Abstract: Disclosed are surface-treated copper foils having at least one treated surface that exhibit high conductivity and a set of surface properties. Also provided are flexible copper-clad laminates and printed circuits made therefrom. The present printed circuits exhibit low insertion loss and are suitable for use in high speed/high frequency applications.

Abstract: The present disclosure is directed to a bondply adhesive. The bondply adhesive contains 65 to 80 wt % maleic anhydride grafted styrene ethylene butadiene styrene copolymer having greater than 1 wt % maleic anhydride, 7 to 24 wt % epoxy resin, 0.3 to 3.0 wt % hardener, 0.05 to 0.1 wt % catalyst, 8 to 15 wt % organic flame retardant and 0.3 to 2.9 wt % 3-glycidyloxypropyl-trimethoxysilane, wherein a combined total of epoxy resin and organic flame retardant is less than 35 wt %.

Abstract: The present disclosure is directed to a coverlay adhesive. The coverlay adhesive contains 40 to 80 wt % maleic anhydride grafted styrene ethylene butadiene styrene copolymer having greater than 1 wt % maleic anhydride, 3 to 14 wt % epoxy resin, 0.5 to 1.5 wt % hardener, 0.05 to 0.1 wt % catalyst, 10 to 26 wt % organic flame retardant, and optionally polypheneylene ether.

Abstract: The present disclosure is directed to a bondply adhesive. The bondply adhesive contains 85 to 99.5 wt % maleic anhydride grafted styrene ethylene butadiene styrene copolymer having greater than 1 wt % maleic anhydride, 0.4 to 3.0 wt % 3-glycidyloxypropyl-trimethoxysilane, and optionally up to 14 wt % organic flame retardant.