Abstract: A length of metallic lead from having anode terminals and cathode terminals integrally formed with each other extends between upper and lower molds of an apparatus for manufacturing tantalum solid electrolytic capacitors. The cathode terminals are first coated with a thermosetting conductive adhesive, and cathode layers of capacitor elements are then placed on the conductive adhesive. Thereafter, anode leads extending outwardly from the capacitor elements are placed on the anode terminals are joined thereto, respectively, by welding. A pressure is applied to the capacitor elements so that a portion of the conductive adhesive is squeezed out from one surface of each of the plurality of capacitor elements to a neighboring side surface thereof. The cathode terminals are then joined to the capacitor elements, respectively, by heat-curing the conductive adhesive, and the capacitor elements are finally covered with a sheathing resin.

Abstract: A capacitor includes a capacitor element having leads accommodated along with electrolyte solution in a metallic case, and a sealing plate that seals the opening of the metallic case. In the capacitor, a center axis of a threaded portion provided in a terminal block on the sealing plate is constituted to be parallel to a planar portion of the sealing plate. Hence, the center axis of the threaded portion is vertical to a circuit board when mounting the capacitor onto the circuit board. Thereby, a series of operation from the insertion to the tightening of the mounting screw is done very easily.

Abstract: A solid electrolytic capacitor having excellent solder wettability and heat resisting adhesion and a method of manufacturing same are obtained by a simple plating configuration. The capacitor includes a capacitor element, positive electrode terminal and negative electrode terminal. The positive electrode terminal and the negative electrode terminal include a metallic member containing (i) at least one selected from the group consisting of nickel, nickel alloy, copper and copper alloy, (ii) a first plated layer of tin or tin alloy, directly disposed without undercoat on the metallic member, and (iii) an intermetallic compound layer formed between the metallic member and the first plated layer. The intermetallic compound layer contains tin-nickel or tin-copper formed through heat reflow treatment of the metallic member disposed on the first plated layer.

Abstract: The present invention relates to a solid electrolytic capacitor having a large capacitance and a higher resistance to heat and adapted as a surface-mount device and a method of producing the same. The invention may include the followings features: (1) a layer containing an electroconductive polymer and a less conductive polymer is provided on a dielectric oxide film on the positive electrode foil; (2) a separator of a polyester resin based unwoven fabric made by span bonding and/or wet processing a resin material is sandwiched between the positive electrode foil and the negative electrode foil and rolled together to form a capacitor element which also include a solid electrolyte; (3) a separator is sandwiched between the positive electrode foil and the negative electrode foil coated with a dielectric oxide film exhibiting a withstand voltage of 0.

Abstract: A length of metallic lead from having anode terminals and cathode terminals integrally formed with each other extends between upper and lower molds of an apparatus for manufacturing tantalum solid electrolytic capacitors. The cathode terminals are first coated with a thermosetting conductive adhesive, and cathode layers of capacitor elements are then placed on the conductive adhesive. Thereafter, anode leads extending outwardly from the capacitor elements are placed on the anode terminals are joined thereto, respectively, by welding. A pressure is applied to the capacitor elements so that a portion of the conductive adhesive is squeezed out from one surface of each of the plurality of capacitor elements to a neighboring side surface thereof. The cathode terminals are then joined to the capacitor elements, respectively, by heat-curing the conductive adhesive, and the capacitor elements are finally covered with a sheathing resin.

Abstract: A capacitor includes a capacitor element having leads accommodated along with electrolyte solution in a metallic case, and a sealing plate that seals the opening of the metallic case. In the capacitor, a center axis of a threaded portion provided in a terminal block on the sealing plate is constituted to be parallel to a planar portion of the sealing plate. Hence, the center axis of the threaded portion is vertical to a circuit board when mounting the capacitor onto the circuit board. Thereby, a series of operation from the insertion to the tightening of the mounting screw is done very easily.

Abstract: A length of metallic lead from having anode terminals and cathode terminals integrally formed with each other extends between upper and lower molds of an apparatus for manufacturing tantalum solid electrolytic capacitors. The cathode terminals are first coated with a thermosetting conductive adhesive, and cathode layers of capacitor elements are then placed on the conductive adhesive. Thereafter, anode leads extending outwardly from the capacitor elements are placed on the anode terminals are joined thereto, respectively, by welding. A pressure is applied to the capacitor elements so that a portion of the conductive adhesive is squeezed out from one surface of each of the plurality of capacitor elements to a neighboring side surface thereof The cathode terminals are then joined to the capacitor elements, respectively, by heat-curing the conductive adhesive, and the capacitor elements are finally covered with a sheathing resin.

Abstract: A solid electrolytic capacitor having excellent solder wettability and heat resisting adhesion and a method of manufacturing same are obtained by a simple plating configuration. The capacitor includes a capacitor element, positive electrode terminal and negative electrode terminal. The positive electrode terminal and the negative electrode terminal include a metallic member containing (i) at least one selected from the group consisting of nickel, nickel alloy, copper and copper alloy, (ii) a first plated layer of tin or tin alloy, directly disposed without undercoat on the metallic member, and (iii) an intermetallic compound layer formed between the metallic member and the first plated layer. The intermetallic compound layer contains tin-nickel or tin-copper formed through heat reflow treatment of the metallic member disposed on the first plated layer.

Abstract: A solid electrolytic capacitor minimized in both equivalent serial resistance (ESR) and equivalent serial inductance (ESI) by eliminating redundant space created by its electrode is presented. The solid electrolytic capacitor includes a capacitor element including mainly of a positive electrode body, having a positive electrode lead embedded therein, and made of any form of a valve metal, such as a net, a sheet, a foil, and modifications thereof with a rough surface; a positive electrode terminal connected to the positive electrode lead; a negative electrode terminal connected to a negative electrode layer; and a housing resin coated by molding. This improves the installation efficiency of the capacitor element, and contributes to the small, thin structure of the solid electrolytic capacitor.

Abstract: A method of manufacturing solid electrolytic capacitors which prevents decrease in product yield due to degradation in characteristics of anode foil during a process of forming a MnO2 layer, and achieves high quality solid electrolytic capacitors with high yield, wherein aluminum foil is sampled from each lot before inputting the lot into the next process of forming MnO2 layer on a surface of aluminum foil, and a predetermined inspection is implemented after forming the MnO2 layer on this sample. Based on inspection results, the lot of the sample is input to the next process. This method prevents occurrence of defects in the MnO2 layer formation process in advance, and avoids finding defects after inputting the entire lot of aluminum foil to the MnO2 layer formation process. Consequently, highly reliable solid electrolytic capacitors are manufactured inexpensively and stably without loss in costs and efficiency.

Abstract: A chip type solid electrolytic capacitor of the present invention has a section formed in a step-wise manner on a cathode lead frame that is connected with a capacitor element. An anode lead wire of the capacitor element is resistance welded to the top of a reversed V-letter shaped structure formed by folding part of an anode lead frame into halves. Further, with the chip type solid electrolytic capacitor of the present invention, part of respective cathode and anode lead frames is exposed outside in such a way as being made flush with the periphery of a resin package, thereby each serving as a terminal. Accordingly, a space problem due to the terminals has been eliminated and the anode lead wire can be made short, thus allowing the volume of a capacitor element employed to be increased. As a result, a chip type solid electrolytic capacitor having a large capacity with its outer dimensions is kept the same as a prior art capacitor can be obtained.