceramic paste layer, is provided on a carrier sheet such that the inner electrode paste layer penetrates the green sheet from the top surface to the bottom surface thereof, and a process, in which laminates of the green sheet and the carrier film are adhered by pressing, and thereafter the carrier film is peeled off, are repeated to obtain the ceramic laminate, and the ceramic laminate is fired after pressing in the direction of the thickness to obtain the ceramic sintered body.

Abstract: A method of manufacturing a laminated ceramic electronic component includes the steps of forming a conductor having a large thickness, which includes a plurality of first coil conductor layers and a plurality of second conductor layers, transferring the plurality of first coil conductor layers, which are each provided on a carrier film, onto the upper surface of a ceramic green sheet, and transferring the plurality of second coil conductor layers, which are each held on a carrier film, onto the lower surface of the same ceramic green sheet.

Abstract: A method of producing a laminated ceramic electronic component results in an increased thickness of an internal electrode, reduced delamination, and produces a laminated ceramic electronic component having outstanding reliability. The method of producing a laminated ceramic electronic component includes the step of forming a green sheet supported on a carrier film and having an internal electrode paste layer configured to pass through the green sheet from the upper surface to the lower surface thereof, and a ceramic paste layer, the two layers being provided with a space therebetween, and the step of repeating the step of press-bonding the laminate of the green sheet and the carrier film, and separating the carrier film to obtain a ceramic laminate, pressing the ceramic laminate in the thickness direction, and then firing the laminate to obtain a ceramic sintered body.

Abstract: A method of producing a laminated ceramic electronic component results in an increased thickness of an internal electrode, reduced delamination, and produces a laminated ceramic electronic component having outstanding reliability. The method of producing a laminated ceramic electronic component includes the step of forming a green sheet supported on a carrier film and having an internal electrode paste layer configured to pass through the green sheet from the upper surface to the lower surface thereof, and a ceramic paste layer, the two layers being provided with a space therebetween, and the step of repeating the step of press-bonding the laminate of the green sheet and the carrier film, and separating the carrier film to obtain a ceramic laminate, pressing the ceramic laminate in the thickness direction, and then firing the laminate to obtain a ceramic sintered body.

Abstract: A method of producing a laminated ceramic electronic component results in an increased thickness of an internal electrode, reduced delamination, and produces a laminated ceramic electronic component having outstanding reliability. The method of producing a laminated ceramic electronic component includes the step of forming a green sheet supported on a carrier film and having an internal electrode paste layer configured to pass through the green sheet from the upper surface to the lower surface thereof, and a ceramic paste layer, the two layers being provided with a space therebetween, and the step of repeating the step of press-bonding the laminate of the green sheet and the carrier film, and separating the carrier film to obtain a ceramic laminate, pressing the ceramic laminate in the thickness direction, and then firing the laminate to obtain a ceramic sintered body.

Abstract: A laminated inductor includes a sintered ceramic body made of a ceramic material and a coil conductor disposed inside of the ceramic body. The coil conductor has a plurality of conductor patterns and via-hole electrodes electrically connecting the conductor patterns which are located at different vertical positions in the ceramic body. A low dielectric constant material layer having a lower dielectric constant than that of the ceramic material of the sintered ceramic body is interposed between adjacent conductor patterns.

Abstract: A method of manufacturing a laminated ceramic electronic component includes the steps of forming a conductor having a large thickness, which includes a plurality of first coil conductor layers and a plurality of second conductor layers, transferring the plurality of first coil conductor layers, which are each provided on a carrier film, onto the upper surface of a ceramic green sheet, and transferring the plurality of second coil conductor layers, which are each held on a carrier film, onto the lower surface of the same ceramic green sheet.

Abstract: A method of producing a laminated ceramic electronic component results in an increased thickness of an internal electrode, reduced delamination, and produces a laminated ceramic electronic component having outstanding reliability. The method of producing a laminated ceramic electronic component includes the step of forming a green sheet supported on a carrier film and having an internal electrode paste layer configured to pass through the green sheet from the upper surface to the lower surface thereof, and a ceramic paste layer, the two layers being provided with a space therebetween, and the step of repeating the step of press-bonding the laminate of the green sheet and the carrier film, and separating the carrier film to obtain a ceramic laminate, pressing the ceramic laminate in the thickness direction, and then firing the laminate to obtain a ceramic sintered body.

Abstract: A manufacturing method for a laminated ceramic electronic component is performed such that the thickness of the inner electrode is greatly increased, delamination does not occur, and reliability is superior. The manufacturing method for the laminated ceramic electronic component includes a process in which a green sheet including the inner electrode paste layer and the ceramic paste layer, is provided on a carrier sheet such that the inner electrode paste layer penetrates the green sheet from the top surface to the bottom surface thereof, and a process, in which laminates of the green sheet and the carrier film are adhered by pressing, and thereafter the carrier film is peeled off, are repeated to obtain the ceramic laminate, and the ceramic laminate is fired after pressing in the direction of the thickness to obtain the ceramic sintered body.

Abstract: A laminated inductor has an increased mechanical strength and includes insulating sheets each having coil conductors and relay via holes, and protective sheets each having lead via holes. The coil conductors are electrically connected in series via the relay via holes to define a coil having a substantially rhomboid shape. Each of the coil conductors is a pattern having a 1/2 turn which is substantially V-shaped. Each coil conductor is arranged at oblique angles relative to the edges of the respective insulating sheet, and the peripheral surfaces of the coil are inclined relative to the peripheral surfaces of the inductor.