Patents by Inventor Tung-Hsin Yeh

Tung-Hsin Yeh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11729301
    Abstract: A case assembly and a wireless communication device are provided. The case assembly includes a metal case and a plastic cladding body. The metal case includes an inner side and an outer side, the inner side is opposite to the outer side, the metal case includes a hollow portion and an antenna portion, the hollow portion is adjacent to a side of the antenna portion. The plastic cladding body is disposed on the metal case, and completely covers the outer side of the metal case, partially covers the inner side of the metal case, and fills the hollow portion. The wireless communication device includes a case assembly and a radio frequency signal module. The radio frequency signal module is electrically connected to the antenna portion of the case assembly. Thus, the structural rigidity of the wireless communication device and its case assembly is kept, and the production cost is reduced.
    Type: Grant
    Filed: August 9, 2021
    Date of Patent: August 15, 2023
    Assignee: HTC CORPORATION
    Inventors: Chih-Kuang Wang, Chin Kai Sun, Chun-Lung Chu, Tung-Hsin Yeh
  • Patent number: 11330734
    Abstract: A case assembly and an electronic device are provided. The case assembly includes a metal case and a plastic cladding body. The metal case includes an inner side and an outer side, the inner side is opposite to the outer side. The metal case further includes a channel which is concavely disposed on the inner side to divide the inner side into a plurality of thermal insulation areas. The plastic cladding body is disposed on the metal case, and completely covers the outer side of the metal case. The electronic device includes a case assembly and a plurality of heart sources. The heart sources are corresponded to the thermal insulation areas on the inner side of the metal case respectively. Thus, the case assembly and the electronic device are able to prevent the heat produced from elements effect each other.
    Type: Grant
    Filed: May 28, 2020
    Date of Patent: May 10, 2022
    Assignee: HTC CORPORATION
    Inventors: Chih-Kuang Wang, Chin Kai Sun, Chun-Lung Chu, Tung-Hsin Yeh
  • Publication number: 20220075192
    Abstract: A glasses type display device including a front end assembly and a pair of legs is provided. Each of the pair of legs includes a front segment, a rear segment, a torsion mechanism, and a rotation mechanism. The torsion mechanism is disposed between the front end assembly and the front segment. The rotation mechanism is disposed between the front segment and the rear segment.
    Type: Application
    Filed: June 18, 2021
    Publication date: March 10, 2022
    Applicant: HTC Corporation
    Inventors: Tung-Hsin Yeh, Ching-Ho Li, Wei-Cheng Liu, Chun-Lung Chu
  • Patent number: 11262819
    Abstract: An electronic device includes a casing, a motherboard, a battery, a fan, and a heat dissipation module. The motherboard is arranged in the casing, and defines a first space with the casing. The battery is arranged in the casing and defines a second space with the motherboard. The motherboard separates the first space and the second space. The fan is arranged in the casing and has a first airflow outlet and a second airflow outlet independent of the first airflow outlet. The first airflow outlet communicates with the first space and the second space. The heat dissipation module is arranged in the casing and transfers heat from the motherboard to the second airflow outlet.
    Type: Grant
    Filed: September 8, 2020
    Date of Patent: March 1, 2022
    Assignee: HTC Corporation
    Inventors: Chih-Yao Kuo, Chin-Kai Sun, Chung-Chiao Tan, Tung-Hsin Yeh
  • Publication number: 20210392212
    Abstract: A case assembly and a wireless communication device are provided. The case assembly includes a metal case and a plastic cladding body. The metal case includes an inner side and an outer side, the inner side is opposite to the outer side, the metal case includes a hollow portion and an antenna portion, the hollow portion is adjacent to a side of the antenna portion. The plastic cladding body is disposed on the metal case, and completely covers the outer side of the metal case, partially covers the inner side of the metal case, and fills the hollow portion. The wireless communication device includes a case assembly and a radio frequency signal module. The radio frequency signal module is electrically connected to the antenna portion of the case assembly. Thus, the structural rigidity of the wireless communication device and its case assembly is kept, and the production cost is reduced.
