Patents by Inventor Tune-Hune Kao

Tune-Hune Kao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240164069
    Abstract: A ceramic substrate structure includes a ceramic board, a first conductive layer, a second conductive layer and a heat dissipation layer. The ceramic board has a first surface and a second surface opposite to each other. Each of the first surface and the second surface is a single surface extending continuously. The first conductive layer is mounted on the first surface of the ceramic board. The second conductive layer is mounted on the first surface of the ceramic board. The second conductive layer is adjacent to the first conductive layer and have different thicknesses. The heat dissipation layer is mounted on the second surface of the ceramic board. The heat dissipation layer includes a first heat dissipation portion corresponding to the first conductive layer and a second heat dissipation portion corresponding to the second conductive layer, and the second heat dissipation portion has a patterned region.
    Type: Application
    Filed: December 21, 2022
    Publication date: May 16, 2024
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yue-Zhen HUANG, Meng-Chi HUANG, Tune-Hune KAO, Min-Chieh CHOU, Jie-Chi CHEN
  • Patent number: 11959941
    Abstract: A probe card includes a flexible inorganic material layer, a metal micro structure, and a circuit board. The flexible inorganic material layer has a first surface and a second surface opposite to each other. The metal micro structure is disposed on the first surface. The circuit board is disposed on the second surface, and the circuit board is electrically connected to the metal micro structure. The test signal is adapted to be conducted to the circuit board through the flexible inorganic material layer.
    Type: Grant
    Filed: December 27, 2021
    Date of Patent: April 16, 2024
    Assignee: Industrial Technology Research Institute
    Inventors: Min-Chieh Chou, Meng-Chi Huang, Tune-Hune Kao, Yue-Zhen Huang
  • Publication number: 20230209706
    Abstract: A three-dimensional circuit board, including a ceramic substrate and multiple circuits, is provided. The ceramic substrate has a first plane, a second plane, a third plane located between the first plane and the second plane, a first side surface connecting the first plane and the second plane, and a second side surface connecting the first plane and the third plane and opposite to the first side surface. A first height of the first side surface is greater than a second height of the second side surface. The circuits are separately embedded on the first plane of the ceramic substrate and extend along the first side surface to be embedded on the second plane.
    Type: Application
    Filed: December 2, 2022
    Publication date: June 29, 2023
    Applicant: Industrial Technology Research Institute
    Inventors: Min-Chieh Chou, Meng-Chi Huang, Tune-Hune Kao, Yue-Zhen Huang
  • Publication number: 20230204628
    Abstract: A probe card includes a flexible inorganic material layer, a metal micro structure, and a circuit board. The flexible inorganic material layer has a first surface and a second surface opposite to each other. The metal micro structure is disposed on the first surface. The circuit board is disposed on the second surface, and the circuit board is electrically connected to the metal micro structure. The test signal is adapted to be conducted to the circuit board through the flexible inorganic material layer.
    Type: Application
    Filed: December 27, 2021
    Publication date: June 29, 2023
    Applicant: Industrial Technology Research Institute
    Inventors: Min-Chieh Chou, Meng-Chi Huang, Tune-Hune Kao, Yue-Zhen Huang
  • Patent number: 10669209
    Abstract: A ceramic device including a ceramic material, a patterned metal structure, and a surface activation material is provided. A surface of the ceramic material at least includes a first surface and a second surface that are not coplanar. The ceramic material has recesses on the surface thereof. The patterned metal structure is disposed on the first surface and the second surface. The surface activation material is disposed on a surface of the recesses and located at an interface between the ceramic material and the patterned metal structure.
    Type: Grant
    Filed: December 15, 2017
    Date of Patent: June 2, 2020
    Assignee: Industrial Technology Research Institute
    Inventors: Meng-Chi Huang, Tune-Hune Kao, Guan-Ting Lin
  • Publication number: 20190177231
    Abstract: A ceramic device including a ceramic material, a patterned metal structure, and a surface activation material is provided. A surface of the ceramic material at least includes a first surface and a second surface that are not coplanar. The ceramic material has recesses on the surface thereof. The patterned metal structure is disposed on the first surface and the second surface. The surface activation material is disposed on a surface of the recesses and located at an interface between the ceramic material and the patterned metal structure.
