Patents by Inventor Tsuyoshi Yamazaki
Tsuyoshi Yamazaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20150291123Abstract: An inner panel of a vehicle hood has a 0.2% proof stress of 70 MPa or more and 120 MPa or less after assembling of the inner panel and completion of bake coating. An outer panel has a 0.2% proof stress of 150 MPa or more. The outer panel is made of JIS 5000 or 6000 series aluminum alloy plate material, and the inner panel is made of a JIS 3000 series aluminum alloy plate material. The inner panel has hat-shaped main beads arranged in a center portion. An elongation amount (L?L0)/L0 determined by cross-section line length L of a concave or convex portion of the main bead projected from the surface of the center portion and a line length L0 of a line segment linearly connecting ends of the portion is 0.4 ? to 0.6 ? to a breaking elongation ? in uniaxial tensile deformation.Type: ApplicationFiled: April 3, 2015Publication date: October 15, 2015Applicant: KABUSHIKI KAISHA KOBE SEIKO SHO (Kobe Steel, Ltd.)Inventors: Masatoshi YOSHIDA, Hideki ISHITOBI, Koji OISHI, Tsuyoshi YAMAZAKI, Masao KOBORI
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Publication number: 20150079424Abstract: A substrate for suspension comprises a metallic substrate, an insulating layer formed on the metallic substrate, a conductor layer formed on the insulating layer, and a cover layer covering the conductor layer. The insulating layer and the cover layer are formed from different materials, whose coefficients of hygroscopic expansion are in the range between 3×10?6/% RH and 30×10?6/% RH. The difference between the coefficients of hygroscopic expansion of the two materials is 5×10?6/% RH or less.Type: ApplicationFiled: November 24, 2014Publication date: March 19, 2015Inventors: Yoichi HITOMI, Shinji KUMON, Terutoshi MOMOSE, Katsuya SAKAYORI, Kiyohiro TAKACHI, Yoichi MIURA, Tsuyoshi YAMAZAKI
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Patent number: 8927122Abstract: A substrate for suspension comprises a metallic substrate, an insulating layer formed on the metallic substrate, a conductor layer formed on the insulating layer, and a cover layer covering the conductor layer. The insulating layer and the cover layer are formed from different materials, whose coefficients of hygroscopic expansion are in the range between 3×10?6/% RH and 30×10?6/% RH. The difference between the coefficients of hygroscopic expansion of the two materials is 5×10?6/% RH or less.Type: GrantFiled: April 14, 2008Date of Patent: January 6, 2015Assignee: Dai Nippon Printing Co., Ltd.Inventors: Yoichi Hitomi, Shinji Kumon, Terutoshi Momose, Katsuya Sakayori, Kiyohiro Takachi, Yoichi Miura, Tsuyoshi Yamazaki
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Publication number: 20140253723Abstract: The present invention provides a measurement apparatus which measures a shape of an inner surface of a measurement target object, including an irradiation unit configured to irradiate, with light emitted by a light source, different positions of the inner surface for respective wavelengths, an image capturing unit configured to capture the light reflected by the inner surface for the respective wavelengths, thereby generating captured data, and a calculation unit configured to calculate the shape of the inner surface based on the captured data corresponding to the respective wavelengths captured by the image capturing unit.Type: ApplicationFiled: March 4, 2014Publication date: September 11, 2014Applicant: CANON KABUSHIKI KAISHAInventor: Tsuyoshi YAMAZAKI
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Publication number: 20140246224Abstract: The present invention provides a substrate for suspension that includes a first structural part including a metal supporting substrate, an insulating layer, a wiring layer, and a cover layer, and a second structural part formed so as to extend continuously from the first structural part and has no metal supporting substrate. A position of an edge of an upper surface of the insulating layer coincides with a position of an edge of the lower surface of the cover layer or the position of the edge of the upper surface of the insulating layer is positioned on a side closer to the wiring layer than to the position of the edge of the lower surface of the cover layer at a boundary region between the first structural part and the second structural part.Type: ApplicationFiled: May 15, 2014Publication date: September 4, 2014Applicant: DAI NIPPON PRINTING CO., LTD.Inventors: Yoichi MIURA, Tsuyoshi YAMAZAKI
