Patents by Inventor Tsuyoshi Yoda

Tsuyoshi Yoda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Film forming method, electronic device and electronic apparatus
    Publication number: 20060062978
    Abstract: A film forming method for forming a thin film pattern on a substrate, comprising a) forming the pattern of a metal base layer on the substrate by vapor-phase deposition with a mask; and b) forming a second metal film on the pattern of the metal base layer by plating the substrate.
    Type: Application
    Filed: August 11, 2005
    Publication date: March 23, 2006
    Inventors: Shinichi Yotsuya, Tsuyoshi Yoda, Suguru Akagawa
  • Method for manufacturing a semiconductor substrate and method for manufacturing an electro-optical device
    Publication number: 20050250306
    Abstract: A method is provided including, after joining a wiring substrate and an element substrate, separating a second substrate of the element substrate from a semiconductor element, and electrically coupling an element-side terminal that has been exposed by the separation to a wiring-side terminal disposed outside the semiconductor element by electroless plating.
    Type: Application
    Filed: April 8, 2005
    Publication date: November 10, 2005
    Inventors: Suguru Akagawa, Tsuyoshi Yoda
  • Method of manufacturing substrate joint body, substrate joint body and electrooptical device
    Publication number: 20050205992
    Abstract: A method of manufacturing a substrate joint body by mounting a TFT on a wiring substrate includes a step of arranging an electrode pad of the wiring substrate and an electrode pad of the TFT at a predetermined interval and mechanically coupling the wiring substrate and the TFT with a adhesive and a step of electrically coupling the wiring substrate and the TFT by growing a bump from the electrode pad of the wiring substrate and/or the electrode pad of the TFT.
    Type: Application
    Filed: March 7, 2005
    Publication date: September 22, 2005
    Inventors: Tsuyoshi Yoda, Suguru Akagawa
  • Method of fabricating bumps utilizing a resist layer having photosensitive agent and resin
    Patent number: 6900117
    Abstract: A bump forming method having a step of patterning a resist layer so as to have a penetrating hole above a pad, a step of applying energy to cause cross-linking in the resist layer, and hardening at least a surface of the resist layer, and a step of forming a metal layer electrically connected to the pad within the penetrating hole.
    Type: Grant
    Filed: October 29, 2001
    Date of Patent: May 31, 2005
    Assignee: Seiko Epson Corporation
    Inventor: Tsuyoshi Yoda
  • Bump forming method, semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
    Publication number: 20020061641
    Abstract: A bump forming method having a step of patterning a resist layer so as to have a penetrating hole above a pad, a step of applying energy to cause cross-linking in the resist layer, and hardening at least a surface of the resist layer, and a step of forming a metal layer electrically connected to the pad within the penetrating hole.
    Type: Application
    Filed: October 29, 2001
    Publication date: May 23, 2002
    Applicant: SEIKO EPSON CORPORATION
    Inventor: Tsuyoshi Yoda