    Type: Application
    Filed: December 15, 2017
    Publication date: June 13, 2019
    Applicant: Industrial Technology Research Institute
    Inventors: Meng-Chi Huang, Tune-Hune Kao, Guan-Ting Lin
  • Patent number: 10051737
    Abstract: An insulating colloidal material and a multilayer circuit structure are provided, wherein the insulating colloidal material includes a resin, trigger particles, and an organic solvent. The trigger particles are selected from the group consisting of organometallic particles and ionic compounds. The ratio of the trigger particles to the insulating colloidal material is between 0.1 wt % and 10 wt %. At least one insulating colloidal layer in the multilayer circuit structure contains the trigger particles.
    Type: Grant
    Filed: March 17, 2017
    Date of Patent: August 14, 2018
    Assignee: Industrial Technology Research Institute
    Inventors: Meng-Chi Huang, Tune-Hune Kao
  • Patent number: 10020569
    Abstract: A laminated antenna structure includes a substrate, a first conductive circuit layer, an insulating colloidal layer, a second conductive circuit layer and a conductive structure. The first conductive circuit layer is disposed on or above the substrate, the second conductive circuit layer is disposed above the first conductive circuit layer, and the insulating colloidal layer is disposed between the first and the second conductive circuit layers. The first conductive circuit layer, the insulating colloidal layer and the second conductive circuit layer form a laminated capacitive structure. The conductive structure is electrically connected to a signal source on the substrate, and the signal source is electrically connected to at least one of the first conductive circuit layer and the second conductive circuit layer. The insulating colloidal layer contains catalyzers.
    Type: Grant
    Filed: December 30, 2015
    Date of Patent: July 10, 2018
    Assignee: Industrial Technology Research Institute
    Inventors: Meng-Chi Huang, Tune-Hune Kao, Wei-Yu Li, Wei Chung, Wen-Hua Zhang
  • Publication number: 20170196085
    Abstract: An insulating colloidal material and a multilayer circuit structure are provided, wherein the insulating colloidal material includes a resin, trigger particles, and an organic solvent. The trigger particles are selected from the group consisting of organometallic particles and ionic compounds. The ratio of the trigger particles to the insulating colloidal material is between 0.1 wt % and 10 wt %. At least one insulating colloidal layer in the multilayer circuit structure contains the trigger particles.
    Type: Application
    Filed: March 17, 2017
    Publication date: July 6, 2017
    Applicant: Industrial Technology Research Institute
    Inventors: Meng-Chi Huang, Tune-Hune Kao
  • Patent number: 9683292
    Abstract: A metal circuit structure is provided. The metal circuit structure includes a substrate, a first trigger layer and a first metal circuit layer. The first trigger layer is disposed on the substrate and includes a first metal circuit pattern. The first metal circuit layer is disposed on the first circuit pattern and is electrically insulated from the substrate. The composition of the first trigger layer includes an insulating gel and a plurality of trigger particles. The trigger particles are at least one of organometallic particles, a chelation and a semiconductor material having an energy gap greater than or equal to 3 eV. The trigger particles are disposed in the insulating gel, such that the dielectric constant of the first trigger layer after curing is between 2 and 6.5.
    Type: Grant
    Filed: October 11, 2016
    Date of Patent: June 20, 2017
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Tune-Hune Kao, Meng-Chi Huang, Min-Chieh Chou
  • Publication number: 20170162936
    Abstract: A laminated antenna structure includes a substrate, a first conductive circuit layer, an insulating colloidal layer, a second conductive circuit layer and a conductive structure. The first conductive circuit layer is disposed on or above the substrate, the second conductive circuit layer is disposed above the first conductive circuit layer, and the insulating colloidal layer is disposed between the first and the second conductive circuit layers. The first conductive circuit layer, the insulating colloidal layer and the second conductive circuit layer form a laminated capacitive structure. The conductive structure is electrically connected to a signal source on the substrate, and the signal source is electrically connected to at least one of the first conductive circuit layer and the second conductive circuit layer. The insulating colloidal layer contains catalyzers.
