Patents by Inventor Tsuyoshi Yokomori
Tsuyoshi Yokomori has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230120615Abstract: A semiconductor manufacturing apparatus includes a thrust-up unit having a plurality of blocks in contact with a dicing tape, a head having a collet absorbing the die and capable of being moved up and down, and a control section controlling the operation of the thrust-up unit and the head. The thrust-up unit can operate each of the plurality of blocks independently. The control section configures the thrust-up sequences of the plurality of blocks in a plurality of steps, and controls the operation of the plurality of blocks on the basis of a time chart recipe capable of setting the height and the speed of the plurality of blocks for each block and in each step.Type: ApplicationFiled: December 16, 2022Publication date: April 20, 2023Inventors: Tsuyoshi YOKOMORI, Tatsuyuki OKUBO, Yuki NAKUI, Hiroshi MAKI, Akira SAITO, Naoki OKAMOTO
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Patent number: 11569118Abstract: A semiconductor manufacturing apparatus includes a thrust-up unit having a plurality of blocks in contact with a dicing tape, a head having a collet absorbing the die and capable of being moved up and down, and a control section controlling the operation of the thrust-up unit and the head. The thrust-up unit can operate each of the plurality of blocks independently. The control section configures the thrust-up sequences of the plurality of blocks in a plurality of steps, and controls the operation of the plurality of blocks on the basis of a time chart recipe capable of setting the height and the speed of the plurality of blocks for each block and in each step.Type: GrantFiled: March 9, 2020Date of Patent: January 31, 2023Assignee: Fasford Technology Co., Ltd.Inventors: Tsuyoshi Yokomori, Tatsuyuki Okubo, Yuki Nakui, Hiroshi Maki, Akira Saito, Naoki Okamoto
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Publication number: 20200312699Abstract: A semiconductor manufacturing apparatus includes a thrust-up unit having a plurality of blocks in contact with a dicing tape, a head having a collet absorbing the die and capable of being moved up and down, and a control section controlling the operation of the thrust-up unit and the head. The thrust-up unit can operate each of the plurality of blocks independently. The control section configures the thrust-up sequences of the plurality of blocks in a plurality of steps, and controls the operation of the plurality of blocks on the basis of a time chart recipe capable of setting the height and the speed of the plurality of blocks for each block and in each step.Type: ApplicationFiled: March 9, 2020Publication date: October 1, 2020Inventors: Tsuyoshi YOKOMORI, Tatsuyuki OKUBO, Yuki NAKUI, Hiroshi MAKI, Akira SAITO, Naoki OKAMOTO
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Publication number: 20130299098Abstract: In a chip pick-up process after dicing in an assembly process during manufacture of a semiconductor integrated circuit device it is an important subject to diminish a pick-up defect caused by the reduction in thickness of each chip which is proceeding in quick tempo. Particularly, bending of the chip peripheral portion caused by a peeling operation is very likely to induce cracking and chipping of the chip. In the present invention, to solve these problems, in case of peeling a chip from a dicing tape (adhesive tape) or the like while vacuum-chucking the chip by a chucking collet, the flow rate of a vacuum chucking system in the chucking collet is monitored to check a bent state of the chip before complete separation of the first chip from the adhesive tape.Type: ApplicationFiled: July 14, 2013Publication date: November 14, 2013Inventors: Hiroshi MAKI, Tsuyoshi YOKOMORI, Tatsuyuki OKUBO
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Patent number: 8492173Abstract: In a chip pick-up process after dicing in an assembly process during manufacture of a semiconductor integrated circuit device it is an important subject to diminish a pick-up defect caused by the reduction in thickness of each chip which is proceeding in quick tempo. Particularly, bending of the chip peripheral portion caused by a peeling operation is very likely to induce cracking and chipping of the chip. In the present invention, to solve these problems, in case of peeling a chip from a dicing tape (adhesive tape) or the like while vacuum-chucking the chip by a chucking collet, the flow rate of a vacuum chucking system in the chucking collet is monitored to check a bent state of the chip before complete separation of the first chip from the adhesive tape.Type: GrantFiled: January 16, 2013Date of Patent: July 23, 2013Assignee: Renesas Electonics CorporationInventors: Hiroshi Maki, Tsuyoshi Yokomori, Tatsuyuki Okubo
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Patent number: 8372665Abstract: In a chip pick-up process after dicing in an assembly process during manufacture of a semiconductor integrated circuit device it is an important subject to diminish a pick-up defect caused by the reduction in thickness of each chip which is proceeding in quick tempo. Particularly, bending of the chip peripheral portion caused by a peeling operation is very likely to induce cracking and chipping of the chip. In the present invention, to solve these problems, in case of peeling a chip from a dicing tape (adhesive tape) or the like while vacuum-chucking the chip by a chucking collet, the flow rate of a vacuum chucking system in the chucking collet is monitored to check a bent state of the chip before complete separation of the first chip from the adhesive tape.Type: GrantFiled: June 26, 2012Date of Patent: February 12, 2013Assignee: Renesas Electronics CorporationInventors: Hiroshi Maki, Tsuyoshi Yokomori, Tatsuyuki Okubo
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Publication number: 20120270340Abstract: In a chip pick-up process after dicing in an assembly process during manufacture of a semiconductor integrated circuit device it is an important subject to diminish a pick-up defect caused by the reduction in thickness of each chip which is proceeding in quick tempo. Particularly, bending of the chip peripheral portion caused by a peeling operation is very likely to induce cracking and chipping of the chip. In the present invention, to solve these problems, in case of peeling a chip from a dicing tape (adhesive tape) or the like while vacuum-chucking the chip by a chucking collet, the flow rate of a vacuum chucking system in the chucking collet is monitored to check a bent state of the chip before complete separation of the first chip from the adhesive tape.Type: ApplicationFiled: June 26, 2012Publication date: October 25, 2012Inventors: HIROSHI MAKI, Tsuyoshi Yokomori, Tatsuyuki Okubo
