Patents by Inventor Tu Won Chang

Tu Won Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8502334
    Abstract: Disclosed is an image sensor including a photo-sensing device, a color filter positioned on the photo-sensing device, a microlens positioned on the color filter, and an insulation layer positioned between the photo-sensing device and the color filter, and including a trench exposing the photo-sensing device and a filler filled in the trench. The filler has light transmittance of about 85% or more at a visible ray region, and a higher refractive index than the insulation layer. A method of manufacturing the image sensor is also provided.
    Type: Grant
    Filed: September 20, 2011
    Date of Patent: August 6, 2013
    Assignee: Cheil Industries Inc.
    Inventors: Kil-Sung Lee, Jae-Hyun Kim, Chang-Min Lee, Eui-June Jeong, Min-Soo Kim, Hwan-Sung Cheon, Tu-Won Chang
  • Publication number: 20120007200
    Abstract: Disclosed is an image sensor including a photo-sensing device, a color filter positioned on the photo-sensing device, a microlens positioned on the color filter, and an insulation layer positioned between the photo-sensing device and the color filter, and including a trench exposing the photo-sensing device and a filler filled in the trench. The filler has light transmittance of about 85% or more at a visible ray region, and a higher refractive index than the insulation layer. A method of manufacturing the image sensor is also provided.
    Type: Application
    Filed: September 20, 2011
    Publication date: January 12, 2012
    Applicant: CHEIL INDUSTRIES INC.
    Inventors: Kil-Sung LEE, Jae-Hyun KIM, Chang-Min LEE, Eui-June JEONG, Min-Soo KIM, Hwan-Sung CHEON, Tu-Won CHANG
  • Patent number: 7851789
    Abstract: The present invention provides a photosensitive resin composition for a pad protective layer that includes (A) an alkali soluble resin, (B) a reactive unsaturated compound, (C) a photoinitiator, and (D) a solvent. The (A) alkali soluble resin includes a copolymer including about 5 to about 50 wt % of a unit having the Chemical Formula 1, about 1 to about 25 wt % of a unit having the Chemical Formula 2, and about 45 to about 90 wt % of a unit having the Chemical Formula 3, and a method of making an image sensor using the photosensitive resin composition.
    Type: Grant
    Filed: December 8, 2008
    Date of Patent: December 14, 2010
    Assignee: Cheil Industries Inc.
    Inventors: Kil-Sung Lee, Jae-Hyun Kim, Chang-Min Lee, Eui-June Jeong, Kwen-Woo Han, O-Bum Kwon, Jung-Sik Choi, Jong-Seob Kim, Tu-Won Chang, Jung-Hyun Cho, Seul-Young Jeong
  • Patent number: 7700007
    Abstract: Disclosed herein is an anisotropic conductive film forming composition, including at least one polymer comprising a polymer containing a silane group; at least one polymerizable compound; and a plurality of conductive particles. The at least one polymer may include an elastomeric polymer and a filler polymer, at least one of which contains a silane group. The at least one polymerizable compound may include a cross-linking agent and/or a polymerization reaction enhancer. The cross-linking agent may also have a silane group. In addition, the film forming composition may include a solvent. The film forming composition is advantageous in that the resulting anisotropic conductive film exhibits enhanced peel and adhesive strength and low electrical contact resistance.
    Type: Grant
    Filed: November 14, 2005
    Date of Patent: April 20, 2010
    Assignee: Cheil Industries, Inc.
    Inventors: Ki Sung Jung, Jeong Ku Kang, Jung Sik Choi, Jong Hwa Lee, Hyoun Young Kim, Tu Won Chang
  • Publication number: 20090146236
    Abstract: The present invention provides a photosensitive resin composition for a pad protective layer that includes (A) an alkali soluble resin, (B) a reactive unsaturated compound, (C) a photoinitiator, and (D) a solvent. The (A) alkali soluble resin includes a copolymer including about 5 to about 50 wt % of a unit having the Chemical Formula 1, about 1 to about 25 wt % of a unit having the Chemical Formula 2, and about 45 to about 90 wt % of a unit having the Chemical Formula 3, and a method of making an image sensor using the photosensitive resin composition.
