Abstract: A collet for compressing an adhesive-attached chip, the collet including a main body having a first pressing surface to which a pressing force from a compressing device is directly transmitted, and a projecting portion projecting from the main body and having a second pressing surface provided along an outer circumference of the first pressing surface, the first pressing surface and the second pressing surface forming a holding surface for holding the adhesive-attached chip.

Abstract: A method for evaluating pickup property of a dicing/die-bonding integrated film including a base layer, an adhesive, and a bonding adhesive layer in order, the method including preparing a laminate including the dicing/die-bonding integrated film and a wafer having a thickness of 10 to 100 ?m laminated on the bonding adhesive layer, singulating the wafer into a plurality of chips having an area of 9 mm2 or less, pushing a center portion of the chip from a side of the base layer, and measuring a peeling strength when an edge of the chip is peeled off from the adhesive layer.