Patents by Inventor Tuck Cheong

Tuck Cheong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20110016310
    Abstract: A secure system having a Trusted Platform Module coupled between a peripheral device and a host. In operation, the Trusted Platform Module is provided to control communication between the peripheral device and the host.
    Type: Application
    Filed: July 20, 2009
    Publication date: January 20, 2011
    Applicant: INFINEON TECHNOLOGIES AG
    Inventor: Tuck Cheong YONG
  • Patent number: 7841045
    Abstract: The hand-held air blower has a hollow, substantially cylindrical housing with an open front end, a plurality of air intake openings, an impeller situated within the housing proximate the intake openings, a motor for driving the impeller, and battery means for powering the motor. A concentrator attachment is designed for use with the blower. The concentrator has means for removably attaching the concentrator to the open front end of the blower housing and a hollow shell. The shell includes an intake section with a diameter substantially equal to the diameter of the front end of the housing and an outlet section with an outlet opening substantially smaller than the diameter of the front end of the housing. A truncated football-like shaped balancing member is provided. The balancing member has a central air flow channel.
    Type: Grant
    Filed: August 6, 2007
    Date of Patent: November 30, 2010
    Assignee: WD-40 Company
    Inventors: Gad Shaanan, Pius Yung-Tuck Cheong
  • Patent number: 7741161
    Abstract: A method for making an IC package with transparent encapsulant includes providing a leadframe, where the leadframe includes a first die pad and a second die pad, disposing a first die on the first die pad and a second die on the second die pad, forming a cavity on the leadframe, where the cavity includes the first die pad and the second die pad, injecting an encapsulant material into the cavity and cutting the injected encapsulant material and the leadframe to form a first IC package and a second IC package. The encapsulant material is transparent for visible wavelengths. The injection of the encapsulant material is performed at an encapsulant temperature ranging from 140° C. to 160° C.
    Type: Grant
    Filed: June 30, 2008
    Date of Patent: June 22, 2010
    Assignee: Carsem (M) Sdn. Bhd.
    Inventors: Ah Lek Khor, Kock Huat Lee, Boon Meng Chan, Min Kong Thum, Hong Mun Tung, Mun Tuck Cheong
  • Publication number: 20090038108
    Abstract: The hand-held air blower has a hollow, substantially cylindrical housing with an open front end, a plurality of air intake openings, an impeller situated within the housing proximate the intake openings, a motor for driving the impeller, and battery means for powering the motor. A concentrator attachment is designed for use with the blower. The concentrator has means for removably attaching the concentrator to the open front end of the blower housing and a hollow shell. The shell includes an intake section with a diameter substantially equal to the diameter of the front end of the housing and an outlet section with an outlet opening substantially smaller than the diameter of the front end of the housing. A truncated football-like shaped balancing member is provided. The balancing member has a central air flow channel.
    Type: Application
    Filed: August 6, 2007
    Publication date: February 12, 2009
    Inventors: Gad Shaanan, Pius Yung-Tuck Cheong
  • Publication number: 20080286901
    Abstract: A method for making an IC package with transparent encapsulant includes providing a leadframe, where the leadframe includes a first die pad and a second die pad, disposing a first die on the first die pad and a second die on the second die pad, forming a cavity on the leadframe, where the cavity includes the first die pad and the second die pad, injecting an encapsulant material into the cavity and cutting the injected encapsulant material and the leadframe to form a first IC package and a second IC package. The encapsulant material is transparent for visible wavelengths. The injection of the encapsulant material is performed at an encapsulant temperature ranging from 140° C. to 160° C.
    Type: Application
    Filed: June 30, 2008
    Publication date: November 20, 2008
    Applicant: Carsem (M) Sdn. Bhd.
    Inventors: Ah Lek Khor, Kock Huat Lee, Boon Meng Chan, Min Kong Thum, Hong Mun Tung, Mun Tuck Cheong
  • Publication number: 20050167790
    Abstract: IC package with transparent encapsulant and method for making thereof. The IC package includes a die pad including a pad bottom surface, a die disposed on the die pad and including an integrated circuit, a plurality of leads including a plurality of lead bottom surfaces, a plurality of conductive wires connecting the die and the plurality of leads, and an encapsulant material. The encapsulant material is transparent for visible wavelengths. The pad bottom surface is exposed without being covered by the encapsulant material, and the plurality of lead bottom surfaces each are exposed without being covered by the encapsulant material.
    Type: Application
    Filed: December 29, 2004
    Publication date: August 4, 2005
    Applicant: Carsem (M) Sdn.Bhd.
    Inventors: Lek Khor, Huat Lee, Meng Chan, Kong Thum, Mun Tung, Tuck Cheong