Abstract: A memory device includes a substrate, a transistor disposed over the substrate, an interconnect structure disposed over and electrically connected to the transistor, and a memory stack disposed between two adjacent metallization layers of the interconnect structure. The memory stack includes a bottom electrode disposed over the substrate and electrically connected to a bit line, a memory layer disposed over the bottom electrode, a selector layer disposed over the memory layer, and a top electrode disposed over the selector layer and electrically connected to a word line. Besides, at least one moisture-resistant layer is provided adjacent to and in physical contact with the selector layer, and the at least one moisture-resistant layer includes an amorphous material.

Abstract: A display panel includes a first substrate and a second substrate assembled together with a sealant, and the resultant assembly encloses a display medium layer. An organic alignment layer and an inorganic alignment layer are disposed between the first substrate and the display medium layer. A first gap exists between the inorganic alignment layer and the sealant, and the organic alignment layer is located in the first gap. The inorganic alignment layer may contact the display medium layer, and the organic alignment layer may be in contact with the display medium layer in the first gap. A portion of the organic alignment layer may overlap the inorganic alignment layer. The inorganic alignment layer may be coated with a coating of hydrophobic molecules. The display panel may further include an opposite organic alignment layer and an opposite inorganic alignment layer between the second substrate and the display medium layer.

Abstract: A display panel includes a first substrate and a second substrate assembled together with a sealant, and the resultant assembly encloses a display medium layer. An organic alignment layer and an inorganic alignment layer are disposed between the first substrate and the display medium layer. A first gap exists between the inorganic alignment layer and the sealant, and the organic alignment layer is located in the first gap. The inorganic alignment layer may contact the display medium layer, and the organic alignment layer may be in contact with the display medium layer in the first gap. A portion of the organic aligmnent layer may overlap the inorganic alignment layer. The inorganic alignment layer may be coated with a coating of hydrophobic molecules. The display panel may further include an opposite organic alignment layer and an opposite inorganic alignment layer between the second substrate and the display medium layer.

Abstract: A display panel according to an embodiment is provided and includes a top substrate having an outer surface; a display layer covered by the top substrate; a patterned light shielding layer disposed on the outer surface of the top substrate and located within the first region; and a patterned oxide layer disposed on the outer surface of the top substrate. The outer surface comprises a first region and a second region beside the first region. An edge of the patterned light shielding layer at least partially overlaps a boundary between the first region and the second region. The patterned oxide layer is located within one of the first region and the second region while exposes the other of the first region and the second region.

Abstract: A display panel according to an embodiment is provided and includes a top substrate having an outer surface; a display layer covered by the top substrate; a patterned light shielding layer disposed on the outer surface of the top substrate and located within the first region; and a patterned oxide layer disposed on the outer surface of the top substrate. The outer surface comprises a first region and a second region beside the first region. An edge of the patterned light shielding layer at least partially overlaps a boundary between the first region and the second region. The patterned oxide layer is located within one of the first region and the second region while exposes the other of the first region and the second region.

Abstract: A manufacturing method of a microelectromechanical system (MEMS) package structure includes providing a base, wherein the base comprises a recess; disposing a chip in the recess, wherein the chip has an active surface; disposing a MEMS device on the active surface in the recess, wherein the MEMS device is covered by a first cover, the first cover comprises a cavity, and the MEMS device is in the cavity; disposing a sealant at a peripheral gap between the chip and the first cover so as to seal the cavity; disposing a glass frit on a second cover or the base; disposing the second cover on the base, wherein the second cover covers the recess, and the glass frit is disposed between the base and the second cover; and heating the glass frit so as to seal the recess.

Abstract: A manufacturing method of a microelectromechanical system (MEMS) package structure includes providing a base, wherein the base comprises a recess; disposing a chip in the recess, wherein the chip has an active surface; disposing a MEMS device on the active surface in the recess, wherein the MEMS device is covered by a first cover, the first cover comprises a cavity, and the MEMS device is in the cavity; disposing a sealant at a peripheral gap between the chip and the first cover so as to seal the cavity; disposing a glass frit on a second cover or the base; disposing the second cover on the base, wherein the second cover covers the recess, and the glass frit is disposed between the base and the second cover; and heating the glass frit so as to seal the recess.

