Patents by Inventor Tung-Hua Wu

Tung-Hua Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20180156552
    Abstract: A thermal simulation system adapted to establish a test environment for a thermal test is provided. The thermal simulation system includes a communication element, a controllable loading element, a plurality of connectors, and a controller. The communication element is configured to receive at least one of a heating control signal, a fan control signal, and a loading control signal from an external electronic device. The controllable loading element is configured to provide a loading. The connectors are configured to connect a heating element and a fan. The controller is configured to control a heat energy generated by the heating element according to the heating control signal, control a fan speed of the fan according to the fan control signal, and control a loading value of the loading provided by the controllable loading element according to the loading control signal.
    Type: Application
    Filed: December 5, 2017
    Publication date: June 7, 2018
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Chang-Yu Tu, Te-Ming Kung, Wen-Shyan Lai, Tung-Hua Wu