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Publication number: 20140218730Abstract: The present invention provides a measurement apparatus which measures a position of a surface to be measured, comprising a light detection unit configured to detect light reflected by the surface to be measured, a confocal optical system configured to irradiate the surface to be measured with light and guide the light traveling from the surface to be measured to the light detection unit, and a control unit configured to determine a position of the surface to be measured, based on an output from the light detection unit, wherein the control unit obtains a plurality of signals to be used for determining the position of the surface to be measured, selects one of the plurality of signals, and obtains the position of the surface to be measured, based on the selected signal.Type: ApplicationFiled: February 3, 2014Publication date: August 7, 2014Applicant: CANON KABUSHIKI KAISHAInventors: Tsuyoshi Yamazaki, Hiroyuki Yuki
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Patent number: 8758910Abstract: The present invention provides a substrate for suspension that includes a first structural part including a metal supporting substrate, an insulating layer, a wiring layer, and a cover layer, and a second structural part formed so as to extend continuously from the first structural part and has no metal supporting substrate. A position of an edge of an upper surface of the insulating layer coincides with a position of an edge of the lower surface of the cover layer or the position of the edge of the upper surface of the insulating layer is positioned on a side closer to the wiring layer than to the position of the edge of the lower surface of the cover layer at a boundary region between the first structural part and the second structural part.Type: GrantFiled: June 29, 2011Date of Patent: June 24, 2014Assignee: Dai Nippon Printing Co., Ltd.Inventors: Yoichi Miura, Tsuyoshi Yamazaki
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Patent number: 8730619Abstract: A main object of the present invention is to provide a suspension substrate such that design freedom of a wiring layer is improved while restraining the upsizing in accordance with an increase in a wiring layer. The present invention solves the problem by providing a suspension substrate comprising a metal supporting substrate, a first insulating layer, a first wiring layer, a second insulating layer, and a second wiring layer laminated in this order, characterized in that the first wiring layer has a functional element wiring layer connected to a functional element, and the second wiring layer has a signal transmission wiring layer comprising a pair of wiring layers and connected to a recording and reproducing element.Type: GrantFiled: October 28, 2011Date of Patent: May 20, 2014Assignee: Dai Nippon Printing Co., Ltd.Inventor: Tsuyoshi Yamazaki
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Publication number: 20130229729Abstract: A main object of the present invention is to provide a suspension substrate such that design freedom of a wiring layer is improved while restraining the upsizing in accordance with an increase in a wiring layer. The present invention solves the problem by providing a suspension substrate comprising a metal supporting substrate, a first insulating layer, a first wiring layer, a second insulating layer, and a second wiring layer laminated in this order, characterized in that the first wiring layer has a functional element wiring layer connected to a functional element, and the second wiring layer has a signal transmission wiring layer comprising a pair of wiring layers and connected to a recording and reproducing element.Type: ApplicationFiled: October 28, 2011Publication date: September 5, 2013Applicant: DAI NIPPON PRINTING CO., LTD.Inventor: Tsuyoshi Yamazaki
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Patent number: 8390958Abstract: A suspension substrate according to the present invention includes an insulating layer, a metallic support layer provided on one face of the insulating layer, a wiring layer provided on the other face of the insulating layer, the wiring layer including a plurality of wirings and an alignment section located in a substrate main body region and isolated from each wiring. Further, in the substrate main body region, an alignment through hole is provided to extend through the metallic support layer, insulating layer and alignment section of the wiring layer. This alignment through hole is used for alignment for the actuator elements.Type: GrantFiled: July 5, 2011Date of Patent: March 5, 2013Assignee: Dai Nippon Printing Co., Ltd.Inventors: Masao Ohnuki, Tsuyoshi Yamazaki
