Abstract: A motor control method comprises: inputting a PWM signal into a control unit for the control unit to obtain a direction command and a speed command by an identification rule, and generating a control signal according to the direction and speed commands by the control unit; and generating a driving signal according to the control signal by the driving unit for driving a motor to operate according to the direction and speed commands.

Abstract: A motor control method comprises: inputting a PWM signal into a control unit for the control unit to obtain a direction command and a speed command by an identification rule, and generating a control signal according to the direction and speed commands by the control unit; and generating a driving signal according to the control signal by the driving unit for driving a motor to operate according to the direction and speed commands.

Abstract: A fan system including a motor with a coil, a storage unit, a driver, and a buffer circuit is provided. The coil module has a first connection terminal and a second connection terminal. The storage unit electrically couples with a voltage source, stores electrical energy when the voltage source is available, and releases the stored electrical energy to carry out a brake operation when the voltage source is unavailable. The driver electrically couples with the first and second connection terminals of the coil module to control a direction of an inductor current passing through the coil module. The buffer circuit electrically couples with the coil module. In the brake operation, the buffer circuit operates to form a transient potential between the first and second connection terminals of the coil module and to consume electrical energy of the inductor current, for gradually stopping the motor in a buffering time period.

Abstract: An exemplary keyboard is provided. The keyboard includes a light pervious base plate, a plurality of input keys, and at least one light source. The light pervious base plate has a top surface. The plurality of input keys are disposed on the light pervious base plate with bottom sides of the input keys facing the top surface of the light pervious base plate. The at least one light source is encapsulated in the light pervious base plate and optically coupled to the light pervious panel.

Abstract: An exemplary color mixing light emitting diode (LED) device includes a substrate, LED dies, an encapsulating body, and a light mixing structure. The substrate has a main surface. The LED dies are arranged adjacent the main surface of the substrate. The light mixing structure is arranged adjacent an outer portion of the main surface of the substrate, around the LED dies. The encapsulating body encapsulates the LED dies and the light mixing structure. The light mixing structure is made of light transmissive material, and the light mixing structure has light scattering particles doped therein.

Abstract: A fan system including a motor with a coil, a storage unit, a driver, and a buffer circuit is provided. The coil module has a first connection terminal and a second connection terminal. The storage unit electrically couples with a voltage source, stores electrical energy when the voltage source is available, and releases the stored electrical energy to carry out a brake operation when the voltage source is unavailable. The driver electrically couples with the first and second connection terminals of the coil module to control a direction of an inductor current passing through the coil module. The buffer circuit electrically couples with the coil module. In the brake operation, the buffer circuit operates to form a transient potential between the first and second connection terminals of the coil module and to consume electrical energy of the inductor current, for gradually stopping the motor in a buffering time period.

Abstract: A flip-chip light emitting diode includes a substrate, an LED chip and a plurality of conductive bumps. The substrate has at least one recess defined in the surface of the substrate, and at least a part of the conductive bumps is embedded the at least one recess. The LED chip is mounted on a surface of the substrate by a flip-chip mounting process. The conductive bumps are sandwiched between the substrate and the LED chip to bond and electrically connect the LED chip to the substrate.

Abstract: An exemplary keyboard is provided. The keyboard includes a light pervious base plate, a plurality of input keys, and at least one light source. The light pervious base plate has a top surface. The plurality of input keys are disposed on the light pervious base plate with bottom sides of the input keys facing the top surface of the light pervious base plate. The at least one light source is encapsulated in the light pervious base plate and optically coupled to the light pervious panel.

Abstract: An exemplary color mixing light emitting diode (LED) device includes a substrate, LED dies, an encapsulating body, and a light mixing structure. The substrate has a main surface. The LED dies are arranged adjacent the main surface of the substrate. The light mixing structure is arranged adjacent an outer portion of the main surface of the substrate, around the LED dies. The encapsulating body encapsulates the LED dies and the light mixing structure. The light mixing structure is made of light transmissive material, and the light mixing structure has light scattering particles doped therein.

Abstract: A light emitting diode (LED) package is provided. The LED package comprises a first lead, a second lead, a heat dissipater, a housing, a conductor and an LED chip. The dissipater is disposed between the first lead and the second lead. The housing covers the heat dissipater and parts of the first lead and the second lead. The housing has an upper surface that exposes the heat dissipater, the first lead and the second lead. The conductor is connected between the first lead and the heat dissipater. The LED chip further has a first surface and a second surface, which are oppositely disposed, wherein the second surface is disposed on the heat dissipater. The Led chip is electrically connected to the first lead and the second lead.