Patents by Inventor Tung-Hsiao Yu

Tung-Hsiao Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wafer taping scheme
    Patent number: 9748130
    Abstract: A method includes setting a first tension value of a laminating tape during a standby mode. A second tension value of the laminating tape is set during taping on a wafer. The second tension value is different from the first tension value. A third tension value of the laminating tape is set after taping. The third tension value is different from the second tension value.
    Type: Grant
    Filed: November 29, 2013
    Date of Patent: August 29, 2017
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Wen-Ming Chen, Wei-Chih Chen, Tung-Hsiao Yu, Min-Yu Wu
  • Wafer Taping Scheme
    Publication number: 20150155195
    Abstract: A method includes setting a first tension value of a laminating tape during a standby mode. A second tension value of the laminating tape is set during taping on a wafer. The second tension value is different from the first tension value. A third tension value of the laminating tape is set after taping. The third tension value is different from the second tension value.
    Type: Application
    Filed: November 29, 2013
    Publication date: June 4, 2015
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Wen-Ming Chen, Wei-Chih Chen, Tung-Hsiao Yu, Min-Yu Wu