Abstract: A white light emitting device with an efficiency of at least 230 lm/W at a blue LED chip input current density from 10 to 60 mA/mm2, preferably in the range from 15 to 40 mA/mm2 and more preferably in the range from 20 to 30 mA/mm2. The device comprises a substrate, at least one string of blue LED chips mounted on the substrate and a phosphor material composition. Said phosphor material composition comprises a narrow band red phosphor which generates light with a peak emission wavelength in a range from 625 nm to 635 nm. The weight percentages of the narrow band red phosphor are between 33 to 49 wt. % for a CCT of from 4000 to 6500K or in an amount of from 60 to 70 wt. % for a CCT of from 2700 to 3500K CCT.

Abstract: A light-emitting device comprises a support frame and at least one blue light-emitting chip and at least one red light-emitting chip coupled onto the support frame; and a green phosphor covering the at least one blue light-emitting chip and the at least one red light-emitting chip. The green phosphor is mainly an aluminate of the formula: M1.xEuxAlyO1+3y/2, wherein M is at least one divalent metal selected from a group consisting of Ba, Sr, Ca, Mg, Mn, Zn, Cu, Cd, Sm and Tm; 0.1<x<0.9; and 0.5?y?12, whereby the light beams emitted from the blue light-emitting chip and the red light-emitting chip are allowed to pass through the green phosphor for generating white light.

Abstract: An illumination structure comprises a FPC (Flexible Printed Circuit) board, several light-emitting diodes and at least one pair of coupling device. The light-emitting diodes are coupled to the FPC board. The at least one pair of coupling device is mounted on respective opposite sides of the FPC board to allow the planar FPC board to be transformed into a three-dimensional shape.

Abstract: A lamp head structure comprises a base and a circuit board. The base has an opening on the bottom and an open slot on at least one side. The circuit board has a respective electrically conducting layer on the bottom surface and at least one lateral surface. The circuit board is located inside the open slot of the base. The electrically conducting layer on the bottom surface of the circuit board is located corresponding to the opening on the bottom of the base. At least one light-emitting device is coupled to the circuit board. A positive electrode and a negative electrode of the light-emitting device are connected to the circuit board. The circuit board is coupled to the base to effectively simplify manufacture process and allow convenient repair.

Abstract: A light-emitting diode comprises: a coupling base; a plurality of light-emitting chips; and a sealant, wherein a plurality of frame pairs having an amount corresponding to that of the light-emitting chips are mounted inside the coupling base. The frame pairs have a plurality of first and second frames having different areas. The light-emitting chips are respectively coupled with a plurality of large-area coupling parts of the first frames, and the light-emitting chips are electrically connected with the second frames, respectively. The coupling base is packaged by the sealant. Accordingly, the volume of the light-emitting diode can be reduced significantly.

Abstract: A light-emitting diode comprises: a coupling base; several light-emitting chips; and an adhesive for sealing the coupling base, wherein the coupling base has a coupling part and at least two frame pairs mounted therein. The light-emitting chips are fixed on the coupling part. The light-emitting chips are electrically connected with these two frame pairs, which are controlled by two control terminals simultaneously.

Abstract: A color-mixing LED is disclosed. Fluorescent powders are mixed with an adhesive to form a thin plate. A segmentation process is then performed on the thin plate. A chip is coupled to a concave bracing frame, and then the segmented thin plate is mounted in the concave bracing frame against its inner walls. A transparent adhesive for fixing is injected into the concave bracing frame, whereby the color-mixing LED has simplified manufacturing procedure, reduced manufacturing cost, and easy assembling design.