Patents by Inventor Tu Shao Chi

Tu Shao Chi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080071415
    Abstract: A method of communicating semiconductor manufacturing information. The method includes providing, by a first service provider, a lot of semiconductor components to a second service provider for processing. The method also includes receiving from the second service provider, by the first service provider, first information associated with the processing. The method further includes outputting to a customer, by the first service provider, second information determined in response to the first information.
    Type: Application
    Filed: November 6, 2007
    Publication date: March 20, 2008
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY. LTD.
    Inventors: Hui-Jye HSHIEH, Tu Shao Chi, Jung-Yi Tsai, Chui-Chung Chiu, Wendy Chang
  • Patent number: 7315827
    Abstract: A method of communicating semiconductor manufacturing information. The method includes providing, by a first service provider, a lot of semiconductor components to a second service provider for processing. The method also includes receiving from the second service provider, by the first service provider, first information associated with the processing. The method further includes outputting to a customer, by the first service provider, second information determined in response to the first information.
    Type: Grant
    Filed: April 12, 2004
    Date of Patent: January 1, 2008
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hui-Jye Hshieh, Tu Shao Chi, Jung-Yi Tsai, Chui-Chung Chiu, Wendy Chang
  • Publication number: 20050240454
    Abstract: A method of communicating semiconductor manufacturing information. The method includes providing, by a first service provider, a lot of semiconductor components to a second service provider for processing. The method also includes receiving from the second service provider, by the first service provider, first information associated with the processing. The method further includes outputting to a customer, by the first service provider, second information determined in response to the first information.
    Type: Application
    Filed: April 12, 2004
    Publication date: October 27, 2005
    Applicant: Taiwan Semiconductor Manufacturing Co. Ltd.
    Inventors: Hui-Jye Hshieh, Tu Shao Chi, Jung-Yi Tsai, Chui-Chung Chiu, Wendy Chang
  • Publication number: 20050086120
    Abstract: The present disclosure provides a method of business-to-business exchange between customers in a semiconductor manufacturing environment. In one embodiment, the method includes exchanging a product from a primary provider to a secondary provider, assigning event elements to the product through a virtual fab, and transmitting information associated with the product throughout the virtual fab, wherein the transmission of information occurs multi-directionally between the entities of the virtual fab and controlling the flow of information and the product through the virtual fab. The controlling flow is multi-directional throughout the virtual fab.
    Type: Application
    Filed: October 16, 2003
    Publication date: April 21, 2005
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Tu Shao-Chi, Tsai Jung-Yi