Abstract: An angle-adjustable power tool has a handle, a driving head, and a positioning group. The handle has an engaging mount and an engaging disk. The engaging mount is disposed on a top of the handle and has a communicating recess and a fixing recess. The engaging disk is mounted in the fixing recess of the engaging mount. The driving head is rotatably connected to the handle and has a pivot base and a head portion. The pivot base is disposed in a bottom of the driving head and is rotatably connected to the handle to dispose the engaging mount and the engaging disk between the handle and the pivot base. The positioning group is disposed between the handle and the driving head and has a positioning mount, an elastic element, an abutting mount, and a toggling element.

Abstract: An electronic package structure and a method for manufacturing the same are provided. The electronic package structure includes a first electronic component, a second electronic component, an interconnection element, an insulation layer, and an encapsulant. The second electronic component is disposed adjacent to the first electronic component. The interconnection element is disposed between the first electronic component and the second electronic component. The insulation layer is disposed between the first electronic component and the second electronic component and has a side surface and a top surface connecting to the side surface. The encapsulant surrounds the interconnection element and at least partially covers the top surface of the insulation layer and has an extended portion in contact with the side surface of the insulation layer.

Abstract: A sight includes a main body, an erecting unit and a compensating mechanism. The compensating mechanism includes a fixing unit, a cover and an switching unit. A compensating mechanism for a sight includes a base unit, a transmission unit, an adjusting cap, a movable unit and a lock unit. The adjusting cap is located in a first position when the adjusting cap is locked by the lock unit. The adjusting cap in the first position can be rotated in a second direction or in a third direction opposite to the second direction when the lock unit is moved in a first direction to release the adjusting cap. The adjusting cap stops in a second position when the adjusting cap is rotated in the third direction so that the movable unit is propped against an end of a groove of the adjusting cap.

Abstract: A method for manufacturing a semiconductor package structure is provided. The method includes: (a) providing a substrate, wherein an upper surface of the substrate includes a predetermined region and an energy-absorbing region adjacent to the predetermined region; (b) disposing a first device in the predetermined region of the upper surface of the substrate; and (c) bonding the first device to the substrate by irradiating an upper surface of the first device with an energy-beam, wherein a center of the energy-beam is moved toward the energy-absorbing region from a first position before bonding.

Abstract: A method for manufacturing a semiconductor package structure is provided. The method includes: (a) providing a semiconductor structure including a first device and a second device; (b) irradiating the first device by a first energy-beam with a first irradiation area; and (c) irradiating the first device and the second device by a second energy-beam with a second irradiation area greater than the first irradiation area of the first energy-beam.

Abstract: A method for manufacturing a semiconductor package structure is provided. The method includes: (a) providing a semiconductor structure including a first device and a second device; (b) irradiating the first device by a first energy-beam with a first irradiation area; and (c) irradiating the first device and the second device by a second energy-beam with a second irradiation area greater than the first irradiation area of the first energy-beam.

Abstract: Two crystals of (S)-(+)-hydroxychloroquine sulfate. One crystal features diffraction peaks at 12.3±0.1°, 13.1±0.1°, 17.9±0.1°, 22.8±0.1°, 23.4±0.1°, 25.1±0.1°, and 26.3±0.1° as 2? angles in a powder X-ray diffraction pattern. The other crystal features diffraction peaks at 12.8±0.1°, 14.5±0.1°, 16.7±0.1°, 17.6±0.1°, 20.2±0.1°, 21.4±0.1°, 23.8±0.1°, 25.7±0.1°, and 26.0±0.1° as 2? angles in a powder X-ray diffraction pattern. Also disclosed are methods of preparing crystals of (S)-(+)-hydroxychloroquine sulfate.

Abstract: A flip-chip packaging substrate and a method for fabricating the same are disclosed. The method includes stacking a plurality of insulating layers having conductive posts in a manner that the conductive posts are stacked on and in contact with one another. The insulating layers and the conductive posts serve as a core layer structure of the flip-chip packaging substrate. As such, the conductive posts having small-sized end surfaces can be fabricated according to the practical need. Therefore, when the thickness of the core layer structure is increased, the present disclosure not only increases the rigidity of the flip-chip packaging substrate so as to avoid warping, but also ensures the design flexibility of the small-sized end surfaces of the conductive posts, allowing high-density electrical connection points and fine-pitch and high-density circuit layers to be fabricated on the core layer structure.

Abstract: A method for manufacturing a semiconductor package structure is provided. The method includes: (a) providing a substrate, wherein an upper surface of the substrate includes a predetermined region and an energy-absorbing region adjacent to the predetermined region; (b) disposing a first device in the predetermined region of the upper surface of the substrate; and (c) bonding the first device to the substrate by irradiating an upper surface of the first device with an energy-beam, wherein a center of the energy-beam is moved toward the energy-absorbing region from a first position before bonding.

Abstract: A sight includes a main body, an erecting unit and a compensating mechanism. The compensating mechanism includes a fixing unit, a cover and an switching unit. A compensating mechanism for a sight includes a base unit, a transmission unit, an adjusting cap, a movable unit and a lock unit. The adjusting cap is located in a first position when the adjusting cap is locked by the lock unit. The adjusting cap in the first position can be rotated in a second direction or in a third direction opposite to the second direction when the lock unit is moved in a first direction to release the adjusting cap. The adjusting cap stops in a second position when the adjusting cap is rotated in the third direction so that the movable unit is propped against an end of a groove of the adjusting cap.

Abstract: A method for manufacturing a semiconductor package structure is provided. The method includes: (a) providing a semiconductor structure including a first device and a second device; (b) irradiating the first device by a first energy-beam with a first irradiation area; and (c) irradiating the first device and the second device by a second energy-beam with a second irradiation area greater than the first irradiation area of the first energy-beam.

