Abstract: Provided is a method of producing a silicon-containing composition in mass production, comprising steps of: slicing a silicon substrate with a free-abrasive wire to obtain a mixing slurry; separating the mixing slurry into a liquid mixture and a solid mixture; and sorting the solid mixture by particle size and removing the cutting wire granules from the solid mixture, so as to obtain the silicon-containing composition applicable for a lithium-ion battery. Furthermore, an anode material of a lithium-ion battery and a method of producing an anode electrode of a lithium-ion battery are provided. According to the method, a few abrasives of the wire sawing tool remain in the nano-scale or micro-scale silicon-containing composition, and thus the problems of extreme volumetric expansion under heat and high production cost are overcome. The produced silicon-containing composition is applicable for a lithium-ion battery.

Abstract: Provided is a method of producing a silicon material, comprising: slicing a silicon substrate with a fixed-abrasives wire to obtain a mixing slurry; and treating the mixing slurry by solid-liquid separation, so as to isolate a silicon material from the mixing slurry, which is applicable for a lithium-ion battery. With the simplified method, the production cost of silicon material is remarkably reduced. Furthermore, an anode material of a lithium-ion battery and a method of producing an anode electrode of a lithium-ion battery are provided. Since the silicon material produced by the method has high purity and fine granules, the extreme volumetric expansion of silicon under heat is largely reduced, and thus the cycle stability, electrical performance, and quality of a lithium-ion battery comprising the silicon material are improved.

Abstract: Provided is a method of processing wafer waste. First, the wafer waste is separated into liquid mixture and solid mixture by solid-liquid separation. Next, a recovered cutting fluid is isolated from the liquid mixture by evaporation. The solid mixture is mixed with a first aqueous solvent to obtain a mixing slurry. Then, the mixing slurry is separated into a silicon-containing mixture and a silicon carbide-containing mixture. After suitable washing process, a recovered silicon and a recovered silicon carbide are finally obtained. Thus, the method recovers the cutting fluid, silicon and silicon carbide in the same process, which can reduce the environmental contaminations caused by wafer waste and reduce the manufacture cost of wafer production by recovering the wafer waste.