Patents by Inventor Tsz-Hei Roy Cheung

Tsz-Hei Roy Cheung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • INSOLE ASSEMBLY
    Publication number: 20180008002
    Abstract: An insole assembly is provided comprising an insole having an upper surface upon which an underside of a foot may contact and be supported. The insole assembly has at least one protrusion which projects away from the upper surface of the insole. At least one of the protrusions is detachably connected to the insole. The protrusions may be interchanged to customize an insole assembly to provide enhanced cutaneous stimulation of targeted regions of a foot.
    Type: Application
    Filed: July 8, 2016
    Publication date: January 11, 2018
    Inventors: Kit-Lun Yick, Sun-Pui Ng, Yiu-Wan Joanne Yip, Tsz-Hei Roy Cheung