Patents by Inventor Tung-Hsiang Liu

Tung-Hsiang Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Surface mountable laminated circuit protection device and method of making the same
    Patent number: 7273538
    Abstract: A surface mountable laminated circuit protection device comprises a first metal layer including a first unit and a second unit, a first insulating layer disposed on the first metal layer, and a second metal layer disposed on the first insulated layer. There is also a composite electroplated layer containing carbon black disposed on the second metal layer, and a first conductive composite material having positive temperature coefficient (PTC) characteristics disposed on the composite electroplated layer containing carbon black. Above the first conductive composite material is a third metal layer. Furthermore, there is a first conducting mechanism for conducting the first metal layer and the second metal to each other; and a second conducting mechanism for conducting the third metal layer and the first metal layer to each other. The application of double-sided metal foil clad substrate simplifies the production process of the protection device and improves its structural strength and dimensional stability.
    Type: Grant
    Filed: September 25, 2003
    Date of Patent: September 25, 2007
    Assignee: Protectronics Technology Corporation
    Inventors: Rei-Yian Chen, Chih-Yi Chang, Tung-Hsiang Liu
  • Surface mountable laminated circuit protection device and method of making the same
    Publication number: 20040069645
    Abstract: A surface mountable laminated circuit protection device comprises a first metal layer including a first unit and a second unit, a first insulating layer disposed on the first metal layer, and a second metal layer disposed on the first insulated layer. There is also a composite electroplated layer containing carbon black disposed on the second metal layer, and a first conductive composite material having positive temperature coefficient (PTC) characteristics disposed on the composite electroplated layer containing carbon black. Above the first conductive composite material is a third metal layer. Furthermore, there is a first conducting mechanism for conducting the first metal layer and the second metal to each other; and a second conducting mechanism for conducting the third metal layer and the first metal layer to each other. The application of double-sided metal foil clad substrate simplifies the production process of the protection device and improves its structural strength and dimensional stability.
    Type: Application
    Filed: September 25, 2003
    Publication date: April 15, 2004
    Applicant: PROTECTRONICS TECHNOLOGY CORPORATION
    Inventors: Rei-Yian Chen, Chih-Yi Chang, Tung-Hsiang Liu
  • Surface mountable laminated circuit protection device and method of making the same
    Patent number: 6686827
    Abstract: A surface mountable laminated circuit protection device comprises a first metal layer including a first unit and a second unit, a first insulating layer disposed on the first metal layer, and a second metal layer disposed on the first insulated layer. There is also a composite electroplated layer containing carbon black disposed on the second metal layer, and a first conductivity composite material layer having positive temperature coefficient (PTC) characteristics disposed on the composite electroplated layer containing carbon black. Above the first conductivity composite material layer having PTC characteristics is a third metal layer. Furthermore, there is a first conducting mechanism for conducting the first metal layer and the second metal to each other; and a second conducting mechanism for conducting the third metal layer and the first metal to each other.
    Type: Grant
    Filed: March 13, 2002
    Date of Patent: February 3, 2004
    Assignee: Protectronics Technology Corporation
    Inventors: Rei-Yian Chen, Chih-Yi Chang, Tung-Hsiang Liu
  • Surface mountable laminated circuit protection device and method of making the same
    Publication number: 20020140540
    Abstract: A surface mountable laminated circuit protection device comprises a first metal layer including a first unit and a second unit, a first insulating layer disposed on the first metal layer, and a second metal layer disposed on the first insulated layer. There is also a composite electroplated layer containing carbon black disposed on the second metal layer, and a first conductivity composite material layer having positive temperature coefficient (PTC) characteristics disposed on the composite electroplated layer containing carbon black. Above the first conductivity composite material layer having PTC characteristics is a third metal layer. Furthermore, there is a first conducting mechanism for conducting the first metal layer and the second metal to each other; and a second conducting mechanism for conducting the third metal layer and the first metal to each other.
    Type: Application
    Filed: March 13, 2002
    Publication date: October 3, 2002
    Applicant: PROTECTRONICS TECHNOLOGY CORPORATION
    Inventors: Rei-Yian Chen, Chih-Yi Chang, Tung-Hsiang Liu