Patents by Inventor Tung-Chen Cheng

Tung-Chen Cheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190161841
    Abstract: A copper alloy wire and a manufacturing method thereof are provided. The copper alloy wire includes: by weight percentage of components, 0.3 to 0.45 of silver (Ag), 0.01 to 0.02 of titanium, and a remaining part that is formed by copper and unavoidable impurities. The method for manufacturing the copper alloy wire is performing two-phase vacuum melting: first performing vacuum electric arc melting into a copper-titanium mother alloy, and then performing vacuum induction melting with remaining components into a copper alloy wire material by means of continuous casting; then drawing the copper alloy wire material into a copper alloy fine wire by a non-slip wire drawing device in a material even-flow wire drawing manner, and finally performing thermal treatment on the copper alloy fine wire by using argon as a protection gas, so as to complete a process of the copper alloy wire.
    Type: Application
    Filed: January 30, 2019
    Publication date: May 30, 2019
    Inventors: Tung-Chen CHENG, Chen-Hsueh CHIANG, Chia-Hao HSU
  • Publication number: 20180148816
    Abstract: A copper alloy wire and a manufacturing method thereof are provided. The copper alloy wire includes: by weight percentage of components, 0.3 to 0.45 of argent, 0.01 to 0.02 of titanium, and a remaining part that is formed by copper and unavoidable impurities. The method for manufacturing the copper alloy wire is performing two-phase vacuum melting: first performing vacuum electric arc melting into a copper-titanium mother alloy, and then performing vacuum induction melting with remaining components into a copper alloy wire material by means of continuous casting; then drawing the copper alloy wire material into a copper alloy fine wire by a non-slip wire drawing device in a material even-flow wire drawing manner, and finally performing thermal treatment on the copper alloy fine wire by using argon as a protection gas, so as to complete a process of the copper alloy wire.
    Type: Application
    Filed: November 28, 2016
    Publication date: May 31, 2018
    Inventors: Tung-Chen CHENG, Chen-Hsueh CHIANG, Chia-Hao HSU
  • Publication number: 20120291506
    Abstract: A device producing a patterned plate includes a die and an electromagnetic actuator. The die includes a patterned surface with a pattern formed thereon and a fracturing part. The tubular work piece is disposed between the die and the electromagnetic actuator such that walls of the tubular work piece correspond to walls of the die. When the electromagnetic actuator is supplied with a current pulse, an eddy current is induced in the tubular work piece, generating a repulsive force between the electromagnetic actuator and the tubular work piece. Therefore, the tubular work piece impacts the die, and a forming surface of the tubular work piece is deformed against the patterned surface and the fracturing part, thus replicating the pattern of the patterned surface onto the forming surface. At the same time, the tubular work piece is fractured at the position corresponding to the fracturing part.
    Type: Application
    Filed: July 25, 2012
    Publication date: November 22, 2012
    Inventors: Tung-Chen Cheng, Yu-Yi Chu
  • Patent number: 8056381
    Abstract: A device for producing a pattern onto a work piece includes a die, an electromagnetic actuator and a base. The die includes a patterned surface, and the patterned surface includes a pattern. The electromagnetic actuator includes an plate body, a convex part and a strip unit connected to the plate body. The electromagnetic actuator is disposed in the base. When the electromagnetic actuator is activated while a work piece is being positioned between the patterned surface and the electromagnetic actuator, an inductive current is generated on the work piece by the electromagnetic actuator, and then a repulsive force is generated between the electromagnetic actuator and the work piece. The repulsive force causes the work piece to adhere to the patterned surface, forcing the work piece to deform against the patterned surface and to take on the shape of the pattern.
    Type: Grant
    Filed: December 30, 2008
    Date of Patent: November 15, 2011
    Assignee: Metal Industries Research & Development Centre
    Inventors: Tung-Chen Cheng, Yu-Yi Chu, Rong-Shean Lee, Tzyy-Ker Sue, Chun-Chieh Wang
  • Publication number: 20100147043
    Abstract: A device for producing a pattern onto a work piece is disclosed. The device comprises a die, an electromagnetic actuator and a base; wherein the die comprises a patterned surface and the patterned surface comprises a pattern. The electromagnetic actuator comprises an plate body, a convex part and a strip unit connected to the plate body; the electromagnetic actuator is disposed in the base. When the electromagnetic actuator is activated while a work piece is being positioned between the patterned surface and the electromagnetic actuator, an inductive current is generated on the work piece by the electromagnetic actuator, and then a repulsive force is generated between the electromagnetic actuator and the work piece. The repulsive force then causes the work piece to adhere to the patterned surface, forcing the work piece to deform against the patterned surface and to take on the shape of the pattern.
    Type: Application
    Filed: December 30, 2008
    Publication date: June 17, 2010
    Inventors: Tung-Chen Cheng, Yu-Yi Chu, Rong-Shean Lee, Tzyy-Ker Sue, Chun-Chieh Wang
  • Publication number: 20100139070
    Abstract: A device for producing a patterned plate from a tubular work piece is disclosed wherein walls of the tubular work piece comprise at least one forming surface. The device comprises a die and an electromagnetic actuator, wherein the die comprises a patterned surface with a pattern formed thereon and a fracturing part. The tubular work piece is disposed between the die and the electromagnetic actuator such that the walls of the tubular work piece correspond to walls of the die, and the forming surface corresponds to the patterned surface. When the electromagnetic actuator is supplied with a current pulse, an eddy current is induced in the tubular work piece, generating a repulsive force between the electromagnetic actuator and the tubular work piece. Therefore, the tubular work piece impacts the die, and the forming surface is deformed against the patterned surface and the fracturing part, thus replicating the pattern of the patterned surface onto the forming surface.
    Type: Application
    Filed: December 30, 2008
    Publication date: June 10, 2010
    Inventors: Tung-Chen Cheng, Yu-Yi Chu
  • Patent number: 7389664
    Abstract: An electromagnetic forming device for a sheet of material is provided. The electromagnetic forming device includes a fixing base, a magnetic concentration block, an electromagnetic actuator, and a die. The fixing base has a groove. The magnetic concentration block is disposed in the groove of the fixing base, and has an accommodating space therein, which is in communication with a surface of the magnetic concentration block via a slit. The electromagnetic actuator, used to generate a magnetic field, is disposed in the accommodating space of the magnetic concentration block, but does not contact the magnetic concentration block. The die and the magnetic concentration block are separated by a gap, and a sheet of material can be disposed in the gap. As the magnetic concentration block is a block, eddy currents in the magnetic concentration block are distributed uniformly, so the generated magnetic field is also distributed uniformly, thus exerting a uniform forming force on the sheet of material.
    Type: Grant
    Filed: November 14, 2007
    Date of Patent: June 24, 2008
    Assignee: Metal Industries Research & Development Centre
    Inventors: Tung-Chen Cheng, Tzyy-Ker Sue, Chi-Keung Chung, Chun-Chieh Wang, Hsing-Ta Hsieh, Ming-Fu Li