Abstract: A MEMS package structure includes a base, a MEMS device, a first cover, a second cover and a glass frit. The base includes a recess. The MEMS device is disposed in the recess. The first cover is disposed in the recess and covering the MEMS device. The second cover is disposed on the base and covering the recess. The glass frit is disposed between the base and the second cover. A MEMS package structure includes the base, the MEMS device, the first cover, a second cover, a first metal frame and a first sealing medium. The first metal frame is disposed around the second cover, and the second cover and the first metal frame collectively are disposed on the base and covering the recess. The first sealing medium is disposed between the first metal frame and the base. Manufacturing methods of the MEMS package structures above are further provided.

Abstract: A MEMS package structure includes a base, a MEMS device, a first cover, a second cover and a glass frit. The base includes a recess. The MEMS device is disposed in the recess. The first cover is disposed in the recess and covering the MEMS device. The second cover is disposed on the base and covering the recess. The glass frit is disposed between the base and the second cover. A MEMS package structure includes the base, the MEMS device, the first cover, a second cover, a first metal frame and a first sealing medium. The first metal frame is disposed around the second cover, and the second cover and the first metal frame collectively are disposed on the base and covering the recess. The first sealing medium is disposed between the first metal frame and the base. Manufacturing methods of the MEMS package structures above are further provided.

Abstract: The present disclosure provides a heat-dissipating apparatus for printed circuit board. The heat-dissipating apparatus adopts a ceramic device arranged between the printed circuit board and ground. Therefore, the apparatus can achieve the purpose of heat dissipation and save space of the printed circuit board and save cost of using a fan and cooling fins.

Abstract: A bottle cap assembly includes a mount, a hose unit connected to the mount, a mouthpiece unit and a dust cap. A lug is connected to the mount and the dust cap is pivotably connected to the lug. A tubular portion is located in the mount and has two spiral ribs. The mouthpiece unit includes a rotatable member, a seal ring and a mouthpiece. The rotatable member is engaged within the tubular portion and has spiral grooves with which the spiral ribs are engaged. The rotatable member has a knob and has a passage is defined therethrough. The seal member seals the mouthpiece unit when the rotatable member is located at the lowest position. When the knob is rotated, the spiral grooves moved upward along with the spiral rib and the passage is separated from the seal member to open the mouthpiece unit.

Abstract: A bottle cap assembly includes a mount, a hose unit connected to the mount, a mouthpiece unit and a dust cap. A lug is connected to the mount and the dust cap is pivotably connected to the lug. A tubular portion is located in the mount and has two spiral ribs. The mouthpiece unit includes a rotatable member, a seal ring and a mouthpiece. The rotatable member is engaged within the tubular portion and has spiral grooves with which the spiral ribs are engaged. The rotatable member has a knob and has a passage is defined therethrough. The seal member seals the mouthpiece unit when the rotatable member is located at the lowest position. When the knob is rotated, the spiral grooves moved upward along with the spiral rib and the passage is separated from the seal member to open the mouthpiece unit.

Abstract: A connection device includes a fixing board connected to a rear end of a box, a main part and a clamping unit. A locking member extends through the front board and a spring contacts against between the locking member and a rear board. Two push rods extend from a lower end of a button and slidably connected with inclined surfaces of the locking member. A safety member is connected to a mediate portion of the button and includes a spring plate which contacts against the button. The clamping unit includes two collars which are securely engaged with the adjustment plate. A bridge member is connected between the two toothed members and supported on a lower side of a handlebar stem. The clamp pieces is located at an inner side of the toothed members and mounted on a handlebar.

Abstract: A connection device includes a fixing board connected to a rear end of a box, a main part and a clamping unit. A locking member extends through the front board and a spring contacts against between the locking member and a rear board. Two push rods extend from a lower end of a button and slidably connected with inclined surfaces of the locking member. A safety member is connected to a mediate portion of the button and includes a spring plate which contacts against the button. The clamping unit includes two collars which are securely engaged with the adjustment plate. A bridge member is connected between the two toothed members and supported on a lower side of a handlebar stem. The clamp pieces is located at an inner side of the toothed members and mounted on a handlebar.

Abstract: A flashlight assembly includes a body having a battery received therein and an end cap assembly including a magnetic member is connected to a first end of the body. Two slots are defined through a second end of the body and two terminal plates are connected to an inside of the second end of the body. A gap is defined between the two terminal plates. A handle has an engaging portion which is pivotably connected to the second end of the body and two insertions extend through the two slots. One of the two insertions is located below the two terminal plates. A light bulb assembly is pivotably connected to the engaging portion of the handle. The two terminal plates are pushed to contact with other by the insertion when the handle is pivoted and the contact of the two terminal plates form a circuit.