Patents by Inventor Tung-Liang WANG

Tung-Liang WANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor package including thermal interface structures and methods of forming the same
    Patent number: 11955405
    Abstract: A semiconductor package includes a package substrate; semiconductor devices disposed on the package substrate; a package ring disposed on a perimeter of the package substrate surrounding the semiconductor devices; a cover including silicon bonded to the package ring and covering the semiconductor devices; and a thermal interface structure (TIS) thermally connecting the semiconductor devices to the cover.
    Type: Grant
    Filed: January 17, 2022
    Date of Patent: April 9, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Jen Yu Wang, Chung-Jung Wu, Sheng-Tsung Hsiao, Tung-Liang Shao, Chih-Hang Tung, Chen-Hua Yu
  • Electronic device and image building module thereof
    Patent number: 9860433
    Abstract: An image building module includes an image builder, a signal-shielding flexible film, and a signal shielding cover. The image builder includes a first image capturing element and a processing chip. The first image capturing element is used for capturing a first image. The processing chip is used for processing the first image. The signal-shielding flexible film covers the processing chip. The signal shielding cover covers the image builder and the signal-shielding flexible film. The signal shielding cover has a first through hole exposing the first image capturing element.
    Type: Grant
    Filed: December 2, 2015
    Date of Patent: January 2, 2018
    Assignee: PEGATRON CORPORATION
    Inventors: Tsung-Chih Yeh, Tung-Liang Wang, Pi-Min Kao, Hsun-Hsin Lee, Chun-Hao Kuo
  • ELECTRONIC DEVICE AND IMAGE BUILDING MODULE THEREOF
    Publication number: 20160191769
    Abstract: An image building module includes an image builder, a signal-shielding flexible film, and a signal shielding cover. The image builder includes a first image capturing element and a processing chip. The first image capturing element is used for capturing a first image. The processing chip is used for processing the first image. The signal-shielding flexible film covers the processing chip. The signal shielding cover covers the image builder and the signal-shielding flexible film. The signal shielding cover has a first through hole exposing the first image capturing element.
    Type: Application
    Filed: December 2, 2015
    Publication date: June 30, 2016
    Inventors: Tsung-Chih YEH, Tung-Liang WANG, Pi-Min KAO, Hsun-Hsin LEE, Chun-Hao KUO
  • Mobile Device and Antenna Structure Therein
    Publication number: 20140057578
    Abstract: A mobile device including an antenna structure is provided. The antenna structure includes a main radiation element, a parasitical element, and a tunable element. The main radiation element has a feeding pin coupled to a signal source, wherein the feeding pin is substantially located at an end of the main radiation element. The parasitical element is close to the main radiation element, and has a parasitical pin which is substantially located at an end of the parasitical element. The tunable element includes a switch and a plurality of paths, wherein the switch selectively couples one of the paths to the parasitical pin in such a manner that the antenna structure operates in multiple bands.
    Type: Application
    Filed: August 24, 2012
    Publication date: February 27, 2014
    Inventors: Shih-Yi CHAN, Tung-Liang WANG