Abstract: A molding system comprises a mold, a molding machine, a computing apparatus, and a controller. The computing apparatus is programmed to perform a first simulation to generate a velocity distribution and a temperature distribution of the molding material in a first portion of a simulating domain and a second simulation to generate a melting distribution of the solid decorating film in a second portion of the simulating domain, wherein the simulating domain corresponds to the mold cavity. The first molding simulation is to performed using a molding condition of the molding machine to set a boundary condition of the first portion, and the second molding simulation is performed using the velocity distribution and the temperature distribution of the molding material to set a boundary condition of the second portion.

Abstract: A molding system comprises a mold, a molding machine, a computing apparatus, and a controller. The computing apparatus is programmed to perform a first simulation to generate a velocity distribution and a temperature distribution of the molding material in a first portion of a simulating domain and a second simulation to generate a melting distribution of the solid decorating film in a second portion of the simulating domain, wherein the simulating domain corresponds to the mold cavity. The first molding simulation is to performed using a molding condition of the molding machine to set a boundary condition of the first portion, and the second molding simulation is performed using the velocity distribution and the temperature distribution of the molding material to set a boundary condition of the second portion.

Abstract: A molding method includes the steps of specifying a simulating domain having a resin part and a mold part, wherein the simulating domain corresponds to a genuine domain on a molding machine; setting an initial resin temperature of the resin part and an initial mold temperature of the mold part; performing a transient state analysis to calculate a plurality of temperature distributions at different times between the resin part and the mold part; calculating at least one heat transfer coefficient between the resin part and the mold part taking into consideration the plurality of temperature distributions at different times; simulating the molding process of a molding resin that is injected into the simulating domain by using the at least one heat transfer coefficient to generate a plurality of molding conditions; and performing the molding process by using the plurality of molding conditions to the genuine domain on the molding machine.