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Patent number: 8308967Abstract: The present invention relates to an insulator as an insulating layer in a laminate which can inhibit dusting at the time of use, more particularly an electronic circuit component to which the insulator has been applied, particularly a wireless suspension. The insulator comprises a laminate of one or more insulation unit layers etchable by a wet process, the insulator having been subjected to plasma treatment after wet etching. The insulator exists mainly as an insulating layer in a laminate having a layer construction of first inorganic material layer-insulating layer-second inorganic material layer or a layer construction of inorganic material layer-insulating layer, and at least a part of the inorganic material layer has been removed to expose the insulating layer.Type: GrantFiled: January 13, 2011Date of Patent: November 13, 2012Assignee: Dai Nippon Printing Co., Ltd.Inventors: Katsuya Sakayori, Terutoshi Momose, Shigeki Kawano, Tomoko Togashi, Hiroko Amasaki, Nobuhiro Sakihama, Tsuyoshi Yamazaki, Michiaki Uchiyama, Hiroshi Yagi
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Publication number: 20120002366Abstract: A suspension substrate according to the present invention includes an insulating layer, a metallic support layer provided on one face of the insulating layer, a wiring layer provided on the other face of the insulating layer, the wiring layer including a plurality of wirings and an alignment section located in a substrate main body region and isolated from each wiring. Further, in the substrate main body region, an alignment through hole is provided to extend through the metallic support layer, insulating layer and alignment section of the wiring layer. This alignment through hole is used for alignment for the actuator elements.Type: ApplicationFiled: July 5, 2011Publication date: January 5, 2012Applicant: Dai Nippon Printing Co., Ltd.Inventors: Masao OHNUKI, Tsuyoshi YAMAZAKI
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Publication number: 20110318609Abstract: It is an object of the present invention to provide a substrate for suspension reduced in the generation of cracks in an insulating layer at the boundary region between a region where a metal supporting substrate exists and a region where no metal supporting substrate exist.Type: ApplicationFiled: June 29, 2011Publication date: December 29, 2011Inventors: Yoichi MIURA, Tsuyoshi YAMAZAKI
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Patent number: 8040634Abstract: A magnetic head suspension having a thin metallic plate as a substrate which is caused to have a new function besides a function as a spring. The magnetic head suspension plural lines for connecting a magnetic head and a control circuit board to each other are formed over a thin metallic plate having a spring property through an insulating layer, and are integrated with the thin metallic plate A metallic pad made of a same metal layer as the plural lines is formed independently of the lines, an opening is made in a portion of the metallic pad to penetrate the insulating layer and then to reach the thin metallic plate, and an electroconductive region is formed into the opening by metal plating, thereby connecting the metallic pad and the thin metallic plate electrically to each other.Type: GrantFiled: July 14, 2006Date of Patent: October 18, 2011Assignee: Dai Nippon Printing Co., Ltd.Inventors: Hiroaki Miyazawa, Terutoshi Momose, Yoichi Hitomi, Tsuyoshi Yamazaki
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Publication number: 20110108519Abstract: The present invention relates to an insulator as an insulating layer in a laminate which can inhibit dusting at the time of use, more particularly an electronic circuit component to which the insulator has been applied, particularly a wireless suspension. The insulator comprises a laminate of one or more insulation unit layers etchable by a wet process, the insulator having been subjected to plasma treatment after wet etching. The insulator exists mainly as an insulating layer in a laminate having a layer construction of first inorganic material layer-insulating layer-second inorganic material layer or a layer construction of inorganic material layer-insulating layer, and at least a part of the inorganic material layer has been removed to expose the insulating layer.Type: ApplicationFiled: January 13, 2011Publication date: May 12, 2011Applicant: Dai Nippon Printing Co., Ltd.Inventors: Katsuya SAKAYORI, Terutoshi Momose, Shigeki Kawano, Tomoko Togashi, Hiroko Amasaki, Nobuhiro Sakihama, Tsuyoshi Yamazaki, Michiaki Uchiyama, Hiroshi Yagi