Abstract: A flip-chip packaging substrate and a method for fabricating the same are disclosed. The method includes stacking a plurality of insulating layers having conductive posts in a manner that the conductive posts are stacked on and in contact with one another. The insulating layers and the conductive posts serve as a core layer structure of the flip-chip packaging substrate. As such, the conductive posts having small-sized end surfaces can be fabricated according to the practical need. Therefore, when the thickness of the core layer structure is increased, the present disclosure not only increases the rigidity of the flip-chip packaging substrate so as to avoid warping, but also ensures the design flexibility of the small-sized end surfaces of the conductive posts, allowing high-density electrical connection points and fine-pitch and high-density circuit layers to be fabricated on the core layer structure.

Abstract: A base structure for a water ball ornament includes a hollow and transparent main body and an opening facing upward, the opening in connection with a water ball ornament, an inner wall of the main body covered with a patterned back plate, one side of the main body provided with a photo frame holder, the photo frame holder configured with a slot and a window in communication with the slot, the slot allowing a photo to be inserted in, and the photo being directly visible through the window.

Abstract: A solar flash light includes a base, light guiding unit, inserting rod and solar photovoltaic module, where the base is provided with a through inserted hole, and a plurality of light emitting elements in electric connection with a circuit board, each light emitting element is configured in the inserted hole, and the on and off thereof is controlled by the circuit board; the light guiding unit includes two light guiding plates inserted in the inserted hole, and the bottoms of the plates face the corresponding light emitting elements; the surface of each light guiding plate is provided with a decorative pattern, the inserting rod is configured on the bottom of the base, and the solar photovoltaic module is assembled on the inserting rod, thereby converting solar energy into electrical energy to make light emitting elements irradiate, and achieving environmental protection and power saving.

Abstract: A method for treating lupus erythematosus by administering to a patient a pharmaceutical composition that contains S-hydroxychloroquine (S-HCQ) and a pharmaceutically acceptable excipient. The pharmaceutical composition is essentially free of R-hydroxychloroquine (R-HCQ). The method is effective for treating cutaneous lupus erythematosus, systemic lupus erythematosus, and patients suffering from systemic lupus erythematosus that have concurrent lupus nephritis. Administration of S-HCQ in the claimed method has fewer side effects, particularly respecting cardiotoxicity, as compared to R-HCQ and to an equimolar mixture of S-HCQ and R-HCQ.

Abstract: The water lamp includes a casing, a lighting member, a cap, and a decorative element. The casing has an accommodation space inside filled with a fluid and a through opening on a bottom side. The lighting member positioned in the accommodation space, including at least one lighting element on a top side and a number of columns and a tube arranged at intervals on a bottom side. The translucent cap has an open bottom receiving the top side of the lighting member. The cap and the lighting member jointly enclose a watertight space. The decorative element has a three-dimensional shape having a chamber on a bottom side for covering the cap. As such, the lighting elements are isolated in the watertight space and separated from the fluid in the casing. Through a power element, the lighting elements may illuminate from inside the casing element, thereby creasing interesting visual effect.

Abstract: A laser engraving lighting structure includes: a main body, being a light-transmissible three-dimensional shell, an outer surface of the main body having a decorative pattern formed by means of laser engraving; and a base, connected to a bottom of the main body, the base configured with an electronic control unit including at least one light emitting element in electric connection with the electronic control unit, and the light emitting element irradiating toward the main body. Whereby, when the light emitting element is powered on, the light will pass through the main body to project the decorative pattern on the outer surface of the main body onto the surrounding objects or wall surfaces.

Abstract: Two crystals of (S)-(+)-hydroxychloroquine sulfate. One crystal features diffraction peaks at 12.3±0.1°, 13.1±0.1°, 17.9±0.1°, 22.8±0.1°, 23.4±0.1°, 25.1±0.1°, and 26.3±0.1° as 2? angles in a powder X-ray diffraction pattern. The other crystal features diffraction peaks at 12.8±0.1°, 14.5±0.1°, 16.7±0.1°, 17.6±0.1°, 20.2±0.1°, 21.4±0.1°, 23.8±0.1°, 25.7±0.1°, and 26.0±0.1° as 2? angles in a powder X-ray diffraction pattern. Also disclosed are methods of preparing crystals of (S)-(+)-hydroxychloroquine sulfate.

Abstract: An integrated module of acoustic wave device with active thermal compensation comprises a substrate, an acoustic wave filter, an active adjustment circuit and at least one variable capacitance device. The acoustic wave filter comprises a plurality of series acoustic wave resonators formed on the substrate, at least one shunt acoustic wave resonator formed on the substrate and a thermal sensing acoustic wave resonator. Each of the variable capacitance device is connected in parallel to one of the series and shunt acoustic wave resonators. The active adjustment circuit outputs an active thermal compensation signal correlated to a thermal variation sensed by the thermal sensing acoustic wave resonator to the variable capacitance device. The active thermal compensation signal induces a capacitance variation of the variable capacitance device such that the impact of the thermal variation to the acoustic wave device is compensated.

Abstract: An acoustic wave filter having thermal sensing acoustic wave resonator comprises a substrate, a plurality of series acoustic wave resonators formed on the substrate, at least one shunt acoustic wave resonator formed on the substrate and a thermal sensing acoustic wave resonator. The thermal sensing acoustic wave resonator is one of a series acoustic wave resonator and a shunt acoustic wave resonator. Thereby the thermal sensing acoustic wave resonator plays dual roles of thermal sensing and acoustic wave filtering.