Patents by Inventor Tuhin Guha Neogi
Tuhin Guha Neogi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10559503Abstract: At least one method, apparatus and system disclosed herein for forming a finFET device having a pass-through structure. A first gate structure and a second gate structure are formed on a semiconductor wafer. A first active area is formed on one end of the first and second gate structures. A second active area is formed on the other end of the first and second gate structures. A trench silicide (TS) structure self-aligned to the first and second gate structures is formed. The TS structure is configured to operatively couple the first active area to the second active area.Type: GrantFiled: October 9, 2017Date of Patent: February 11, 2020Assignee: GLOBALFOUNDRIES INC.Inventors: Guillaume Bouche, Tuhin Guha Neogi, Andy Chi-Hung Wei, Jia Zeng, Jongwook Kye, Jason Eugene Stephens, Irene Yuh-Ling Lin, Sudharshanan Raghunathan, Lei Yuan
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Patent number: 10262941Abstract: Semiconductor devices and methods of fabricating the semiconductor devices with cross coupled contacts using patterning for cross couple pick-up are disclosed. One method includes, for instance: obtaining an intermediate semiconductor device; performing a first lithography to pattern a first shape; performing a second lithography to pattern a second shape overlapping a portion of the first shape; processing the first shape and the second shape to form an isolation region at the overlap; and forming four regions separated by the isolation region. An intermediate semiconductor device is also disclosed.Type: GrantFiled: April 22, 2016Date of Patent: April 16, 2019Assignee: GLOBALFOUNDRIES Inc.Inventors: Guillaume Bouche, Jason Eugene Stephens, Tuhin Guha Neogi, Kai Sun, Deniz Elizabeth Civay, David Charles Pritchard, Andy Wei
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Patent number: 10236350Abstract: At least one method, apparatus and system disclosed herein for forming a finFET device. A gate structure comprising a gate spacer on a semiconductor wafer is formed. A self-aligned contact (SAC) cap is formed over the gate structure. A TS structure is formed. At least one M0 metal structure void is formed. At least one CB structure void adjacent the M0 metal structure void is formed. An etch process is performed the M0 and CB structures voids to the gate structure. At least one CA structure void adjacent the CB structure void is formed. The M0, CB, and CA structure voids are metallized.Type: GrantFiled: March 11, 2016Date of Patent: March 19, 2019Assignee: GLOBALFOUNDRIES INC.Inventors: Guillaume Bouche, Tuhin Guha Neogi, Sudharshanan Raghunathan, Andy Chi-Hung Wei, Jason Eugene Stephens, Vikrant Kumar Chauhan, David Michael Permana
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Patent number: 10181522Abstract: Structures for a field-effect transistor and fabrication methods for forming a structure for a field-effect transistor. The structure may include a gate electrode, a source/drain region formed adjacent to a vertical sidewall of the gate electrode, and a conductive link that couples the vertical sidewall of the gate electrode with the source/drain region.Type: GrantFiled: February 21, 2017Date of Patent: January 15, 2019Assignee: GLOBALFOUNDRIES Inc.Inventors: Tuhin Guha Neogi, Scott D. Luning, David Pritchard, Kasun Anupama Punchihewa
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Patent number: 10068806Abstract: At least one method, apparatus and system disclosed involves providing an integrated circuit having metal feature flyover over an middle-of-line (MOL) feature. A first location for a non-contact intersection region between a first middle of line (MOL) interconnect feature and a metal feature in a functional cell is determined. A dielectric feature is formed over the first MOL interconnect feature at the first location. The metal feature is formed over the dielectric layer, the dielectric layer providing a predetermined amount of voltage isolation between the first MOL interconnect feature and the metal feature.Type: GrantFiled: February 26, 2018Date of Patent: September 4, 2018Assignee: GLOBALFOUNDRIES INC.Inventors: David C. Pritchard, Tuhin Guha Neogi, Scott Luning, David Doman
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Publication number: 20180240885Abstract: Structures for a field-effect transistor and fabrication methods for forming a structure for a field-effect transistor. The structure may include a gate electrode, a source/drain region formed adjacent to a vertical sidewall of the gate electrode, and a conductive link that couples the vertical sidewall of the gate electrode with the source/drain region.Type: ApplicationFiled: February 21, 2017Publication date: August 23, 2018Inventors: Tuhin Guha Neogi, Scott D. Luning, David Pritchard, Kasun Anupama Punchihewa
