Patents by Inventor Tuneyuki TANAKA

Tuneyuki TANAKA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device
    Patent number: 11508672
    Abstract: A semiconductor device including a base, a buffer member, a frame, a lid, and a semiconductor element, is disclosed. The ceramic frame is mounted on the copper base with the molybdenum buffer member interposed therebetween. The semiconductor element is sealed in a space within the frame defined by the lid. The frame includes a top portion, a lower stage portion that is disposed below the top portion and is provided with an input electrode and an output electrode, and an upper stage portion. The upper stage portion is formed in an arrangement direction of the input electrode and the output electrode, and is formed below the top portion and above the lower stage portion. The upper stage portion includes an upper stage connection portion formed on the periphery of the lower stage portion in a direction intersecting the arrangement direction of the input electrode and the output electrode.
    Type: Grant
    Filed: December 18, 2020
    Date of Patent: November 22, 2022
    Assignee: SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
    Inventor: Tuneyuki Tanaka
  • SEMICONDUCTOR DEVICE
    Publication number: 20210134739
    Abstract: A semiconductor device including a base, a buffer member, a frame, a lid, and a semiconductor element, is disclosed. The ceramic frame is mounted on the copper base with the molybdenum buffer member interposed therebetween. The semiconductor element is sealed in a space within the frame defined by the lid. The frame includes a top portion, a lower stage portion that is disposed below the top portion and is provided with an input electrode and an output electrode, and an upper stage portion. The upper stage portion is formed in an arrangement direction of the input electrode and the output electrode, and is formed below the top portion and above the lower stage portion. The upper stage portion includes an upper stage connection portion formed on the periphery of the lower stage portion in a direction intersecting the arrangement direction of the input electrode and the output electrode.
    Type: Application
    Filed: December 18, 2020
    Publication date: May 6, 2021
    Applicant: SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
    Inventor: Tuneyuki TANAKA
  • Semiconductor device
    Patent number: 10903171
    Abstract: A semiconductor device including a base, a buffer member, a frame, a lid, and a semiconductor element, is disclosed. The ceramic frame is mounted on the copper base with the molybdenum buffer member interposed therebetween. The semiconductor element is sealed in a space within the frame defined by the lid. The frame includes a top portion, a lower stage portion that is disposed below the top portion and is provided with an input electrode and an output electrode, and an upper stage portion. The upper stage portion is formed in an arrangement direction of the input electrode and the output electrode, and is formed below the top portion and above the lower stage portion. The upper stage portion includes an upper stage connection portion formed on the periphery of the lower stage portion in a direction intersecting the arrangement direction of the input electrode and the output electrode.
    Type: Grant
    Filed: July 9, 2019
    Date of Patent: January 26, 2021
    Assignee: SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
    Inventor: Tuneyuki Tanaka
  • SEMICONDUCTOR DEVICE
    Publication number: 20200020648
    Abstract: A semiconductor device including a base, a buffer member, a frame, a lid, and a semiconductor element, is disclosed. The ceramic frame is mounted on the copper base with the molybdenum buffer member interposed therebetween. The semiconductor element is sealed in a space within the frame defined by the lid. The frame includes a top portion, a lower stage portion that is disposed below the top portion and is provided with an input electrode and an output electrode, and an upper stage portion. The upper stage portion is formed in an arrangement direction of the input electrode and the output electrode, and is formed below the top portion and above the lower stage portion. The upper stage portion includes an upper stage connection portion formed on the periphery of the lower stage portion in a direction intersecting the arrangement direction of the input electrode and the output electrode.
    Type: Application
    Filed: July 9, 2019
    Publication date: January 16, 2020
    Applicant: Sumitomo Electric Device Innovations, Inc.
    Inventor: Tuneyuki TANAKA