Patents by Inventor Tung-Hung Su

Tung-Hung Su has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210057270
    Abstract: A semiconductor wafer and method for manufacturing thereof are provided. The semiconductor wafer includes a handling substrate and a silicon layer over the handling substrate and having a {111} facet at an edge of a top surface of the silicon layer. The a defect count on the top surface of the silicon layer is less than about 15 each semiconductor wafer. The method includes the following operations: a semiconductor-on-insulator (SOI) substrate is provided, wherein the SOI substrate has a handling substrate, a silicon layer over the handling substrate, and a silicon germanium layer over the silicon layer; and the silicon germanium layer is etched at a first temperature with hydrochloric acid to expose a first surface of the silicon layer.
    Type: Application
    Filed: August 23, 2019
    Publication date: February 25, 2021
  • Publication number: 20210007606
    Abstract: The disclosure provides a method of and an imaging system for clinical sign detection. The method uses an imaging system having an RGB image sensor and the processing device disclosed herein. An image of a patient or examinee is captured by the RGB image sensor to generate an RGB image. Clinical signs of the patient or examinee are detected by the processing device based on the RGB images.
    Type: Application
    Filed: July 9, 2020
    Publication date: January 14, 2021
    Applicants: COMPAL ELECTRONICS, INC., National Taiwan University Hospital
    Inventors: Tung-Hung Su, Cheng-Fu Chou, Shann-Ching Chen