Patents by Inventor Tsz-Sin Siu
Tsz-Sin Siu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10702971Abstract: A flexible membrane for use in a carrier head has a generally circular main portion with a lower surface, an annular outer portion for connection to a base assembly, and an annular flap extending from the main portion on a side opposite the lower surface for connection to the base assembly. At least one surface of the flap has a surface texture to prevent adhesion.Type: GrantFiled: September 13, 2016Date of Patent: July 7, 2020Assignee: Applied Materials, Inc.Inventors: Jeonghoon Oh, Tsz-Sin Siu, Hung Chih Chen, Andrew J. Nagengast, Steven M. Zuniga, Thomas B. Brezoczky
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Publication number: 20170001282Abstract: A flexible membrane for use in a carrier head has a generally circular main portion with a lower surface, an annular outer portion for connection to a base assembly, and an annular flap extending from the main portion on a side opposite the lower surface for connection to the base assembly. At least one surface of the flap has a surface texture to prevent adhesion.Type: ApplicationFiled: September 13, 2016Publication date: January 5, 2017Applicant: Applied Materials, Inc.Inventors: Jeonghoon Oh, Tsz-Sin Siu, Hung Chih Chen, Andrew J. Nagengast, Steven M. Zuniga, Thomas B. Brezoczky
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Patent number: 9452505Abstract: A flexible membrane for use in a carrier head has a generally circular main portion with a lower surface, an annular outer portion for connection to a base assembly, and an annular flap extending from the main portion on a side opposite the lower surface for connection to the base assembly. At least one surface of the flap has a surface texture to prevent adhesion.Type: GrantFiled: August 18, 2014Date of Patent: September 27, 2016Assignee: Applied Materials, Inc.Inventors: Jeonghoon Oh, Tsz-Sin Siu, Hung Chih Chen, Andrew J. Nagengast, Steven M. Zuniga, Thomas B. Brezoczky
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Publication number: 20150038065Abstract: A flexible membrane for use in a carrier head has a generally circular main portion with a lower surface, an annular outer portion for connection to a base assembly, and an annular flap extending from the main portion on a side opposite the lower surface for connection to the base assembly. At least one surface of the flap has a surface texture to prevent adhesion.Type: ApplicationFiled: August 18, 2014Publication date: February 5, 2015Inventors: Jeonghoon Oh, Tsz-Sin Siu, Hung Chih Chen, Andrew J. Nagengast, Steven M. Zuniga, Thomas B. Brezoczky
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Patent number: 8808062Abstract: A flexible membrane for use in a carrier head has a generally circular main portion with a lower surface, an annular outer portion for connection to a base assembly, and an annular flap extending from the main portion on a side opposite the lower surface for connection to the base assembly. At least one surface of the flap has a surface texture to prevent adhesion.Type: GrantFiled: June 3, 2013Date of Patent: August 19, 2014Assignee: Applied Materials, Inc.Inventors: Jeonghoon Oh, Tsz-Sin Siu, Hung Chih Chen, Andrew J. Nagengast, Steven M. Zuniga, Thomas B. Brezoczky
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Publication number: 20130334752Abstract: A flexible membrane for use in a carrier head has a generally circular main portion with a lower surface, an annular outer portion for connection to a base assembly, and an annular flap extending from the main portion on a side opposite the lower surface for connection to the base assembly. At least one surface of the flap has a surface texture to prevent adhesion.Type: ApplicationFiled: June 3, 2013Publication date: December 19, 2013Inventors: Jeonghoon Oh, Tsz-Sin Siu, Hung Chih Chen, Andrew J. Nagengast, Steven M. Zuniga, Thomas B. Brezoczky
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Patent number: 8454413Abstract: A flexible membrane for use in a carrier head has a generally circular main portion with a lower surface, an annular outer portion for connection to a base assembly, and an annular flap extending from the main portion on a side opposite the lower surface for connection to the base assembly. At least one surface of the flap has a surface texture to prevent adhesion.Type: GrantFiled: December 21, 2006Date of Patent: June 4, 2013Assignee: Applied Materials, Inc.Inventors: Jeonghoon Oh, Tsz-Sin Siu, Hung Chih Chen, Andrew J. Nagengast, Steven M. Zuniga, Thomas B. Brezoczky
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Patent number: 8088299Abstract: A carrier head for chemical mechanical polishing of a substrate includes a base and a flexible membrane extending beneath the base. The flexible membrane includes a central portion with an outer surface providing a substrate receiving surface, a perimeter portion connecting the central portion to the base, and at least one flap extending from an inner surface of the central portion. The flap divides a volume between the flexible membrane and the base into a plurality of chambers, and the flap includes a laterally extending first section and an angled second section extending beneath the first section and connecting the laterally extending first section to the central portion.Type: GrantFiled: November 29, 2010Date of Patent: January 3, 2012Assignee: Applied Materials, Inc.Inventors: Hung Chih Chen, Jeonghoon Oh, Tsz-Sin Siu, Thomas Brezoczky, Steven M. Zuniga
