Patents by Inventor Tun-Yi Ho

Tun-Yi Ho has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250063750
    Abstract: The present disclosure describes a structure with a conductive plate and a method for forming the structure. The structure includes a gate structure disposed on a diffusion region of a substrate, a protective layer in contact with the diffusion region and covering a sidewall of the gate structure and a portion of a top surface of the gate structure, and a first insulating layer in contact with the gate structure and the protective layer. The structure further includes a conductive plate in contact with the first insulating layer, where a first portion of the conductive plate laterally extends over a horizontal portion of the protective layer, and where a second portion of the conductive plate extends over a sidewall portion of the protective layer covering the sidewall of the gate structure. The structure further includes a second insulating layer in contact with the conductive plate.
    Type: Application
    Filed: November 7, 2024
    Publication date: February 20, 2025
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chan-Yu HUNG, Chia-Cheng Ho, Fei-Yun Chen, Yu-Chang Jong, Puo-Yu Chiang, Tun-Yi Ho
  • Patent number: 12166108
    Abstract: The present disclosure describes a structure with a conductive plate and a method for forming the structure. The structure includes a gate structure disposed on a diffusion region of a substrate, a protective layer in contact with the diffusion region and covering a sidewall of the gate structure and a portion of a top surface of the gate structure, and a first insulating layer in contact with the gate structure and the protective layer. The structure further includes a conductive plate in contact with the first insulating layer, where a first portion of the conductive plate laterally extends over a horizontal portion of the protective layer, and where a second portion of the conductive plate extends over a sidewall portion of the protective layer covering the sidewall of the gate structure. The structure further includes a second insulating layer in contact with the conductive plate.
    Type: Grant
    Filed: May 18, 2022
    Date of Patent: December 10, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chan-Yu Hung, Chia-Cheng Ho, Fei-Yun Chen, Yu-Chang Jong, Puo-Yu Chiang, Tun-Yi Ho
  • Publication number: 20230378324
    Abstract: The present disclosure describes a structure with a conductive plate and a method for forming the structure. The structure includes a gate structure disposed on a diffusion region of a substrate, a protective layer in contact with the diffusion region and covering a sidewall of the gate structure and a portion of a top surface of the gate structure, and a first insulating layer in contact with the gate structure and the protective layer. The structure further includes a conductive plate in contact with the first insulating layer, where a first portion of the conductive plate laterally extends over a horizontal portion of the protective layer, and where a second portion of the conductive plate extends over a sidewall portion of the protective layer covering the sidewall of the gate structure. The structure further includes a second insulating layer in contact with the conductive plate.
    Type: Application
    Filed: May 18, 2022
    Publication date: November 23, 2023
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chan-Yu Hung, Chia-Cheng Ho, Fei-Yun Chen, Yu-Chang Jong, Puo-Yu Chiang, Tun-Yi Ho