    Type: Application
    Filed: December 8, 2008
    Publication date: June 11, 2009
    Applicant: CHEIL INDUSTRIES INC.
    Inventors: Kil-Sung LEE, Jae-Hyun KIM, Chang-Min LEE, Eui-June JEONG, Kwen-Woo HAN, O-Bum KWON, Jung-Sik CHOI, Jong-Seob KIM, Tu-Won CHANG, Jung-Hyun CHO, Seul-Young JEONG
  • Patent number: 6855458
    Abstract: Disclosed is a non-aqueous electrolyte composition for batteries, which is composed of a mixture of a fluorobenzene component and a carbonic acid ester component in which the volume ratio of the fluorobenzene component to the carbonic acid ester component ranges from 50:50 to 5:95. The non-aqueous electrolyte composition has a significant advantage over electrolyte compositions employing carbonic acid ester solvents only, in terms of low temperature performance, cell life, and high-temperature dischargeability.
    Type: Grant
    Filed: December 24, 1999
    Date of Patent: February 15, 2005
    Assignees: Cheil Industries, Inc., Samsung SDI Co., Ltd.
    Inventors: Jong Seob Kim, Young Gyu Kim, Tu Won Chang, Kwang Sik Kim, Jin Sung Kim, Ky Hoon Ahn
  • Patent number: 6551367
    Abstract: There is disclosed a process for preparing a metal oxide CMP slurry suitable for semiconductor devices, wherein a mixture comprising 1 to 50 weight % of a metal oxide and 50 to 99 weight % of water is mixed in a pre-mixing tank, transferred to a dispersion chamber with the aid of a transfer pump, allowed to have a flow rate of not less than 100 m/sec by pressurization with a high pressure pump, and subjected to counter collision for dispersion through two orifices in the dispersion chamber. The slurry has particles which are narrow in particle size distribution, showing an ultrafine size ranging from 30 to 500 nm. Also, the slurry is not polluted at all during its preparation and shows no tailing phenomena, so that it is preventive of &mgr;-scratching. Therefore, it can be used in the planarization for shallow trench isolation, interlayer dielectrics and inter metal dielectrics through a CMP process.
    Type: Grant
    Filed: May 31, 2001
    Date of Patent: April 22, 2003
    Assignee: Cheil Industries Inc.
    Inventors: Kil Sung Lee, Jae Seok Lee, Seok Jin Kim, Tu Won Chang
  • Patent number: 6488730
    Abstract: The present invention relates to a polishing composition comprising 30 to 99 wt % of deionized water, 0.1 to 50 wt % of powder of metallic oxide and 0.01 to 20 wt % of cyclic amine. This polishing composition can be used in a chemical mechanical polishing of thin films in integrated circuit manufacturing and has an effect of minimizing the occurrence of microscratches on the thin film after polishing. Thereby it can be applied to the manufacturing process of highly integrated circuits such as Shallow Trench Isolation.
    Type: Grant
    Filed: May 7, 2001
    Date of Patent: December 3, 2002
    Assignee: Cheil Industries, Inc.
    Inventors: Kil Sung Lee, Jae Seok Lee, Seok Jin Kim, Young Ki Lee, Tu Won Chang
  • Patent number: 6447694
    Abstract: Disclosed is a polishing composition which comprises an Al2O3/SiO2 composite-based metal oxide powder, deionized water and an additive, said metal oxide powder comprising an Al2O3/SiO2 composite as an essential component. The polishing composition is superior in removal rate and free of causing microscratches after polishing and thus, suitable for use in the global planarization of device wafer surfaces.
    Type: Grant
    Filed: June 22, 2000
    Date of Patent: September 10, 2002
    Assignee: Cheil Industries, Inc.
    Inventors: Kil Sung Lee, Seok Jin Kim, Jae Seok Lee, Tu Won Chang
  • Patent number: 6364919
    Abstract: Disclosed is a process for preparing metal oxide slurries suitable for the chemical mechanical polishing (CMP) of semiconductor devices. A suspension of metal oxide in water is dispersed at a predetermined pressure through an orifice of a dispersion chamber while two intensifier pumps are used to maintain the pressure applied to the dispersion chamber constantly, resulting in restraining or minimizing the generation of macro particles as large as or larger than 1 &mgr;m. The metal oxide slurries are uniform in particle size with narrow particle size distribution and show excellent polishing performance with a significant reduction in the occurrence frequency of microscratches, so that they are suitable for CMP of ultra-integrated semiconductor devices.