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Publication number: 20110070810Abstract: A carrier head for chemical mechanical polishing of a substrate includes a base and a flexible membrane extending beneath the base. The flexible membrane includes a central portion with an outer surface providing a substrate receiving surface, a perimeter portion connecting the central portion to the base, and at least one flap extending from an inner surface of the central portion. The flap divides a volume between the flexible membrane and the base into a plurality of chambers, and the flap includes a laterally extending first section and an angled second section extending beneath the first section and connecting the laterally extending first section to the central portion.Type: ApplicationFiled: November 29, 2010Publication date: March 24, 2011Inventors: Hung Chih Chen, Jeonghoon Oh, Tsz-Sin Siu, Thomas Brezoczky, Steven M. Zuniga
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Patent number: 7842158Abstract: A carrier head for chemical mechanical polishing of a substrate includes a base and a flexible membrane extending beneath the base. The flexible membrane includes a central portion with an outer surface providing a substrate receiving surface, a perimeter portion connecting the central portion to the base, and at least one flap extending from an inner surface of the central portion. The flap divides a volume between the flexible membrane and the base into a plurality of chambers, and the flap includes a laterally extending first section and an angled second section extending beneath the first section and connecting the laterally extending first section to the central portion.Type: GrantFiled: August 10, 2007Date of Patent: November 30, 2010Assignee: Applied Materials, Inc.Inventors: Hung Chih Chen, Jeonghoon Oh, Tsz-Sin Siu, Thomas B. Brezoczky, Steven M. Zuniga
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Publication number: 20070272356Abstract: A carrier head for chemical mechanical polishing of a substrate includes a base and a flexible membrane extending beneath the base. The flexible membrane includes a central portion with an outer surface providing a substrate receiving surface, a perimeter portion connecting the central portion to the base, and at least one flap extending from an inner surface of the central portion. The flap divides a volume between the flexible membrane and the base into a plurality of chambers, and the flap includes a laterally extending first section and an angled second section extending beneath the first section and connecting the laterally extending first section to the central portion.Type: ApplicationFiled: August 10, 2007Publication date: November 29, 2007Applicant: Applied Materials, Inc.Inventors: Hung Chen, Jeonghoon Oh, Tsz-Sin Siu, Thomas Brezoczky, Steven Zuniga
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Publication number: 20070202785Abstract: A flexible membrane for use in a carrier head has a generally circular main portion with a lower surface, an annular outer portion for connection to a base assembly, and an annular flap extending from the main portion on a side opposite the lower surface for connection to the base assembly. At least one surface of the flap has a surface texture to prevent adhesion.Type: ApplicationFiled: December 21, 2006Publication date: August 30, 2007Inventors: Jeonghoon Oh, Tsz-Sin Siu, Hung Chen, Andrew Nagengast, Steven Zuniga, Thomas Brezoczky
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Patent number: 7255771Abstract: A carrier head for chemical mechanical polishing of a substrate includes a base and a flexible membrane extending beneath the base. The flexible membrane includes a central portion with an outer surface providing a substrate receiving surface, a perimeter portion connecting the central portion to the base, and at least one flap extending from an inner surface of the central portion. The flap divides a volume between the flexible membrane and the base into a plurality of chambers, and the flap includes a laterally extending first section and an angled second section extending beneath the first section and connecting the laterally extending first section to the central portion.Type: GrantFiled: March 26, 2004Date of Patent: August 14, 2007Assignee: Applied Materials, Inc.Inventors: Hung Chih Chen, Jeonghoon Oh, Tsz-Sin Siu, Thomas Brezoczky, Steven M. Zuniga
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Patent number: 7081042Abstract: Techniques for removing a substrate from a polishing pad are described. A substrate is pulled away from the polishing pad such that the edges of the substrate are pulled away from the polishing pad before the center of the substrate is pulled from the polishing pad.Type: GrantFiled: December 2, 2004Date of Patent: July 25, 2006Assignee: Applied MaterialsInventors: Hung Chih Chen, Steven M. Zuniga, Tsz-Sin Siu
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Publication number: 20060019582Abstract: Techniques for removing a substrate from a polishing pad are described. A substrate is pulled away from the polishing pad such that the edges of the substrate are pulled away from the polishing pad before the center of the substrate is pulled from the polishing pad.Type: ApplicationFiled: December 2, 2004Publication date: January 26, 2006Inventors: Hung Chen, Steven Zuniga, Tsz-Sin Siu
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Publication number: 20050211377Abstract: A carrier head for chemical mechanical polishing of a substrate includes a base and a flexible membrane extending beneath the base. The flexible membrane includes a central portion with an outer surface providing a substrate receiving surface, a perimeter portion connecting the central portion to the base, and at least one flap extending from an inner surface of the central portion. The flap divides a volume between the flexible membrane and the base into a plurality of chambers, and the flap includes a laterally extending first section and an angled second section extending beneath the first section and connecting the laterally extending first section to the central portion.Type: ApplicationFiled: March 26, 2004Publication date: September 29, 2005Inventors: Hung Chen, Jeonghoon Oh, Tsz-Sin Siu, Thomas Brezoczky, Steven Zuniga