Abstract: The proposed mechanism for weld detection, uses isolation monitoring circuits (which is used for measurement of the leakage current between battery positive and negative to the chassis ground (on pack or link side) and checks the health status of the contactors. The mechanism connects isolation monitoring circuit between two points on the battery pack (between two sides of the high current contactors) and measures the resistance of two points, therefore checking the continuity of the contactors in the system. Since it can measure a range of resistance, it can also check if a contactor is completely welded or it has been partially welded. This would be important because in case of partial weld, the car can fix the problem and remove the partial weld by activating and deactivating the contactors for several time, with or without inserting high current in the coil of the contactors.

Abstract: The proposed mechanism for weld detection, uses isolation monitoring circuits (which is used for measurement of the leakage current between battery positive and negative to the chassis ground (on pack or link side) and checks the health status of the contactors. The mechanism connects isolation monitoring circuit between two points on the battery pack (between two sides of the high current contactors) and measures the resistance of two points, therefore checking the continuity of the contactors in the system. Since it can measure a range of resistance, it can also check if a contactor is completely welded or it has been partially welded. This would be important because in case of partial weld, the car can fix the problem and remove the partial weld by activating and deactivating the contactors for several time, with or without inserting high current in the coil of the contactors.

Abstract: A photovoltaic system includes voltage limiting devices that are connected in series. A voltage limiting device clips a corresponding photovoltaic string to limit a voltage of the photovoltaic string. Unclipping of clipped photovoltaic strings is coordinated by a central controller or in a distributed fashion by the voltage limiting devices based on monitored string conditions.

Abstract: A photovoltaic system includes voltage limiting devices that are connected in series. A voltage limiting device clips a corresponding photovoltaic string to limit a voltage of the photovoltaic string. Unclipping of clipped photovoltaic strings is coordinated by a central controller or in a distributed fashion by the voltage limiting devices based on monitored string conditions.

Abstract: A method of detecting a fault of a switching electricity source having a control stage responsive to a setpoint signal to deliver a control signal that is modulated with a predetermined duty ratio (?) to a power stage that is to deliver electricity to a load. The method includes the steps of: determining at least one nominal value (?min, ?max) for the duty ratio for normal operation, and at least one fault threshold (?SC, ?OC) as a function of the nominal value; determining at least one instantaneous value (?) of the duty ratio of the signal issued by the control stage; and comparing the instantaneous value with the fault threshold. A detection circuit implementing the method is also provided.

Abstract: A method of detecting a failure of an alternator supplying three-phase electricity to a load, the method comprising the steps of determining a duty ratio for each of the phases at the output of the alternator, determining phase differences between the phases at the output of the alternator; and determining the presence of a failure as a function of the phase differences and as a function of a comparison of the duty ratios. A power supply device is also provided for implementing the method.

Abstract: A method of detecting a failure of an alternator supplying three-phase electricity to a load, the method comprising the steps of determining a duty ratio for each of the phases at the output of the alternator, determining phase differences between the phases at the output of the alternator; and determining the presence of a failure as a function of the phase differences and as a function of a comparison of the duty ratios. A power supply device is also provided for implementing the method.

Abstract: A method of detecting a fault of a switching electricity source having a control stage responsive to a setpoint signal to deliver a control signal that is modulated with a predetermined duty ratio (?) to a power stage that is to deliver electricity to a load. The method includes the steps of: determining at least one nominal value (?min, ?max) for the duty ratio for normal operation, and at least one fault threshold (?SC, ?OC) as a function of the nominal value; determining at least one instantaneous value (?) of the duty ratio of the signal issued by the control stage; and comparing the instantaneous value with the fault threshold. A detection circuit implementing the method is also provided.

Abstract: The present invention relates to compositions for the chemical mechanical planarization (“CMP”) of barrier/adhesion layers, particularly Ta/TaN barrier/adhesion layers as occur in the manufacture of integrated circuits. CMP compositions comprise an aqueous solution of oxidizer and colloidal silica abrasive. Oxidizers include hydroxylamine nitrate, nitric acid, benzotriazole, ammonium nitrate, aluminum nitrate, hydrazine and mixtures thereof in aqueous solution.

Abstract: The present invention relates to compositions for the chemical mechanical planarization (“CMP”) of barrier/adhesion layers, particularly Ta/TaN barrier/adhesion layers as occur in the manufacture of integrated circuits. CMP compositions comprise an aqueous solution of oxidizer and colloidal silica abrasive. Oxidizers include hydroxylamine nitrate, nitric acid, benzotriazole, ammonium nitrate, aluminum nitrate, hydrazine and mixtures thereof in aqueous solution.

