Abstract: A pulp chamber dental spacer constructed of cold water soluble material, which may include portions of polyvinyl alcohol, to protect the pupal floor of a pulp chamber from a drilled hole following a root canal treatment or procedure. The spacer may be spherical or cubical in shape and that protects the pupal floor by providing a solid “space” for a practitioner to feel the end of a temporary filing such that the drill does not descend to and possibly damage the sensitive pupal floor. The dissolvable material preferably is non-linting, thereby providing for complete removal and preventing the “wicking” of contaminated salivary fluids and causing coronal damage.

Abstract: A pulp chamber dental spacer constructed of cold water soluble material, which may include portions of polyvinyl alcohol, to protect the pupal floor of a pulp chamber from a drilled hole following a root canal treatment or procedure. The spacer may be spherical or cubical in shape and that protects the pupal floor by providing a solid “space” for a practitioner to feel the end of a temporary filing such that the drill does not descend to and possibly damage the sensitive pupal floor. The dissolvable material preferably is non-linting, thereby providing for complete removal and preventing the “wicking” of contaminated salivary fluids and causing coronal damage.

Abstract: A pulp chamber dental spacer constructed of cold water soluble material, which may include portions of polyvinyl alcohol, to protect the pupal floor of a pulp chamber from a drilled hole following a root canal treatment or procedure. The spacer may be spherical or cubical in shape and that protects the pupal floor by providing a solid “space” for a practitioner to feel the end of a temporary filing such that the drill does not descend to and possibly damage the sensitive pupal floor. The dissolvable material preferably is non-linting, thereby providing for complete removal and preventing the “wicking” of contaminated salivary fluids and causing coronal damage.

Abstract: A method of manufacturing a semiconductor device according to the present invention comprises: a bump forming step of forming a bump electrode 100 on a semiconductor chip 1, the bump electrode 100 protruding in a substantially conical shape; a pad forming step of forming a pad electrode 200 on a substrate 10, the pad electrode 200 having a recess 210 with inner lateral surfaces thereof defining a substantially pyramidal shape or a prism shape; a pressing step of pressing the bump electrode 100 and the pad electrode 200 in a direction which brings them closer to each other, with the bump electrode 100 being inserted in the recess 210 so that the central axis of the bump electrode 100 and the central axis of the recess 210 coincide with each other; and an ultrasonic joining step of joining the bump electrode 100 and the pad electrode 200 by vibrating at least one of the bump electrode 100 and the pad electrode 200 using ultrasonic waves.

Abstract: A method of manufacturing a semiconductor device according to the present invention comprises: a bump forming step of forming a bump electrode 100 on a semiconductor chip 1, the bump electrode 100 protruding in a substantially conical shape; a pad forming step of forming a pad electrode 200 on a substrate 10, the pad electrode 200 having a recess 210 with inner lateral surfaces thereof defining a substantially pyramidal shape or a prism shape; a pressing step of pressing the bump electrode 100 and the pad electrode 200 in a direction which brings them closer to each other, with the bump electrode 100 being inserted in the recess 210 so that the central axis of the bump electrode 100 and the central axis of the recess 210 coincide with each other; and an ultrasonic joining step of joining the bump electrode 100 and the pad electrode 200 by vibrating at least one of the bump electrode 100 and the pad electrode 200 using ultrasonic waves.