Patents by Inventor Tun-Ching PI
Tun-Ching PI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12185475Abstract: The present disclosure provides an electronic device and method of manufacturing the same. The electronic device includes a first region, a second region, an electronic component, and a first sensing element. The second region is adjacent to the first region. The first region has a first pliability. The second region has a second pliability. The second pliability is greater than the first pliability. The electronic component is disposed at the first region. The first sensing element is disposed at the second region and electrically connected to the electronic component.Type: GrantFiled: April 23, 2021Date of Patent: December 31, 2024Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Tun-Ching Pi, Ming-Hung Chen
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Patent number: 12165984Abstract: A semiconductor device package includes a number of interposers mounted to the carrier, wherein the number of interposers may be arranged in an irregular pattern.Type: GrantFiled: September 6, 2022Date of Patent: December 10, 2024Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Hao-Chih Hsieh, Tun-Ching Pi, Sung-Hung Chiang, Yu-Chang Chen
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Patent number: 12148679Abstract: A semiconductor device, a semiconductor package, and a method of manufacturing the same are provided. The semiconductor device includes an electronic component, a first thermal conductive layer, a second thermal conductive layer, and a solderable element. The first thermal conductive layer is disposed adjacent to a surface of the electronic component. The second thermal conductive layer is disposed on the first thermal conductive layer and exposes a portion of the first thermal conductive layer. The solderable element is disposed on the second thermal conductive layer.Type: GrantFiled: February 5, 2021Date of Patent: November 19, 2024Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventor: Tun-Ching Pi
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Patent number: 12119282Abstract: A semiconductor device package includes a carrier and an encapsulant disposed on the carrier. At least one portion of the encapsulant is spaced from the carrier by a space.Type: GrantFiled: July 28, 2022Date of Patent: October 15, 2024Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Tun-Ching Pi, Yen-Chi Huang, Hao-Chih Hsieh, Jin Han Shih
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Publication number: 20240126327Abstract: The present disclosure provides an electronic wearable device. The electronic wearable device includes a first module having a first contact and a second module having a second contact. The first contact is configured to keep electrical connection with the second contact in moving with respect to each other during a wearing period.Type: ApplicationFiled: October 14, 2022Publication date: April 18, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Chao Wei LIU, Wei-Hao CHANG, Yung-I YEH, Jen-Chieh KAO, Tun-Ching PI, Ming-Hung CHEN, Hui-Ping JIAN, Shang-Lin WU
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Patent number: 11776863Abstract: A semiconductor device package includes a carrier, a first interposer disposed and a second interposer. The second interposer is stacked on the first interposer, and the first interposer is mounted to the carrier. The combination of the first interposer and the second interposer is substantially T-shaped.Type: GrantFiled: August 17, 2021Date of Patent: October 3, 2023Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Hao-Chih Hsieh, Tun-Ching Pi, Sung-Hung Chiang, Yu-Chang Chen
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Publication number: 20220415810Abstract: A semiconductor device package includes a number of interposers mounted to the carrier, wherein the number of interposers may be arranged in an irregular pattern.Type: ApplicationFiled: September 6, 2022Publication date: December 29, 2022Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Hao-Chih HSIEH, Tun-Ching PI, Sung-Hung CHIANG, Yu-Chang CHEN
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Publication number: 20220367308Abstract: A semiconductor device package includes a carrier and an encapsulant disposed on the carrier. At least one portion of the encapsulant is spaced from the carrier by a space.Type: ApplicationFiled: July 28, 2022Publication date: November 17, 2022Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Tun-Ching PI, Yen-Chi HUANG, Hao-Chih HSIEH, Jin Han SHIH
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Publication number: 20220346239Abstract: The present disclosure provides an electronic device and method of manufacturing the same. The electronic device includes a first region, a second region, an electronic component, and a first sensing element. The second region is adjacent to the first region. The first region has a first pliability. The second region has a second pliability. The second pliability is greater than the first pliability. The electronic component is disposed at the first region. The first sensing element is disposed at the second region and electrically connected to the electronic component.Type: ApplicationFiled: April 23, 2021Publication date: October 27, 2022Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Tun-Ching PI, Ming-Hung CHEN
