Abstract: The disclosure provides an electronic device including a substrate, a first semiconductor element, and a first protective structure. The first semiconductor element is disposed on the substrate and electrically connected to the substrate. The first semiconductor element has a first surface away from the substrate. The first protective structure covers at least a portion of the first surface.

Abstract: This disclosure provides a display apparatus and the sealing method thereof. The display apparatus includes: a substrate having a displaying region and a non-displaying region surrounding the displaying region; and a frit disposed on the non-displaying region to form a closed loop which surrounds the displaying region and has both a start portion and an end portion not overlapping each other; wherein a first light beam is applied to the frit to sinter it along the loop in a first direction, and a second light beam is applied to the frit to sinter it along the loop in a second direction, starting at the start portion and ending up at the end portion; wherein, the second direction is different from the first direction.

Abstract: An organic light emitting diode display panel is disclosed, which comprises: a first substrate having a first edge, a second edge, a third edge opposite to the first edge, and a fourth edge opposite to the second edge; a second substrate opposite to the first substrate; an organic light emitting diode unit disposed on the second substrate; a fit unit disposed between the first substrate and the second substrate and surrounding the organic light emitting diode unit; and a buffer unit disposed between the first substrate and the second substrate and between the frit unit facing to the first edge of the first substrate and the first edge thereof, wherein the buffer unit has a first end with a first cutting edge connecting to the second edge. In addition, the present invention also provides a method for manufacturing the same.

Abstract: A display device packaging method comprises steps of: providing a first substrate including a display region and a non-display region that surrounds the display region; providing an adhesive material which is disposed on the first substrate and formed into a closed curve surrounding the display region, wherein the closed curve has a start zone and an end zone connected to the start zone; providing a light-blocking element at least covering the end zone; providing a heating source radiating to the light-blocking element and moving the heating source to the start zone of the adhesive material; and scanning the adhesive material from the start zone to the end zone along the closed curve by the heating source. A display device is also disclosed.

Abstract: This disclosure provides a display apparatus and the sealing method thereof. The display apparatus includes: a substrate having a displaying region and a non-displaying region surrounding the displaying region; and a frit disposed on the non-displaying region to form a closed loop which surrounds the displaying region and has both a start portion and an end portion not overlapping each other; wherein a first light beam is applied to the frit to sinter it along the loop in a first direction, and a second light beam is applied to the frit to sinter it along the loop in a second direction, starting at the start portion and ending up at the end portion; wherein, the second direction is different from the first direction.

Abstract: An organic light-emitting diode device, including: a first substrate, wherein an organic light-emitting diode element is disposed on the first substrate; a second substrate, disposed to be opposite to the first substrate; a frit, disposed between the first substrate and the second substrate, having a laser pre-sintering start/end region and forming a closed space between the first substrate and the second substrate by laser sealing. At least one side of the laser pre-sintering start/end region has a gap, and the width of the gap is no bigger than 30% of the width of the frit.

Abstract: An organic light emitting diode display panel is disclosed, which comprises: a first substrate having a first edge, a second edge, a third edge opposite to the first edge, and a fourth edge opposite to the second edge; a second substrate opposite to the first substrate; an organic light emitting diode unit disposed on the second substrate; a fit unit disposed between the first substrate and the second substrate and surrounding the organic light emitting diode unit; and a buffer unit disposed between the first substrate and the second substrate and between the frit unit facing to the first edge of the first substrate and the first edge thereof, wherein the buffer unit has a first end with a first cutting edge connecting to the second edge. In addition, the present invention also provides a method for manufacturing the same.

Abstract: A display device packaging method comprises steps of: providing a first substrate including a display region and a non-display region that surrounds the display region; providing an adhesive material which is disposed on the first substrate and formed into a closed curve surrounding the display region, wherein the closed curve has a start zone and an end zone connected to the start zone; providing a light-blocking element at least covering the end zone; providing a heating source radiating to the light-blocking element and moving the heating source to the start zone of the adhesive material; and scanning the adhesive material from the start zone to the end zone along the closed curve by the heating source. A display device is also disclosed.

Abstract: This disclosure provides a display apparatus and the sealing method thereof. The display apparatus includes: a substrate having a displaying region and a non-displaying region surrounding the displaying region; and a frit disposed on the non-displaying region to form a closed loop which surrounds the displaying region and has both a start portion and an end portion not overlapping each other; wherein a first light beam is applied to the frit to sinter it along the loop in a first direction, and a second light beam is applied to the frit to sinter it along the loop in a second direction, starting at the start portion and ending up at the end portion; wherein, the second direction is different from the first direction.