    Type: Application
    Filed: December 30, 2015
    Publication date: June 8, 2017
    Inventors: Meng-Chi Huang, Tune-Hune Kao, Wei-Yu Li, Wei Chung, Wen-Hua Zhang
  • Publication number: 20170127513
    Abstract: An insulating colloidal material and a multilayer circuit structure are provided, wherein the insulating colloidal material includes a resin, trigger particles, and an organic solvent. The trigger particles are selected from any one of the group consisting of organometallic particles and ionic compounds. The ratio of the trigger particles to the insulating colloidal material is between 0.1 wt % and 10 wt %. At least one insulating colloidal layer in the multilayer circuit structure contains the trigger particles.
    Type: Application
    Filed: December 17, 2015
    Publication date: May 4, 2017
    Inventors: Meng-Chi Huang, Tune-Hune Kao
  • Patent number: 9642250
    Abstract: An insulating colloidal material and a multilayer circuit structure are provided, wherein the insulating colloidal material includes a resin, trigger particles, and an organic solvent. The trigger particles are selected from any one of the group consisting of organometallic particles and ionic compounds. The ratio of the trigger particles to the insulating colloidal material is between 0.1 wt % and 10 wt %. At least one insulating colloidal layer in the multilayer circuit structure contains the trigger particles.
    Type: Grant
    Filed: December 17, 2015
    Date of Patent: May 2, 2017
    Assignee: Industrial Technology Research Institute
    Inventors: Meng-Chi Huang, Tune-Hune Kao
  • Patent number: 9590292
    Abstract: A beam antenna comprising a first material layer, a second material layer, a first radiating conductor unit and an energy transmission conductor layer is provided. The first material layer has a signal source and a first conductor layer. The second material layer has a first thin-film layer, where the first thin-film layer is adhered on a surface of the second material layer. The first thin-film layer further comprises an insulating gel and a plurality of trigger particles. The first radiating conductor unit is adhered on a surface of the first thin-file layer, and the first thin-file layer is located between the first radiating conductor unit and the second material layer. The energy transmission conductor structure is disposed between the first and the second material layers, which has a first terminal and a second terminal that electrically coupled or connected to the signal source and the first radiating conductor unit respectively.
    Type: Grant
    Filed: December 8, 2015
    Date of Patent: March 7, 2017
    Assignee: Industrial Technology Research Institute
    Inventors: Wei-Yu Li, Tune-Hune Kao, Meng-Chi Huang, Wei Chung, Min-Chieh Chou
  • Publication number: 20170029953
    Abstract: A metal circuit structure is provided. The metal circuit structure includes a substrate, a first trigger layer and a first metal circuit layer. The first trigger layer is disposed on the substrate and includes a first metal circuit pattern. The first metal circuit layer is disposed on the first circuit pattern and is electrically insulated from the substrate. The composition of the first trigger layer includes an insulating gel and a plurality of trigger particles. The trigger particles are at least one of organometallic particles, a chelation and a semiconductor material having an energy gap greater than or equal to 3 eV. The trigger particles are disposed in the insulating gel, such that the dielectric constant of the first trigger layer after curing is between 2 and 6.5.
    Type: Application
    Filed: October 11, 2016
    Publication date: February 2, 2017
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Tune-Hune KAO, Meng-Chi HUANG, Min-Chieh Chou
  • Patent number: 9499911
    Abstract: A metal circuit structure, a method for forming a metal circuit and a liquid trigger material for forming a metal circuit are provided. The metal circuit structure includes a substrate, a first trigger layer and a first metal circuit layer. The first trigger layer is disposed on the substrate and includes a first metal circuit pattern. The first metal circuit layer is disposed on the first circuit pattern and is electrically insulated from the substrate. The composition of the first trigger layer includes an insulating gel and a plurality of trigger particles. The trigger particles are at least one of organometallic particles, a chelation and a semiconductor material having an energy gap greater than or equal to 3 eV. The trigger particles are disposed in the insulating gel, such that the dielectric constant of the first trigger layer after curing is between 2 and 6.5.