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Publication number: 20100047626Abstract: A substrate for suspension 10 comprises a metallic substrate 1, an insulating layer 2 formed on the metallic substrate 1, a conductor layer 3 formed on the insulating layer 2, and a cover layer 4 covering the conductor layer 3. The insulating layer 2 and the cover layer 4 are formed from different materials, whose coefficients of hygroscopic expansion are in the range between 3×10?6/% RH and 30×10?6/% RH. The difference between the coefficients of hygroscopic expansion of the two materials is 5×10?6/% RH or less.Type: ApplicationFiled: April 14, 2008Publication date: February 25, 2010Applicant: Dai Nippon Printing Co., Ltd.Inventors: Yoichi Hitomi, Shinji Kumon, Terutoshi Momose, Katsuya Sakayori, Kiyohiro Takachi, Yoichi Miura, Tsuyoshi Yamazaki
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Publication number: 20090310260Abstract: A magnetic head suspension having a thin metallic plate as a substrate which is caused to have a new function besides a function as a spring. The magnetic head suspension plural lines for connecting a magnetic head and a control circuit board to each other are formed over a thin metallic plate having a spring property through an insulating layer, and are integrated with the thin metallic plate A metallic pad made of a same metal layer as the plural lines is formed independently of the lines, an opening is made in a portion of the metallic pad to penetrate the insulating layer and then to reach the thin metallic plate, and an electroconductive region is formed into the opening by metal plating, thereby connecting the metallic pad and the thin metallic plate electrically to each other.Type: ApplicationFiled: July 14, 2006Publication date: December 17, 2009Inventors: Hiroaki Miyazawa, Terutoshi Momose, Yoichi Hitomi, Tsuyoshi Yamazaki
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Patent number: 7226806Abstract: The present invention relates to an insulator as an insulating layer in a laminate which can inhibit dusting at the time of use, more particularly an electronic circuit component to which the insulator has been applied, particularly a wireless suspension. The insulator comprises a laminate of one or more insulation unit layers etchable by a wet process, the insulator having been subjected to plasma treatment after wet etching. The insulator exists mainly as an insulating layer in a laminate having a layer construction of first inorganic material layer—insulating layer—second inorganic material layer or a layer construction of inorganic material layer—insulating layer, and at least a part of the inorganic material layer has been removed to expose the insulating layer.Type: GrantFiled: February 14, 2002Date of Patent: June 5, 2007Assignee: Dai Nippon Printing Co., Ltd.Inventors: Katsuya Sakayori, Terutoshi Momose, Shigeki Kawano, Tomoko Togashi, Hiroko Amasaki, Nobuhiro Sakihama, Tsuyoshi Yamazaki, Michiaki Uchiyama, Hiroshi Yagi
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Publication number: 20070120229Abstract: The present invention relates to an insulator as an insulating layer in a laminate which can inhibit dusting at the time of use, more particularly an electronic circuit component to which the insulator has been applied, particularly a wireless suspension. The insulator comprises a laminate of one or more insulation unit layers etchable byawet process, the insulator having been subjected to plasma treatment after wet etching. The insulator exists mainly as an insulating layer in a laminate having a layer construction of first inorganic material layer—insulating layer—second inorganic material layer or a layer construction of inorganic material layer—insulating layer, and at least a part of the inorganic material layer has been removed to expose the insulating layer.Type: ApplicationFiled: January 25, 2007Publication date: May 31, 2007Applicant: Dai Nippon Printing Co., Ltd.Inventors: Katsuya Sakayori, Terutoshi Momose, Shigeki Kawano, Tomoko Togashi, Hiroko Amasaki, Nobuhiro Sakihama, Tsuyoshi Yamazaki, Michiaki Uchiyama, Hiroshi Yagi
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Magnetic head suspension with both protected wiring and unprotected wiring, in addition to terminals
Patent number: 6894875Abstract: A magnetic head suspension includes an insulating base (12), wiring parts (13) formed on one surface of the insulating base (12) including a conductive metal layer, an elastic metal plate (14) provided on the other surface of the insulating base (12), and a wiring protecting layer (19) covering the wiring parts (13). The wiring protecting layer (19) is formed by subjecting a dry film containing an epoxy resin, an acrylic resin and a polymer containing aromatic rings to exposure and developing processes.Type: GrantFiled: April 16, 2002Date of Patent: May 17, 2005Assignee: Dai Nippon Printing Co., Ltd.Inventors: Tooru Serizawa, Terutoshi Momose, Nobuhiro Sakihama, Youichi Nagai, Tsuyoshi Yamazaki, Michiaki Uchiyama, Midori Chiba