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Patent number: 10056373Abstract: Embodiments of the present invention provide an improved semiconductor structure and methods of fabrication that provide transistor contacts that are self-aligned in two dimensions. Two different capping layers are used, each being comprised of a different material. The two capping layers are selectively etchable to each other. One capping layer is used for gate coverage while the other capping layer is used for source/drain coverage. Selective etch processes open the desired gates and source/drains, while block masks are used to cover elements that are not part of the connection scheme. A metallization line (layer) is deposited, making contact with the open elements to provide electrical connectivity between them.Type: GrantFiled: April 18, 2017Date of Patent: August 21, 2018Assignee: GLOBALFOUNDRIES INC.Inventors: Andy Chih-Hung Wei, Guillaume Bouche, Mark A. Zaleski, Tuhin Guha Neogi, Jason E. Stephens, Jongwook Kye, Jia Zeng
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Publication number: 20180182674Abstract: At least one method, apparatus and system disclosed involves providing an integrated circuit having metal feature flyover over an middle-of-line (MOL) feature. A first location for a non-contact intersection region between a first middle of line (MOL) interconnect feature and a metal feature in a functional cell is determined. A dielectric feature is formed over the first MOL interconnect feature at the first location. The metal feature is formed over the dielectric layer, the dielectric layer providing a predetermined amount of voltage isolation between the first MOL interconnect feature and the metal feature.Type: ApplicationFiled: February 26, 2018Publication date: June 28, 2018Applicant: GLOBALFOUNDRIES INC.Inventors: David C. Pritchard, Tuhin Guha Neogi, Scott Luning, David Doman
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Publication number: 20180108571Abstract: At least one method, apparatus and system disclosed involves providing an integrated circuit having metal feature flyover over an middle-of-line (MOL) feature. A first location for a non-contact intersection region between a first middle of line (MOL) interconnect feature and a metal feature in a functional cell is determined. A dielectric feature is formed over the first MOL interconnect feature at the first location. The metal feature is formed over the dielectric layer, the dielectric layer providing a predetermined amount of voltage isolation between the first MOL interconnect feature and the metal feature.Type: ApplicationFiled: October 14, 2016Publication date: April 19, 2018Applicant: GLOBALFOUNDRIES INC.Inventors: David C. Pritchard, Tuhin Guha Neogi, Scott Luning, David Doman
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Patent number: 9947590Abstract: At least one method, apparatus and system disclosed involves providing an integrated circuit having metal feature flyover over an middle-of-line (MOL) feature. A first location for a non-contact intersection region between a first middle of line (MOL) interconnect feature and a metal feature in a functional cell is determined. A dielectric feature is formed over the first MOL interconnect feature at the first location. The metal feature is formed over the dielectric layer, the dielectric layer providing a predetermined amount of voltage isolation between the first MOL interconnect feature and the metal feature.Type: GrantFiled: October 14, 2016Date of Patent: April 17, 2018Assignee: GLOBALFOUNDRIES INC.Inventors: David C. Pritchard, Tuhin Guha Neogi, Scott Luning, David Doman
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Publication number: 20180033701Abstract: At least one method, apparatus and system disclosed herein for forming a finFET device having a pass-through structure. A first gate structure and a second gate structure are formed on a semiconductor wafer. A first active area is formed on one end of the first and second gate structures. A second active area is formed on the other end of the first and second gate structures. A trench silicide (TS) structure self-aligned to the first and second gate structures is formed. The TS structure is configured to operatively couple the first active area to the second active area.Type: ApplicationFiled: October 9, 2017Publication date: February 1, 2018Applicant: GLOBALFOUNDRIES INC.Inventors: Guillaume Bouche, Tuhin Guha Neogi, Andy Chi-Hung Wei, Jia Zeng, Jongwook Kye, Jason Eugene Stephens, Irene Yuh-Ling Lin, Sudharshanan Raghunathan, Lei Yuan