    Type: Grant
    Filed: July 3, 2014
    Date of Patent: November 22, 2016
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Tune-Hune Kao, Meng-Chi Huang, Min-Chieh Chou
  • Publication number: 20160164184
    Abstract: A beam antenna comprising a first material layer, a second material layer, a first radiating conductor unit and an energy transmission conductor layer is provided. The first material layer has a signal source and a first conductor layer. The second material layer has a first thin-film layer, where the first thin-film layer is adhered on a surface of the second material layer. The first thin-film layer further comprises an insulating gel and a plurality of trigger particles. The first radiating conductor unit is adhered on a surface of the first thin-file layer, and the first thin-file layer is located between the first radiating conductor unit and the second material layer. The energy transmission conductor structure is disposed between the first and the second material layers, which has a first terminal and a second terminal that electrically coupled or connected to the signal source and the first radiating conductor unit respectively.
    Type: Application
    Filed: December 8, 2015
    Publication date: June 9, 2016
    Inventors: Wei-Yu Li, Tune-Hune Kao, Meng-Chi Huang, Wei Chung, Min-Chieh Chou
  • Publication number: 20150122533
    Abstract: A metal circuit structure, a method for forming a metal circuit and a liquid trigger material for forming a metal circuit are provided. The metal circuit structure includes a substrate, a first trigger layer and a first metal circuit layer. The first trigger layer is disposed on the substrate and includes a first metal circuit pattern. The first metal circuit layer is disposed on the first circuit pattern and is electrically insulated from the substrate. The composition of the first trigger layer includes an insulating gel and a plurality of trigger particles. The trigger particles are at least one of organometallic particles, a chelation and a semiconductor material having an energy gap greater than or equal to 3 eV. The trigger particles are disposed in the insulating gel, such that the dielectric constant of the first trigger layer after curing is between 2 and 6.5.
    Type: Application
    Filed: July 3, 2014
    Publication date: May 7, 2015
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Tune-Hune KAO, Meng-Chi HUANG, Min-Chieh CHOU
  • Publication number: 20150060932
    Abstract: A liquid-filled packaging structure of a heating component includes a main body, at least one heating component and a channel. The main body includes an accommodating space, a first opening connecting with the accommodating space and a second opening connecting with the accommodating space. The heating component is disposed in the accommodating space. The two opposite ends of the channel connect with the first opening and the second opening, respectively, so as to form a circulation loop. The accommodating space and the channel are filled with a liquid.
    Type: Application
    Filed: July 11, 2014
    Publication date: March 5, 2015
    Inventors: Meng-Chi HUANG, Wen-Hua ZHANG, Tune-Hune KAO, Min-Chieh CHOU, Chih-Yu KO
  • Patent number: 8659160
    Abstract: A die structure, a manufacturing method and a substrate, wherein the die structure is constituted by a chip on wafer (COW) and the substrate, and the substrate is formed by stacking and then cutting a plurality of thermal and electrical conductive poles and a plurality of insulating material layers. Moreover, the fabricating of the die structure comprises a plurality of COWs carried on a carrier board is bonded on the substrate, the plurality of COWs are in contact with the plurality of thermal and electrical conductive poles on the substrate, and then the carrier board is removed. After that, a phosphor plate is adhered on the plurality of COWs so as to form a stacked structure. Thereafter, the stacked structure is cut, thus forming a plurality of die structures having at least one COW.
    Type: Grant
    Filed: July 19, 2011
    Date of Patent: February 25, 2014
    Assignee: Industrial Technology Research Institute
    Inventors: Meng-Chi Huang, Han-Ping Yang, Min-Chieh Chou, Tune-Hune Kao, Jung-Kang Peng, Cheng-Hsuan Lin, Jian-Shian Lin