Patents by Inventor TUNG-HUAN HSIEH

TUNG-HUAN HSIEH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10950961
    Abstract: A card edge connector structure includes an insulating case, a terminal assembly, a first grounding sheet and a second grounding sheet. The terminal assembly includes a first terminal set and a second terminal set and is configured in the insulating case. The first grounding sheet is configured between the insulating case and the first terminal set, and the second grounding sheet is configured between the insulating case and the second terminal set. A first arm of the first grounding sheet contacts the first grounding terminal through a first groove of a first terminal fixing component, and a second arm of the second grounding sheet contacts the second grounding terminal through a second groove of a second terminal fixing component.
    Type: Grant
    Filed: November 7, 2019
    Date of Patent: March 16, 2021
    Assignee: JESS-LINK PRODUCTS CO., LTD.
    Inventors: Cheng-Chung Lai, Ya-Fen Kao, Tung-Huan Hsieh, Chieh-Ming Cheng
  • Publication number: 20200328541
    Abstract: A card edge connector structure includes an insulating case, a terminal assembly, a first grounding sheet and a second grounding sheet. The terminal assembly includes a first terminal set and a second terminal set and is configured in the insulating case. The first grounding sheet is configured between the insulating case and the first terminal set, and the second grounding sheet is configured between the insulating case and the second terminal set. A first arm of the first grounding sheet contacts the first grounding terminal through a first groove of a first terminal fixing component, and a second arm of the second grounding sheet contacts the second grounding terminal through a second groove of a second terminal fixing component.
    Type: Application
    Filed: November 7, 2019
    Publication date: October 15, 2020
    Inventors: CHENG-CHUNG LAI, YA-FEN KAO, TUNG-HUAN HSIEH, CHIEH-MING CHENG