Patents by Inventor Tuncay ERDOEL

Tuncay ERDOEL has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240030092
    Abstract: A device includes a radio frequency chip and a heat sink arranged over the radio frequency chip. The device further includes a layer stack arranged between the radio frequency chip and the heat sink. The layer stack includes a first layer including a first material, a thermal interface material, and a metal layer arranged between the first material and the thermal interface material.
    Type: Application
    Filed: July 12, 2023
    Publication date: January 25, 2024
    Inventors: Tuncay ERDOEL, Walter HARTNER, Pietro BRENNER, Simon KORNPROBST, Martin MAYER
  • Patent number: 11872853
    Abstract: A tire pressure monitoring system (TPMS) includes a communication interface device configured to communicate with a target TPMS sensor module. The communication interface device include a radio frequency (RF) transceiver configured to generate at least one wake-up signal; an antenna array configured to transmit each wake-up signal as a directional RF beam; a processing circuit configured to monitor for a response signal in response to the antenna array transmitting the at least one wake-up signal; and a power amplifier configured to set a power of each wake-up signal according to an adjustable power setting such that the power of each subsequent wake-up signal is increased in discrete steps until the response signal is received by the RF transceiver.
    Type: Grant
    Filed: June 1, 2021
    Date of Patent: January 16, 2024
    Assignee: Infineon Technologies AG
    Inventors: Michael Kandler, Thomas Engl, Tuncay Erdoel, Maximilian Werner, Maciej Wojnowski
  • Patent number: 11824019
    Abstract: A chip package includes a chip configured to generate and/or receive a signal; a laminate substrate including a substrate integrated waveguide (SIW) for carrying the signal, the substrate integrated waveguide including a chip-to-SIW transition structure configured to couple the signal between the SIW and the chip and a SIW-to-waveguide transition structure configured to couple the signal out of the SIW or into the SIW, wherein the SIW-to-waveguide transition structure includes a waveguide aperture; and a plurality of electrical interfaces arranged about a periphery of the waveguide aperture, the plurality of electrical interfaces configured to receive the signal from the SIW-to-waveguide transition structure and output the signal from the chip package or to couple the signal to the SIW-to-waveguide transition structure and into the chip package.
    Type: Grant
    Filed: June 24, 2021
    Date of Patent: November 21, 2023
    Assignee: Infineon Technologies AG
    Inventors: Tuncay Erdoel, Walter Hartner, Ulrich Moeller, Bernhard Rieder, Ernst Seler, Maciej Wojnowski
  • Patent number: 11798874
    Abstract: A semiconductor device includes a semiconductor chip including an electrical contact arranged on a main surface of the semiconductor chip, an external connection element configured to provide a first electrical connection between the semiconductor device and a printed circuit board, and an electrical redistribution layer extending in a direction parallel to the main surface of the semiconductor chip and configured to provide a second electrical connection between the electrical contact of the semiconductor chip and the external connection element. The electrical redistribution layer includes a ground line connected to a ground potential and a signal line configured to carry an electrical signal having a wavelength.
    Type: Grant
    Filed: November 29, 2021
    Date of Patent: October 24, 2023
    Assignee: Infineon Technologies AG
    Inventors: Walter Hartner, Francesca Arcioni, Tuncay Erdoel, Vincenzo Fiore, Helmut Kollmann, Arif Roni, Emanuele Stavagna, Christoph Wagner
  • Publication number: 20220415830
    Abstract: A chip package includes a chip configured to generate and/or receive a signal; a laminate substrate including a substrate integrated waveguide (SIW) for carrying the signal, the substrate integrated waveguide including a chip-to-SIW transition structure configured to couple the signal between the SIW and the chip and a SIW-to-waveguide transition structure configured to couple the signal out of the SIW or into the SIW, wherein the SIW-to-waveguide transition structure includes a waveguide aperture; and a plurality of electrical interfaces arranged about a periphery of the waveguide aperture, the plurality of electrical interfaces configured to receive the signal from the SIW-to-waveguide transition structure and output the signal from the chip package or to couple the signal to the SIW-to-waveguide transition structure and into the chip package.
    Type: Application
    Filed: June 24, 2021
    Publication date: December 29, 2022
    Applicant: Infineon Technologies AG
    Inventors: Tuncay ERDOEL, Walter HARTNER, Ulrich MOELLER, Bernhard RIEDER, Ernst SELER, Maciej WOJNOWSKI
  • Publication number: 20220379670
    Abstract: A tire pressure monitoring system (TPMS) includes a communication interface device configured to communicate with a target TPMS sensor module. The communication interface device include a radio frequency (RF) transceiver configured to generate at least one wake-up signal; an antenna array configured to transmit each wake-up signal as a directional RF beam; a processing circuit configured to monitor for a response signal in response to the antenna array transmitting the at least one wake-up signal; and a power amplifier configured to set a power of each wake-up signal according to an adjustable power setting such that the power of each subsequent wake-up signal is increased in discrete steps until the response signal is received by the RF transceiver.
    Type: Application
    Filed: June 1, 2021
    Publication date: December 1, 2022
    Applicant: Infineon Technologies AG
    Inventors: Michael KANDLER, Thomas ENGL, Tuncay ERDOEL, Maximilian WERNER, Maciej WOJNOWSKI
  • Publication number: 20220247089
    Abstract: A radio-frequency device comprises a printed circuit board and a radio-frequency package having a radio-frequency chip and a radio-frequency radiation element, the radio-frequency package being mounted on the printed circuit board. The radio-frequency device furthermore comprises a waveguide component having a waveguide, wherein the radio-frequency radiation element is configured to radiate transmission signals into the waveguide and/or to receive reception signals via the waveguide.
    Type: Application
    Filed: January 24, 2022
    Publication date: August 4, 2022
    Inventors: Walter HARTNER, Tuncay ERDOEL, Klaus ELIAN, Christian GEISSLER, Bernhard RIEDER, Rainer Markus SCHALLER, Horst THEUSS, Maciej WOJNOWSKI
  • Publication number: 20220181246
    Abstract: A semiconductor device includes a semiconductor chip including an electrical contact arranged on a main surface of the semiconductor chip, an external connection element configured to provide a first electrical connection between the semiconductor device and a printed circuit board, and an electrical redistribution layer extending in a direction parallel to the main surface of the semiconductor chip and configured to provide a second electrical connection between the electrical contact of the semiconductor chip and the external connection element. The electrical redistribution layer includes a ground line connected to a ground potential and a signal line configured to carry an electrical signal having a wavelength.
    Type: Application
    Filed: November 29, 2021
    Publication date: June 9, 2022
    Inventors: Walter HARTNER, Francesca ARCIONI, Tuncay ERDOEL, Vincenzo FIORE, Helmut KOLLMANN, Arif RONI, Emanuele STAVAGNA, Christoph WAGNER