    Type: Application
    Filed: August 9, 2021
    Publication date: December 16, 2021
    Inventors: Chih-Kuang WANG, Chin Kai SUN, Chun-Lung CHU, Tung-Hsin YEH
  • Publication number: 20210378135
    Abstract: A case assembly and an electronic device are provided. The case assembly includes a metal case and a plastic cladding body. The metal case includes an inner side and an outer side, the inner side is opposite to the outer side. The metal case further includes a channel which is concavely disposed on the inner side to divide the inner side into a plurality of thermal insulation areas. The plastic cladding body is disposed on the metal case, and completely covers the outer side of the metal case. The electronic device includes a case assembly and a plurality of heart sources. The heart sources are corresponded to the thermal insulation areas on the inner side of the metal case respectively. Thus, the case assembly and the electronic device are able to prevent the heat produced from elements effect each other.
    Type: Application
    Filed: May 28, 2020
    Publication date: December 2, 2021
    Inventors: Chih-Kuang WANG, Chin Kai Sun, Chun-Lung Chu, Tung-Hsin Yeh
  • Patent number: 11115508
    Abstract: A case assembly and a wireless communication device are provided. The case assembly includes a metal case and a plastic cladding body. The metal case includes an inner side and an outer side, the inner side is opposite to the outer side, the metal case includes a hollow portion and an antenna portion, the hollow portion is adjacent to a side of the antenna portion. The plastic cladding body is disposed on the metal case, and completely covers the outer side of the metal case, partially covers the inner side of the metal case, and fills the hollow portion. The wireless communication device includes a case assembly and a radio frequency signal module. The radio frequency signal module is electrically connected to the antenna portion of the case assembly. Thus, the structural rigidity of the wireless communication device and its case assembly is kept, and the production cost is reduced.
    Type: Grant
    Filed: June 10, 2020
    Date of Patent: September 7, 2021
    Assignee: HTC CORPORATION
    Inventors: Chih-Kuang Wang, Chin Kai Sun, Chun-Lung Chu, Tung-Hsin Yeh
  • Publication number: 20210216119
    Abstract: An electronic device includes a casing, a motherboard, a battery, a fan, and a heat dissipation module. The motherboard is arranged in the casing, and defines a first space with the casing. The battery is arranged in the casing and defines a second space with the motherboard. The motherboard separates the first space and the second space. The fan is arranged in the casing and has a first airflow outlet and a second airflow outlet independent of the first airflow outlet. The first airflow outlet communicates with the first space and the second space. The heat dissipation module is arranged in the casing and transfers heat from the motherboard to the second airflow outlet.
    Type: Application
    Filed: September 8, 2020
    Publication date: July 15, 2021
    Applicant: HTC Corporation
    Inventors: Chih-Yao Kuo, Chin-Kai Sun, Chung-Chiao Tan, Tung-Hsin Yeh
  • Patent number: 10264336
    Abstract: An electronic device including a conductive casing, a conductive sheet, a conductive elastic pad, a circuit board and a sound output unit is provided. The conductive casing has an inner surface and a plurality of through holes extended from the inner surface to the outside of the conductive casing to pass through the conductive casing. The conductive sheet is disposed on the inner surface and covers part of the through holes. The conductive elastic pad is disposed in the conductive casing and contacts the conductive sheet. The circuit board is disposed in the conductive casing and connected with the conductive elastic pad. The sound output unit is disposed in the conductive casing and electrically connected to the circuit board. The sound output unit is adapted to output a sound transmitted to the outside of the electronic device by another part of the through holes. A conductive structure is also provided.
    Type: Grant
    Filed: December 5, 2013
    Date of Patent: April 16, 2019
    Assignee: HTC Corporation
    Inventors: Tung-Hsin Yeh, Cheng-Chieh Chuang, Shih-Ming Lin
  • Publication number: 20140286523
    Abstract: An electronic device including a conductive casing, a conductive sheet, a conductive elastic pad, a circuit board and a sound output unit is provided. The conductive casing has an inner surface and a plurality of through holes extended from the inner surface to the outside of the conductive casing to pass through the conductive casing. The conductive sheet is disposed on the inner surface and covers part of the through holes. The conductive elastic pad is disposed in the conductive casing and contacts the conductive sheet. The circuit board is disposed in the conductive casing and connected with the conductive elastic pad. The sound output unit is disposed in the conductive casing and electrically connected to the circuit board. The sound output unit is adapted to output a sound transmitted to the outside of the electronic device by another part of the through holes. A conductive structure is also provided.
    Type: Application
    Filed: December 5, 2013
    Publication date: September 25, 2014
    Applicant: HTC Corporation
    Inventors: Tung-Hsin Yeh, Cheng-Chieh Chuang, Shih-Ming Lin