Patents by Inventor Tsuyoshi Tokunaga

Tsuyoshi Tokunaga has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10997484
    Abstract: An antenna device includes a power feed coil and a ring-shaped conductor arranged about an axis and a ring-shaped conductor including first and second edge end portions in an axial direction and a cavity inward from the first edge end portion. At least a portion of the cavity overlaps with a coil opening of the power feed coil when seen from the radial direction. The power feed coil causes electric field coupling, magnetic field coupling, and/or electromagnetic field coupling with the cavity. The ring-shaped conductor defines and functions as a booster antenna of the power feed coil. A substantial coil opening defining and functioning as an antenna is larger than that when only the power feed coil is provided, thus facilitating coupling with a communication partner-side antenna coil.
    Type: Grant
    Filed: June 14, 2017
    Date of Patent: May 4, 2021
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Tsuyoshi Tokunaga, Jian Wang
  • Patent number: 10327317
    Abstract: A mobile wireless terminal includes a metal casing, a printed wiring board disposed in the metal casing and including a ground conductor thereon, the ground conductor defining a ground plane for both a power supply circuit and an antenna, a capacitor connected to the metal casing and the ground conductor, and an overcurrent protective element connected to the metal casing and the ground conductor and having an operating voltage higher than a maximum instantaneous value of a commercial power supply voltage. A capacitance of the overcurrent protective element may be smaller than a capacitance of the capacitor. The capacitor may be a multilayer ceramic capacitor, and the overcurrent protective element may be a discharge gap overcurrent protective element.
    Type: Grant
    Filed: December 4, 2017
    Date of Patent: June 18, 2019
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Tsuyoshi Tokunaga, Kenichi Ishizuka
  • Publication number: 20180103531
    Abstract: A mobile wireless terminal includes a metal casing, a printed wiring board disposed in the metal casing and including a ground conductor thereon, the ground conductor defining a ground plane for both a power supply circuit and an antenna, a capacitor connected to the metal casing and the ground conductor, and an overcurrent protective element connected to the metal casing and the ground conductor and having an operating voltage higher than a maximum instantaneous value of a commercial power supply voltage. A capacitance of the overcurrent protective element may be smaller than a capacitance of the capacitor. The capacitor may be a multilayer ceramic capacitor, and the overcurrent protective element may be a discharge gap overcurrent protective element.
    Type: Application
    Filed: December 4, 2017
    Publication date: April 12, 2018
    Inventors: Tsuyoshi TOKUNAGA, Kenichi ISHIZUKA
  • Publication number: 20170277990
    Abstract: An antenna device includes a power feed coil and a ring-shaped conductor arranged about an axis and a ring-shaped conductor including first and second edge end portions in an axial direction and a cavity inward from the first edge end portion. At least a portion of the cavity overlaps with a coil opening of the power feed coil when seen from the radial direction. The power feed coil causes electric field coupling, magnetic field coupling, and/or electromagnetic field coupling with the cavity. The ring-shaped conductor defines and functions as a booster antenna of the power feed coil. A substantial coil opening defining and functioning as an antenna is larger than that when only the power feed coil is provided, thus facilitating coupling with a communication partner-side antenna coil.
    Type: Application
    Filed: June 14, 2017
    Publication date: September 28, 2017
    Inventors: Tsuyoshi TOKUNAGA, Jian WANG
  • Patent number: 8585853
    Abstract: A layered manufacturing method for forming a desired three-dimensional object by using a powder as a raw material. The method forms a desired solid body, which is employed in a layered manufacturing device, including a stage member having stage surface; a transparent member having an optical window to cover the stage surface to form an enclosed region together with the stage surface; and an exhaust system for exhausting gasses in the enclosed region. The optical window is positioned at a vertical upper direction when the enclosed region is formed.
    Type: Grant
    Filed: May 17, 2011
    Date of Patent: November 19, 2013
    Inventors: Keijirou Yamamoto, Tsuyoshi Tokunaga
  • Publication number: 20110285060
    Abstract: A layered manufacturing method for forming a desired three-dimensional object by using a powder as a raw material. The method forms a desired solid body, which is employed in a layered manufacturing device, including a stage member having stage surface; a transparent member having an optical window to cover the stage surface to form an enclosed region together with the stage surface; and an exhaust system for exhausting gasses in the enclosed region. The optical window is positioned at a vertical upper direction when the enclosed region is formed.
    Type: Application
    Filed: May 17, 2011
    Publication date: November 24, 2011
    Inventors: Keijirou YAMAMOTO, Tsuyoshi Tokunaga
  • Publication number: 20070003427
    Abstract: After preparing a plurality of flat plate material members by compressing material powder, a region of an initial flat plate material member corresponding to a designed cross sectional shape is irradiated with irradiated light (laser light) L, to form an initial cross sectional element that is hardened after being melted. The surface of the initial cross sectional element is then leveled. Next, the next flat plate material member is arranged on the surface of an already manufactured section having a leveled one side surface. Irradiated light is then irradiated to a region of the new flat plate material member corresponding to the designed cross sectional shape at the layer position of the new flat plate material member, and a layer cross sectional member is formed by hardening after melting, and integrated with an already formed section. The surface of the layered cross sectional element is then leveled.
    Type: Application
    Filed: June 9, 2006
    Publication date: January 4, 2007
    Applicants: Keijirou YAMAMOTO, Tsuyoshi TOKUNAGA
    Inventors: Keijirou Yamamoto, Tsuyoshi Tokunaga