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Patent number: 8222050Abstract: In a chip pick-up process after dicing in an assembly process during manufacture of a semiconductor integrated circuit device it is an important subject to diminish a pick-up defect caused by the reduction in thickness of each chip which is proceeding in quick tempo. Particularly, bending of the chip peripheral portion caused by a peeling operation is very likely to induce cracking and chipping of the chip. In the present invention, to solve these problems, in case of peeling a chip from a dicing tape (adhesive tape) or the like while vacuum-chucking the chip by a chucking collet, the flow rate of a vacuum chucking system in the chucking collet is monitored to check a bent state of the chip before complete separation of the first chip from the adhesive tape.Type: GrantFiled: August 11, 2011Date of Patent: July 17, 2012Assignee: Renesas Electronics CorporationInventors: Hiroshi Maki, Tsuyoshi Yokomori, Tatsuyuki Okubo
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Publication number: 20110290427Abstract: In a chip pick-up process after dicing in an assembly process during manufacture of a semiconductor integrated circuit device it is an important subject to diminish a pick-up defect caused by the reduction in thickness of each chip which is proceeding in quick tempo. Particularly, bending of the chip peripheral portion caused by a peeling operation is very likely to induce cracking and chipping of the chip. In the present invention, to solve these problems, in case of peeling a chip from a dicing tape (adhesive tape) or the like while vacuum-chucking the chip by a chucking collet, the flow rate of a vacuum chucking system in the chucking collet is monitored to check a bent state of the chip before complete separation of the first chip from the adhesive tape.Type: ApplicationFiled: August 11, 2011Publication date: December 1, 2011Inventors: Hiroshi Maki, Tsuyoshi Yokomori, Tatsuyuki Okubo
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Patent number: 8003495Abstract: In a chip pick-up process after dicing in an assembly process during manufacture of a semiconductor integrated circuit device it is an important subject to diminish a pick-up defect caused by the reduction in thickness of each chip which is proceeding in quick tempo. Particularly, bending of the chip peripheral portion caused by a peeling operation is very likely to induce cracking and chipping of the chip. In the present invention, to solve these problems, in case of peeling a chip from a dicing tape (adhesive tape) or the like while vacuum-chucking the chip by a chucking collet, the flow rate of a vacuum chucking system in the chucking collet is monitored to check a bent state of the chip before complete separation of the first chip from the adhesive tape.Type: GrantFiled: January 10, 2011Date of Patent: August 23, 2011Assignee: Renesas Electronics CorporationInventors: Hiroshi Maki, Tsuyoshi Yokomori, Tatsuyuki Okubo
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Publication number: 20110097849Abstract: In a chip pick-up process after dicing in an assembly process during manufacture of a semiconductor integrated circuit device it is an important subject to diminish a pick-up defect caused by the reduction in thickness of each chip which is proceeding in quick tempo. Particularly, bending of the chip peripheral portion caused by a peeling operation is very likely to induce cracking and chipping of the chip. In the present invention, to solve these problems, in case of peeling a chip from a dicing tape (adhesive tape) or the like while vacuum-chucking the chip by a chucking collet, the flow rate of a vacuum chucking system in the chucking collet is monitored to check a bent state of the chip before complete separation of the first chip from the adhesive tape.Type: ApplicationFiled: January 10, 2011Publication date: April 28, 2011Inventors: Hiroshi Maki, Tsuyoshi Yokomori, Tatsuyuki Okubo
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Patent number: 7888141Abstract: In a chip pick-up process after dicing in an assembly process during manufacture of a semiconductor integrated circuit device it is an important subject to diminish a pick-up defect caused by the reduction in thickness of each chip which is proceeding in quick tempo. Particularly, bending of the chip peripheral portion caused by a peeling operation is very likely to induce cracking and chipping of the chip. In the present invention, to solve these problems, in case of peeling a chip from a dicing tape (adhesive tape) or the like while vacuum-chucking the chip by a chucking collet, the flow rate of a vacuum chucking system in the chucking collet is monitored to check a bent state of the chip before complete separation of the first chip from the adhesive tape.Type: GrantFiled: June 11, 2008Date of Patent: February 15, 2011Assignee: Renesas Electronics CorporationInventors: Hiroshi Maki, Tsuyoshi Yokomori, Tatsuyuki Okubo
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Publication number: 20080318346Abstract: In a chip pick-up process after dicing in an assembly process during manufacture of a semiconductor integrated circuit device it is an important subject to diminish a pick-up defect caused by the reduction in thickness of each chip which is proceeding in quick tempo. Particularly, bending of the chip peripheral portion caused by a peeling operation is very likely to induce cracking and chipping of the chip. In the present invention, to solve these problems, in case of peeling a chip from a dicing tape (adhesive tape) or the like while vacuum-chucking the chip by a chucking collet, the flow rate of a vacuum chucking system in the chucking collet is monitored to check a bent state of the chip before complete separation of the first chip from the adhesive tape.Type: ApplicationFiled: June 11, 2008Publication date: December 25, 2008Inventors: Hiroshi Maki, Tsuyoshi Yokomori, Tatsuyuki Okubo