Abstract: The present invention relates chemical mechanical planarization (“CMP”) of copper surfaces and describes copper CMP slurries including an oxidizer, one or more hydroxylamine compounds and at least one abrasive. The hydroxylamine compositions can include hydroxylamine nitrate, hydroxylamine, hydroxylamine sulfate, hydroxyl ammonium salts and mixtures thereof. The oxidizers may further include citric acid as a complexing agent for copper. Sulfuric acid and/or nitric acid provide means for modifying the pH of the oxidizer so that the hydroxylamine chemistries are acidic. Some embodiments include corrosion inhibitors such as benzotriazole, 2,4-pentadione dioxime and/or 1,6-dioxaspiro[4,4] nonane 2,7-dione. Some embodiments also include a free radical inhibitor, advantageously hydrazine. Colloidal silica and milled alumina are used as typical abrasive components.

Abstract: An apparatus for polishing a workpiece includes a workpiece holder configured to hold the workpiece, a polishing member configured to be positioned adjacent to a face of the workpiece in order to polish the workpiece face with a front side of the polishing member, and a platen having a plurality of pressure zones configured to selectively apply pressure to the polishing member thereby causing the polishing member to contact the workpiece face with selective pressure. In another embodiment, the apparatus includes a pressure controller coupled to the platen and configured to selectively adjust the pressure zones.

Abstract: Methods of blow drying vehicles with two or three superimposed dryers mounted for linear movement along the length of a vehicle include blow dryers having either fixed or pivotal nozzles so that air can be blown at the vehicle in predetermined patterns that have been found to more efficiently dry the vehicle. Further, a pivotal nozzle system is disclosed wherein a frustoconical nozzle is pivotally mounted on a horizontal axis for reciprocating movement by a linear actuator so that the nozzle can be oriented in desirable positions for effecting the drying operations described in the disclosed methods.

Abstract: An apparatus for polishing a workpiece includes a workpiece holder configured to hold the workpiece, a polishing member configured to be positioned adjacent to a face of the workpiece in order to polish the workpiece face with a front side of the polishing member, and a platen having a plurality of pressure zones configured to selectively apply pressure to the polishing member thereby causing the polishing member to contact the workpiece face with selective pressure. In another embodiment, the apparatus includes a pressure controller coupled to the platen and configured to selectively adjust the pressure zones.

Abstract: A method of polishing a plurality of layers on a surface of a semiconductor wafer includes polishing a first layer using a polishing solution on a first portion of polishing pad and polishing another layer using a polishing solution on another portion of polishing pad. The polishing solution used for each layer is preferably suited to polish its respective layer. The different portions of polishing pad, likewise, are preferably suited to polish a corresponding wafer layer. The different portions of polishing pad may be located on the same pad or on different pads.

Abstract: The invention relates to a selective barrier slurry comprising abrasive particles, a barrier removal chemical, and a pH adjusting agent useful for adjusting the pH of the composition. In particular, the inventive slurry comprises abrasive particles, a barrier removal chemical, and a component useful for adjusting the pH of the composition. The content of the abrasive particles comprise about 0.1% to about 5% of the slurry, preferably from about 1% to about 2%. The pH adjusting component can be any component that is able to adjust the pH of the slurry to the desired range. The final pH of the slurry is alkaline and is preferably in the range of about 7 to about 12, and more preferably in the range of about 9 to about 10. The slurry may also contain additives or surfactants, which can be used to increase the stability of the silica.

Abstract: The present invention relates to compositions for the chemical mechanical planarization (“CMP”) of barrier/adhesion layers, particularly Ta/TaN barrier/adhesion layers as occur in the manufacture of integrated circuits. CMP compositions comprise an aqueous solution of oxidizer and colloidal silica abrasive. Oxidizers include hydroxylamine nitrate, nitric acid, benzotriazole, ammonium nitrate, aluminum nitrate, hydrazine and mixtures thereof in aqueous solution.

Abstract: The present invention relates chemical mechanical planarization (“CMP”) of copper surfaces and describes copper CMP slurries including an oxidizer, one or more hydroxylamine compounds and at least one abrasive. The hydroxylamine compositions can include hydroxylamine nitrate, hydroxylamine, hydroxylamine sulfate, hydroxyl ammonium salts and mixtures thereof. The oxidizers may further include citric acid as a complexing agent for copper. Sulfuric acid and/or nitric acid provide means for modifying the pH of the oxidizer so that the hydroxylamine chemistries are acidic. Some embodiments include corrosion inhibitors such as benzotriazole, 2,4-pentadione dioxime and/or 1,6-dioxaspiro[4,4]nonane 2,7-dione. Some embodiments also include a free radical inhibitor, advantageously hydrazine. Colloidal silica and milled alumina are used as typical abrasive components.