    Type: Grant
    Filed: March 27, 2000
    Date of Patent: April 2, 2002
    Assignee: Cheil Industries, Inc.
    Inventors: Kil Sung Lee, Jae Seok Lee, Seok Jin Kim, Tu Won Chang
  • Publication number: 20020022369
    Abstract: The present invention relates to a polishing composition comprising 30 to 99 wt % of deionized water, 0.1 to 50 wt % of powder of metallic oxide and 0.01 to 20 wt % of cyclic amine.
    Type: Application
    Filed: May 7, 2001
    Publication date: February 21, 2002
    Inventors: Kil Sung Lee, Jae Seok Lee, Seok Jin Kim, Young Ki Lee, Tu Won Chang
  • Publication number: 20010034979
    Abstract: There is disclosed a process for preparing a metal oxide CMP slurry suitable for semiconductor devices, wherein a mixture comprising 1 to 50 weight % of a metal oxide and 50 to 99 weight % of water is mixed in a pre-mixing tank, transferred to a dispersion chamber with the aid of a transfer pump, allowed to have a flow rate of not less than 100 m/sec by pressurization with a high pressure pump, and subjected to counter collision for dispersion through two orifices in the dispersion chamber. The slurry has particles which are narrow in particle size distribution, showing an ultrafine size ranging from 30 to 500 nm. Also, the slurry is not polluted at all during its preparation and shows no tailing phenomena, so that it is preventive of &mgr;-scratching. Therefore, it can be used in the planarization for shallow trench isolation, interlayer dielectrics and inter metal dielectrics through a CMP process.
    Type: Application
    Filed: May 31, 2001
    Publication date: November 1, 2001
    Inventors: Kll Sung Lee, Jae Seok Lee, Seok Jin Kim, Tu Won Chang
  • Patent number: 6248818
    Abstract: Disclosed are polythiophene-based conductive polymer liquid compositions of high conductivity and transparency. The compositions comprise 16-32 weight % of an aqueous polythiophene-based conductive polymer solution, 52-80 weight % of an alcohol solvent, 1-12 weight % of an amide solvent, 0.01-0.4 weight % of a sulfonic acid group-containing monomer dopant, and optionally 2-8 weight % of an alkoxysilane. The compositions can be applied to transparent substrates to form coatings which have a surface resistance of 1 k&OHgr;/□ or less and a transmittance of 92% or higher. With the excellent conductivity and transparency, the compositions are useful as electromagnetic wave-shielding materials, finding numerous applications in cathode ray tube screens (TV sets and computer monitors) as well as CPP films, polyethyleneterephthalate films, polycarbonate panels, and acryl panels.
    Type: Grant
    Filed: November 3, 1999
    Date of Patent: June 19, 2001
    Assignee: Samsung General Chemicals Co. Ltd.
    Inventors: Hyun Don Kim, Hae Ryong Chung, Min Kyo Cheong, Tu Won Chang
  • Patent number: 6235827
    Abstract: Disclosed is a polymer composition for coatings with high refractivity, conductivity and transparency. The composition comprises 2-20 weight % of an aqueous polythiophene-based conductive polymer solution having a solid content of 1.2-1.5 weight %; 0.5-20 weight % of a highly refractive, inorganic sol solution having a solid content of 14-16 weight %; 50-97.4 weight % of an alcohol containing 1-3 carbon atoms; 0.1-10 weight % of an amide solvent; 0.005-0.1 weight % of a water- or an alcohol-soluble resin binder; and 0.005-0.05 weight % of a sulfonic acid group-containing monomer dopant. The composition can be applied to CRT external glass and other transparent substrates to allow thin films which have a refractive index of 1.6-2.0, a transmittance of 90-98% and a surface resistance of 1×103-1×108 &OHgr;/□.
    Type: Grant
    Filed: December 7, 1999
    Date of Patent: May 22, 2001
    Assignee: Cheil Industries, Inc.
    Inventors: Hyun Don Kim, Hae Ryong Chung, Min Kyo Cheong, Tu Won Chang