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Patent number: 11437322Abstract: A semiconductor device package includes a number of interposers mounted to the carrier, wherein the number of interposers may be arranged in an irregular pattern.Type: GrantFiled: September 4, 2019Date of Patent: September 6, 2022Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Hao-Chih Hsieh, Tun-Ching Pi, Sung-Hung Chiang, Yu-Chang Chen
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Publication number: 20220254699Abstract: A semiconductor device, a semiconductor package, and a method of manufacturing the same are provided. The semiconductor device includes an electronic component, a first thermal conductive layer, a second thermal conductive layer, and a solderable element. The first thermal conductive layer is disposed adjacent to a surface of the electronic component. The second thermal conductive layer is disposed on the first thermal conductive layer and exposes a portion of the first thermal conductive layer. The solderable element is disposed on the second thermal conductive layer.Type: ApplicationFiled: February 5, 2021Publication date: August 11, 2022Applicant: Advanced Semiconductor Engineering, Inc.Inventor: Tun-Ching PI
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Publication number: 20210375706Abstract: A semiconductor device package includes a carrier, a first interposer disposed and a second interposer. The second interposer is stacked on the first interposer, and the first interposer is mounted to the carrier. The combination of the first interposer and the second interposer is substantially T-shaped.Type: ApplicationFiled: August 17, 2021Publication date: December 2, 2021Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Hao-Chih HSIEH, Tun-Ching PI, Sung-Hung CHIANG, Yu-Chang CHEN
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Patent number: 11094602Abstract: A semiconductor device package includes a carrier, a first interposer disposed and a second interposer. The second interposer is stacked on the first interposer, and the first interposer is mounted to the carrier. The combination of the first interposer and the second interposer is substantially T-shaped.Type: GrantFiled: August 9, 2019Date of Patent: August 17, 2021Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Hao-Chih Hsieh, Tun-Ching Pi, Sung-Hung Chiang, Yu-Chang Chen
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Publication number: 20210043527Abstract: A semiconductor device package includes a carrier, a first interposer disposed and a second interposer. The second interposer is stacked on the first interposer, and the first interposer is mounted to the carrier. The combination of the first interposer and the second interposer is substantially T-shaped.Type: ApplicationFiled: August 9, 2019Publication date: February 11, 2021Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Hao-Chih HSIEH, Tun-Ching PI, Sung-Hung CHIANG, Yu-Chang CHEN
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Publication number: 20200083132Abstract: A semiconductor device package includes a carrier and an encapsulant disposed on the carrier. At least one portion of the encapsulant is spaced from the carrier by a space.Type: ApplicationFiled: May 10, 2019Publication date: March 12, 2020Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Yen-Chi HUANG, Hao-Chih HSIEH, Jin Han SHIH, Yung I. YEH, Tun-Ching PI
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Publication number: 20200083172Abstract: A semiconductor device package includes a number of interposers mounted to the carrier, wherein the number of interposers may be arranged in an irregular pattern.Type: ApplicationFiled: September 4, 2019Publication date: March 12, 2020Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Hao-Chih HSIEH, Tun-Ching PI, Sung-Hung CHIANG, Yu-Chang CHEN
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Patent number: 10083911Abstract: A semiconductor device package includes a flexible substrate, an electronic component, at least one flexible member, and a package body. The electronic component is disposed on the flexible substrate. The at least one flexible member is disposed on the flexible substrate. The package body encapsulates the electronic component and has a first part and a second part separated from the first part by the at least one flexible member.Type: GrantFiled: February 8, 2017Date of Patent: September 25, 2018Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Hao-Chih Hsieh, Tun-Ching Pi
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Publication number: 20180226348Abstract: A semiconductor device package includes a flexible substrate, an electronic component, at least one flexible member, and a package body. The electronic component is disposed on the flexible substrate. The at least one flexible member is disposed on the flexible substrate. The package body encapsulates the electronic component and has a first part and a second part separated from the first part by the at least one flexible member.Type: ApplicationFiled: February 8, 2017Publication date: August 9, 2018Inventors: Hao-Chih HSIEH, Tun-Ching PI