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Patent number: 9818651Abstract: At least one method, apparatus and system disclosed herein for forming a finFET device having a pass-through structure. A first gate structure and a second gate structure are formed on a semiconductor wafer. A first active area is formed on one end of the first and second gate structures. A second active area is formed on the other end of the first and second gate structures. A trench silicide (TS) structure self-aligned to the first and second gate structures is formed. The TS structure is configured to operatively couple the first active area to the second active area.Type: GrantFiled: March 11, 2016Date of Patent: November 14, 2017Assignee: GlobalFoundries Inc.Inventors: Guillaume Bouche, Tuhin Guha Neogi, Andy Chi-Hung Wei, Jia Zeng, Jongwook Kye, Jason Eugene Stephens, Irene Yuh-Ling Lin, Sudharshanan Raghunathan, Lei Yuan
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Publication number: 20170309560Abstract: Semiconductor devices and methods of fabricating the semiconductor devices with cross coupled contacts using patterning for cross couple pick-up are disclosed. One method includes, for instance: obtaining an intermediate semiconductor device; performing a first lithography to pattern a first shape; performing a second lithography to pattern a second shape overlapping a portion of the first shape; processing the first shape and the second shape to form an isolation region at the overlap; and forming four regions separated by the isolation region. An intermediate semiconductor device is also disclosed.Type: ApplicationFiled: April 22, 2016Publication date: October 26, 2017Applicant: GLOBALFOUNDRIES Inc.Inventors: Guillaume BOUCHE, Jason Eugene STEPHENS, Tuhin GUHA NEOGI, Kai SUN, Deniz Elizabeth CIVAY, David Charles PRITCHARD, Andy WEI
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Publication number: 20170263506Abstract: At least one method, apparatus and system disclosed herein for forming a finFET device having a pass-through structure. A first gate structure and a second gate structure are formed on a semiconductor wafer. A first active area is formed on one end of the first and second gate structures. A second active area is formed on the other end of the first and second gate structures. A trench silicide (TS) structure self-aligned to the first and second gate structures is formed. The TS structure is configured to operatively couple the first active area to the second active area.Type: ApplicationFiled: March 11, 2016Publication date: September 14, 2017Applicant: GLOBALFOUNDRIES INC.Inventors: Guillaume Bouche, Tuhin Guha Neogi, Andy Chi-Hung Wei, Jia Zeng, Jongwook Kye, Jason Eugene Stephens, Irene Yuh-Ling Lin, Sudharshanan Raghunathan, Lei Yuan
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Publication number: 20170263715Abstract: At least one method, apparatus and system disclosed herein for forming a finFET device. A gate structure comprising a gate spacer on a semiconductor wafer is formed. A self-aligned contact (SAC) cap is formed over the gate structure. A TS structure is formed. At least one M0 metal structure void is formed. At least one CB structure void adjacent the M0 metal structure void is formed. An etch process is performed the M0 and CB structures voids to the gate structure. At least one CA structure void adjacent the CB structure void is formed. The M0, CB, and CA structure voids are metallized.Type: ApplicationFiled: March 11, 2016Publication date: September 14, 2017Inventors: Guillaume Bouche, Tuhin Guha Neogi, Sudharshanan Raghunathan, Andy Chi-Hung Wei, Jason Eugene Stephens, Vikrant Kumar Chauhan, David Michael Permana
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Publication number: 20170221886Abstract: Embodiments of the present invention provide an improved semiconductor structure and methods of fabrication that provide transistor contacts that are self-aligned in two dimensions. Two different capping layers are used, each being comprised of a different material. The two capping layers are selectively etchable to each other. One capping layer is used for gate coverage while the other capping layer is used for source/drain coverage. Selective etch processes open the desired gates and source/drains, while block masks are used to cover elements that are not part of the connection scheme. A metallization line (layer) is deposited, making contact with the open elements to provide electrical connectivity between them.Type: ApplicationFiled: April 18, 2017Publication date: August 3, 2017Inventors: Andy Chih-Hung Wei, Guillaume Bouche, Mark A. Zaleski, Tuhin Guha Neogi, Jason E. Stephens, Jongwook Kye, Jia Zeng
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Patent number: 9666488Abstract: A method of forming a silicide layer as a pass-through contact under a gate contact between p-epilayer and n-epilayer source/drains and the resulting device are provided. Embodiments include depositing a semiconductor layer over a substrate; forming a pFET gate on a p-side of the semiconductor layer and a nFET gate on a n-side of the semiconductor layer; forming a gate contact between the pFET gate and the nFET gate; forming raised source/drains on opposite sides of each of the pFET and nFET gates; and forming a metal silicide over a first raised source/drain on the p-side and over a second raised source/drain on the n-side, wherein the metal silicide extends from the first raised source/drain to the second raised source/drain and below the gate contact between the pFET and nFET gates.Type: GrantFiled: April 11, 2016Date of Patent: May 30, 2017Assignee: GLOBALFOUNDRIES INC.Inventors: Tuhin Guha Neogi, David Pritchard, Scott Luning, Guillaume Bouche, David Doman
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Patent number: 9660040Abstract: Embodiments of the present invention provide an improved semiconductor structure and methods of fabrication that provide transistor contacts that are self-aligned in two dimensions. Two different capping layers are used, each being comprised of a different material. The two capping layers are selectively etchable to each other. One capping layer is used for gate coverage while the other capping layer is used for source/drain coverage. Selective etch processes open the desired gates and source/drains, while block masks are used to cover elements that are not part of the connection scheme. A metallization line (layer) is deposited, making contact with the open elements to provide electrical connectivity between them.Type: GrantFiled: October 29, 2015Date of Patent: May 23, 2017Assignee: GLOBALFOUNDRIES INC.Inventors: Andy Chih-Hung Wei, Guillaume Bouche, Mark A. Zaleski, Tuhin Guha Neogi, Jason E. Stephens, Jongwook Kye, Jia Zeng
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Patent number: 9502528Abstract: An improved semiconductor structure and methods of fabrication that provide improved transistor contacts in a semiconductor structure are provided. A first block mask is formed over a portion of the semiconductor structure. This first block mask covers at least a portion of at least one source/drain (s/d) contact location. An s/d capping layer is formed over the s/d contact locations that are not covered by the first block mask. This s/d capping layer is comprised of a first capping substance. Then, a second block mask is formed over the semiconductor structure. This second block mask exposes at least one gate location. A gate capping layer, which comprises a second capping substance, is removed from the exposed gate location(s). Then a metal contact layer is deposited, which forms a contact to both the s/d contact location(s) and the gate contact location(s).Type: GrantFiled: August 26, 2014Date of Patent: November 22, 2016Assignee: GLOBALFOUNDRIES INC.Inventors: Guillaume Bouche, Jason E. Stephens, Tuhin Guha Neogi, Mark A. Zaleski, Andy Chih-Hung Wei
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Patent number: 9472455Abstract: A method is provided for fabricating cross-coupled line segments on a wafer for use, for instance, in fabricating cross-coupled gates of two or more transistors. The fabricating includes: patterning a first line segment with a first side projection using a first mask; and patterning a second line segment with a second side projection using a second mask. The second line segment is offset from the first line segment, and the patterned second side projection overlies the patterned first side projection, and facilitates defining a cross-stitch segment connecting the first and second line segments. The method further includes selectively cutting the first and second line segments in defining the cross-coupled line segments from the first and second line segments and the cross-stitch segment.Type: GrantFiled: April 7, 2014Date of Patent: October 18, 2016Assignee: GLOBALFOUNDRIES INC.Inventors: Jason E. Stephens, Lei Yuan, Lixia Lei, David Pritchard, Tuhin Guha Neogi